公开(公告)号：US20230187178A1

公开(公告)日：2023-06-15

申请号：US17993055

申请日：2022-11-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngil KANG ,  Byeongsang KIM ,  Jongmu KIM ,  Yongbeom PARK ,  Dougyong SUNG ,  Yunjae LEE ,  Seugkyu LIM ,  Kyuhee HAN

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J2237/335 ,  H01J37/32724

Abstract: A substrate processing apparatus includes: a process chamber; a substrate support structure disposed at a lower portion of the process chamber and configured to accommodate a substrate; and a gas supply module disposed at an upper portion of the process chamber and supplying a process gas to the substrate, wherein the gas supply module includes a showerhead that includes: a first showerhead body including a plurality of injection ports configured to transfer gas transferred from a gas inlet into the process chamber; and a coating layer covering the first showerhead body and including aluminum fluoride, wherein the first showerhead body includes a metal matrix composite (MMC).

公开(公告)号：US20210111007A1

公开(公告)日：2021-04-15

申请号：US16865493

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang KIM ,  Keonwoo KIM ,  Eungsu KIM ,  Hakyoung KIM ,  Heewon MIN ,  Kyeongtea BANG ,  Seungwon SHIN ,  Dongyun YEO ,  Hyanjung LEE ,  Kyeongseok JEONG

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.

公开(公告)号：US20150251323A1

公开(公告)日：2015-09-10

申请号：US14643702

申请日：2015-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeongsang KIM ,  Kang-Min PARK ,  Jungjun PARK ,  JaeChul HWANG

IPC: B25J19/00 ,  B25J15/00

CPC classification number: B25J19/0091 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/67766

Abstract: The robot including a main body, an arm connected to the main body, a hand connected to the arm, the hand including a hand base and a finger, and a hand bracket unit between the hand base and the finger or between the hand base and the arm, may be provided. The hand bracket unit may include a vibration damping member provided between the hand base and the finger or between the hand base and the arm, thereby damping vibration of the hand base or the finger.

Abstract translation: 该机器人包括主体，连接到主体的臂，连接到手臂的手，手包括手基座和手指，以及在手基座和手指之间或手基座和手指之间的手托架单元， 可以提供手臂。 手托架单元可以包括设置在手基座和手指之间或手基座和手臂之间的减震构件，从而阻止手基座或手指的振动。

公开(公告)号：US20250146917A1

公开(公告)日：2025-05-08

申请号：US19018240

申请日：2025-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonbum NAM ,  Namkyun KIM ,  Seungbo SHIM ,  Donghyeon NA ,  Naohiko OKUNISHI ,  Dongseok HAN ,  Minyoung HUR ,  Byeongsang KIM ,  Kuihyun YOON

IPC: G01N9/24 ,  H01Q1/40 ,  H01Q9/30

Abstract: An apparatus for measuring parameters of plasma includes a cutoff probe. The cutoff probe includes: a first antenna having a line shape and configured to emit a microwave to the plasma in response to the signal provided by at least one processor; a second antenna having a line shape and configured to generate an electrical signal in response to receiving the microwave emitted by the first antenna and transferred through the plasma; a first insulating layer; a second insulating layer; a first shield; a second shield; an end protection layer covering an end of each of the first insulating layer, the second insulating layer, the first shield, and the second shield; a first antenna protection layer, of insulating nature, covering the first antenna; and a second antenna protection layer, of insulating nature, covering the second antenna.

公开(公告)号：US20240167162A1

公开(公告)日：2024-05-23

申请号：US18215916

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihyeong LEE ,  Sangyeon OH ,  Minsung KIM ,  Byeongsang KIM ,  Yihwan KIM ,  Sangchul HAN

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/4581 ,  C23C16/46

Abstract: A substrate processing apparatus includes a chamber providing a space for performing a semiconductor process on a semiconductor substrate, and a substrate stage configured to support the semiconductor substrate. The substrate stage includes a platen having a seating surface to support the semiconductor substrate, the platen having a resistance heater and an RF electrode adjacent to the seating surface, a shaft under the platen, the shaft having a first through hole in a central region and a plurality of second through holes in a peripheral region surrounding the central region, an RF rod spaced apart from an inner wall of the first through hole, the RF rod electrically connected to the RF electrode, and a plurality of heater rods respectively within the plurality of second through holes and electrically connected to the resistance heater.

公开(公告)号：US20230317418A1

公开(公告)日：2023-10-05

申请号：US18068778

申请日：2022-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin KO ,  Sangki NAM ,  Dougyong SUNG ,  Byeongsang KIM ,  Yunhwan KIM ,  Suyoung YOO ,  Namkyun KIM ,  Kuihyun YOON

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32568 ,  H01J2237/3343 ,  H01J2237/2001

Abstract: A substrate processing apparatus includes a process chamber having an internal space; upper and lower electrode portions facing each other in the internal space; and a gas supply unit configured to supply cooling gas to a bottom surface of a substrate seated on the lower electrode portion. The gas supply unit may include a gas supply source outside the process chamber and configured to provide a cooling gas, and a gas filter connected to the gas supply source and including one or more wall surfaces at least partially defining a gas flow path for the cooling gas. The gas filter may include a first and second regions formed of respective materials having different dielectric constants. The first and second regions may be configured so that the cooling gas flowing along the gas flow path flows upwardly concurrently with colliding with a wall surface of the gas flow path.

公开(公告)号：US20230100582A1

公开(公告)日：2023-03-30

申请号：US17713433

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunhwan KIM ,  Dougyong SUNG ,  Byeongsang KIM ,  Youngjin NOH ,  Namkyun KIM

IPC: H01J37/32

Abstract: A substrate processing apparatus includes a base plate, an upper plate on the base plate, a DC power supply configured to supply power to the upper plate, and a controller interconnecting the upper plate and the DC power supply. The upper plate includes a first electrode, and a second electrode spaced apart from the first electrode. The controller includes a first controller interconnecting the first electrode and the DC power supply, and a second controller interconnecting the second electrode and the DC power supply. The DC power supply is configured to apply a first voltage to the first electrode via the first controller, and configured to apply a second voltage to the second electrode via the second controller. The first voltage and the second voltage are different.

公开(公告)号：US20230010881A1

公开(公告)日：2023-01-12

申请号：US17591751

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang KIM ,  Dougyong SUNG ,  Sungjin KIM ,  Yunhwan KIM ,  Inseok SEO ,  Seungbo SHIM ,  Naohiko OKUNISHI ,  Minyoung HUR

IPC: G01R27/16 ,  H01L21/683 ,  H01L21/67 ,  C23C16/52 ,  H01L21/66 ,  C23C16/455

Abstract: An impedance measurement jig may include a first contact plate, a second contact plate, a cover plate, a plug, and an analyzer. The first contact plate may make electrical contact with an ESC in a substrate-processing apparatus. The second contact plate may make electrical contact with a focus ring configured to surround the ESC. The cover plate may be configured to cover an upper surface of the substrate-processing apparatus. The plug may be installed at the cover plate to selectively make contact with the first contact plate or the second contact plate. The analyzer may individually apply a power to the first contact plate and the second contact plate through the plug to measure an impedance of the ESC and an impedance of the focus ring. Thus, the impedances of the ESC and the focus ring may be individually measured to inspect the ESC and/or the focus ring.