摘要:
A method for providing a through wafer connection to an integrated circuit silicon package. A hole is first created in the silicon package with an inner surface area extending from the bottom surface of the silicon package to the top surface of the silicon package. The hole is created by one of two methods. The first involves mechanical drilling with a diamond bit rotated at a high rate of speed. The second involves ultrasonically milling utilizing a slurry and steel fingers. The inner surface area of the hole is covered with an insulating material to insulate the conductive material which is later deposited and to serve as a diffusion barrier, then a seed material is placed in the hole. Finally, the hole is filled with a conductive material which is utilized to provide large power inputs or signaling connections to the integrated circuit chips.
摘要:
A silicon wafer is etched to form a first and second series of guidance features. The features of the first series are larger than and surround the features of the second series. The second series is clustered into groups and a hole is formed in the center of each group. The wafer is designed to integrate a silicon package having preformed contacts with a plurality of silicon-based chips. The package and each chip has a series of guidance recesses which correspond to the guidance features of the first and second series, respectively. One chip is placed on top of each group of the second series, and the package is placed on top of the first series. The recesses in the package and chips will precisely align with and slidingly engage the upper ends of the features. Since the features of the first series are larger than those of the second series, there is a clearance between the package and the chips. In the final stage of assembly, the package is restrained from movement and a pin is inserted through each hole in the wafer to force the chips into contact with the contacts on the package. Heat is then applied to fuse solder balls on the chips with the contacts to form a complete and finished assembly.
摘要:
A package for integrated circuit chips. The package contains a silicon substrate having a top surface and a bottom surface. The package also contains a first means for electrically connecting the integrated circuits to the substrate attached to the top surface of the substrate. A multilevel wiring is located at the top surface and is coupled to the first connecting means and serves as a communication link among a plurality of the first connecting means to enable multi-chip processing. A via containing means for coupling the multilevel wiring at the top surface to the bottom surface runs through the substrate from the bottom surface to the top surface. A second means is also present for connecting the coupling means at the bottom surface of the substrate with external components.
摘要:
A processor has multiple cores with each core having an associated function to support processor operations. The functions performed by the cores are selectively altered to improve processor operations by balancing the resources applied for each function. For example, each core comprises a field programmable array that is selectively and dynamically programmed to perform a function, such as a floating point function or a fixed point function, based on the number of operations that use each function. As another example, a processor is built with a greater number of cores than can be simultaneously powered, each core associated with a function, so that cores having functions with lower utilization are selectively powered down.
摘要:
A method for optimizing execution of a single threaded program on a multi-core processor. The method includes dividing the single threaded program into a plurality of discretely executable components while compiling the single threaded program; identifying at least some of the plurality of discretely executable components for execution by an idle core within the multi-core processor; and enabling execution of the at least one of the plurality of discretely executable components on the idle core.
摘要:
A method for optimizing execution of a single threaded program on a multi-core processor. The method includes dividing the single threaded program into a plurality of discretely executable components while compiling the single threaded program; identifying at least some of the plurality of discretely executable components for execution by an idle core within the multi-core processor; and enabling execution of the at least one of the plurality of discretely executable components on the idle core.
摘要:
The disclosed methodology and apparatus may reduce heat generation in a multi-core processor. In one embodiment, a multi-core processor cycles selected processor cores off in a predetermined pattern across the processor die over time to reduce the average heat generation by the processor. The disclosed multi-core processor may reduce or avoid undesirable hot spots that impact processor life.
摘要:
A processor has multiple cores with each core having an associated function to support processor operations. The functions performed by the cores are selectively altered to improve processor operations by balancing the resources applied for each function. For example, each core comprises a field programmable array that is selectively and dynamically programmed to perform a function, such as a floating point function or a fixed point function, based on the number of operations that use each function. As another example, a processor is built with a greater number of cores than can be simultaneously powered, each core associated with a function, so that cores having functions with lower utilization are selectively powered down.
摘要:
A method and apparatus for speculatively executing a single threaded program within a multi-core processor which includes identifying an idle core within the multi-core processor, performing a look ahead operation on the single thread instructions to identify speculative instructions within the single thread instructions, and allocating the idle core to execute the speculative instructions.
摘要:
A method for automatically initializing the operational settings of a system from information stored within a non-volatile storage of an integrated circuit so that the operational requirements of the integrated circuit, which may be a microprocessor, are met by the system when the system is operating. During manufacturing test environmental requirements of the integrated circuit are determined and stored within the non-volatile storage of the integrated circuit. During system initialization, environmental control values such as required operating voltage and frequency and cooling requirements are determined from the test values, which are read from the integrated circuit. The values are read by an interface of the system from an interface of the integrated circuit. System settings are controlled by the values to provide the required operating environment and the values may be captured within the system for subsequent operations and initialization sequences.