公开(公告)号：US20110001559A1

公开(公告)日：2011-01-06

申请号：US12614672

申请日：2009-11-09

申请人： Sang-Hoon SHIN ,  Hyung-Dong Lee ,  Jeong-Woo Lee ,  Hyang-Hwa Choi

发明人： Sang-Hoon SHIN ,  Hyung-Dong Lee ,  Jeong-Woo Lee ,  Hyang-Hwa Choi

IPC分类号： H01L25/00

CPC分类号： H01L25/0657 ,  H01L22/22 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/3011

摘要： A semiconductor device and a method for driving the same rapidly detect failure of a through-semiconductor-chip via and effectively repairing the failure using a latching unit assigned to each through-semiconductor-chip via. The semiconductor device includes a plurality of semiconductor chips that are stacked, and a plurality of through-semiconductor-chip vias to commonly transfer a signal to the plurality of semiconductor chips, wherein each of the semiconductor chips includes a multiplicity of latching units assigned to the through-semiconductor-chip vias and the multiplicity of latching units of each of the semiconductor chips constructs a boundary scan path including the plurality of through-semiconductor-chip vias to sequentially transfer test data.

摘要翻译： 半导体器件及其驱动方法可以快速检测半导体芯片通孔的故障，并使用分配给每个贯通半导体芯片通孔的锁存单元有效地修复故障。 半导体器件包括堆叠的多个半导体芯片，以及多个贯穿半导体芯片通孔，以共同地将信号传递到多个半导体芯片，其中每个半导体芯片包括分配给多个半导体芯片的多个锁存单元 通过半导体芯片通孔，并且每个半导体芯片的多个锁存单元构成包括多个通过半导体芯片通孔的边界扫描路径以顺序地传送测试数据。

公开(公告)号：US20120092062A1

公开(公告)日：2012-04-19

申请号：US13338716

申请日：2011-12-28

申请人： Jeong-Woo Lee ,  Hyung-Dong Lee ,  Sang-Hoon Shin ,  Hyang-Hwa Choi

发明人： Jeong-Woo Lee ,  Hyung-Dong Lee ,  Sang-Hoon Shin ,  Hyang-Hwa Choi

IPC分类号： H01H37/76

CPC分类号： H01L22/22 ,  G01R31/2853 ,  H01L23/481 ,  H01L23/5258 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/3011

摘要： A semiconductor system includes a controller; a semiconductor device comprising a plurality of stacked semiconductor chips stacked over the controller, and a plurality of through-silicon vias (TSVs) configured to commonly transfer a signal to the plurality of stacked semiconductor chips; and a defect information transfer TSV configured to transfer TSV defect information sequentially outputted from at least one of the semiconductor chips to the controller, wherein the controller comprises: a plurality of first repair fuse units configured to set first fuse information based on the TSV defect information; and a plurality of first TSV selection units configured to selectively drive the TSVs in response to the first fuse information.

摘要翻译： 半导体系统包括控制器; 包括堆叠在所述控制器上的多个层叠半导体芯片的半导体器件以及被配置为共同地将信号传送到所述多个堆叠的半导体芯片的多个穿硅通孔（TSV） 以及缺陷信息传送TSV，被配置为将从半导体芯片中的至少一个依次输出的TSV缺陷信息传送到控制器，其中，所述控制器包括：多个第一修复熔丝单元，被配置为基于所述TSV缺陷信息来设置第一熔丝信息 ; 以及多个第一TSV选择单元，被配置为响应于所述第一熔丝信息选择性地驱动所述TSV。

公开(公告)号：US08110892B2

公开(公告)日：2012-02-07

申请号：US12649452

申请日：2009-12-30

申请人： Jeong-Woo Lee ,  Hyung-Dong Lee ,  Sang-Hoon Shin ,  Hyang-Hwa Choi

发明人： Jeong-Woo Lee ,  Hyung-Dong Lee ,  Sang-Hoon Shin ,  Hyang-Hwa Choi

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L22/22 ,  H01L23/481 ,  H01L23/5258 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2924/3011

摘要： A semiconductor device includes a plurality of stacked semiconductor chips; and a plurality of through-silicon vias (TSVs) including first TSVs and redundant TSVs and configured to commonly transfer a signal to the plurality of stacked semiconductor chips. At least one of the semiconductor chips includes a plurality of repair fuse units configured to store defect information as to at least one defect of the TSVs; and a plurality of latch units allocated to the respective TSVs and configured to store a plurality of signals indicating at least one TSV defect and outputted from the plurality of repair fuse units.

摘要翻译： 半导体器件包括多个堆叠的半导体芯片; 以及包括第一TSV和冗余TSV的多个穿硅通孔（TSV），并且被配置为共同地将信号传送到多个堆叠的半导体芯片。 半导体芯片中的至少一个包括多个修复熔丝单元，其被配置为存储关于TSV的至少一个缺陷的缺陷信息; 以及分配给各个TSV的多个锁存单元，并被配置为存储指示至少一个TSV缺陷并从多个修复熔丝单元输出的多个信号。

公开(公告)号：US08698276B2

公开(公告)日：2014-04-15

申请号：US13338716

申请日：2011-12-28

申请人： Jeong-Woo Lee ,  Hyung-Dong Lee ,  Sang-Hoon Shin ,  Hyang-Hwa Choi

发明人： Jeong-Woo Lee ,  Hyung-Dong Lee ,  Sang-Hoon Shin ,  Hyang-Hwa Choi

IPC分类号： H01L23/52

CPC分类号： H01L22/22 ,  G01R31/2853 ,  H01L23/481 ,  H01L23/5258 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/3011

摘要： A semiconductor system includes a controller; a semiconductor device comprising a plurality of stacked semiconductor chips stacked over the controller, and a plurality of through-silicon vias (TSVs) configured to commonly transfer a signal to the plurality of stacked semiconductor chips; and a defect information transfer TSV configured to transfer TSV defect information sequentially outputted from at least one of the semiconductor chips to the controller, wherein the controller comprises: a plurality of first repair fuse units configured to set first fuse information based on the TSV defect information; and a plurality of first TSV selection units configured to selectively drive the TSVs in response to the first fuse information.

摘要翻译： 半导体系统包括控制器; 包括堆叠在所述控制器上的多个层叠半导体芯片的半导体器件以及被配置为共同地将信号传送到所述多个堆叠的半导体芯片的多个穿硅通孔（TSV） 以及缺陷信息传送TSV，被配置为将从半导体芯片中的至少一个依次输出的TSV缺陷信息传送到控制器，其中，所述控制器包括：多个第一修复熔丝单元，被配置为基于所述TSV缺陷信息来设置第一熔丝信息 ; 以及多个第一TSV选择单元，被配置为响应于所述第一熔丝信息选择性地驱动所述TSV。

公开(公告)号：US08171358B2

公开(公告)日：2012-05-01

申请号：US12614672

申请日：2009-11-09

申请人： Sang-Hoon Shin ,  Hyung-Dong Lee ,  Jeong-Woo Lee ,  Hyang-Hwa Choi

发明人： Sang-Hoon Shin ,  Hyung-Dong Lee ,  Jeong-Woo Lee ,  Hyang-Hwa Choi

IPC分类号： G01R31/28 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L22/22 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/3011

摘要： A semiconductor device and a method for driving the same rapidly detect failure of a through-semiconductor-chip via and effectively repairing the failure using a latching unit assigned to each through-semiconductor-chip via. The semiconductor device includes a plurality of semiconductor chips that are stacked, and a plurality of through-semiconductor-chip vias to commonly transfer a signal to the plurality of semiconductor chips, wherein each of the semiconductor chips includes a multiplicity of latching units assigned to the through-semiconductor-chip vias and the multiplicity of latching units of each of the semiconductor chips constructs a boundary scan path including the plurality of through-semiconductor-chip vias to sequentially transfer test data.

摘要翻译： 半导体器件及其驱动方法可以快速检测半导体芯片通孔的故障，并使用分配给每个贯通半导体芯片通孔的锁存单元有效地修复故障。 半导体器件包括堆叠的多个半导体芯片，以及多个贯穿半导体芯片通孔，以共同地将信号传递到多个半导体芯片，其中每个半导体芯片包括分配给多个半导体芯片的多个锁存单元 通过半导体芯片通孔，并且每个半导体芯片的多个锁存单元构成包括多个通过半导体芯片通孔的边界扫描路径以顺序地传送测试数据。

公开(公告)号：US20120155200A1

公开(公告)日：2012-06-21

申请号：US13299497

申请日：2011-11-18

申请人： Young-Suk Moon ,  Hyung-Dong Lee ,  Jeong-Woo Lee ,  Sang-Hoon Shin

发明人： Young-Suk Moon ,  Hyung-Dong Lee ,  Jeong-Woo Lee ,  Sang-Hoon Shin

IPC分类号： G11C8/18 ,  G11C7/12 ,  G11C8/00

CPC分类号： G11C8/12 ,  G06F2213/0038

摘要： A memory system includes a memory device, a control device configured to control the memory device, a first channel configured to transfer a row command from the control device to the memory device, and a second channel configured to transfer a column command from the control device to the memory device.

摘要翻译： 存储器系统包括存储器件，被配置为控制存储器件的控制器件，被配置为将控制器件的行命令传送到存储器件的第一通道以及被配置为从控制器件传送列命令的第二通道 到存储设备。

公开(公告)号：US08996868B2

公开(公告)日：2015-03-31

申请号：US13323086

申请日：2011-12-12

申请人： Jeong-Woo Lee ,  Shin Kyung Lee ,  Oh Cheon Kwon

发明人： Jeong-Woo Lee ,  Shin Kyung Lee ,  Oh Cheon Kwon

IPC分类号： H04L9/32 ,  H04W12/06 ,  H04W12/02

CPC分类号： H04W12/06 ,  H04L63/0869 ,  H04L63/162 ,  H04W12/02 ,  H04W84/005

摘要： A vehicle communication authentication system performs mutual authentication with an authentication subject by performing a user subscriber identify module (USIM)-based authentication protocol in a wireless network, mounts a USIM card in which mutual authentication is succeeded in a vehicle terminal, and performs authentication of vehicle communication with a server that provides a vehicle service.

摘要翻译： 车辆通信认证系统通过在无线网络中执行基于用户用户识别模块（USIM）的认证协议来执行与认证对象的相互认证，将其中相互认证成功的USIM卡安装在车载终端中，并进行认证 与提供车辆服务的服务器的车辆通信。

公开(公告)号：US08747702B2

公开(公告)日：2014-06-10

申请号：US13538028

申请日：2012-06-29

申请人： Dal-Ho Huh ,  Kyoung-Mi Lee ,  Eui-Su Kang ,  Mi-Young Chae ,  Jeong-Woo Lee

发明人： Dal-Ho Huh ,  Kyoung-Mi Lee ,  Eui-Su Kang ,  Mi-Young Chae ,  Jeong-Woo Lee

IPC分类号： H01B1/00 ,  C08G75/00 ,  C08G73/00 ,  C08G73/06

CPC分类号： H01B1/125 ,  C08G2261/135 ,  C08G2261/143 ,  C08G2261/1452 ,  C08G2261/3223 ,  C08G2261/76 ,  C08G2261/794 ,  C08K5/3445 ,  C08K2201/001 ,  C08L65/00 ,  H01L51/0037 ,  H01L51/0081 ,  H01L51/0082 ,  H05B33/12 ,  C08L25/18

摘要： A conductive polymer, a conductive polymer composition, a conductive polymer layer, and an organic photoelectric device including the conductive polymer layer, the conductive polymer being doped with a polyacid copolymer, the polyacid copolymer being represented by the following Chemical Formula 1:

摘要翻译： 导电聚合物，导电聚合物组合物，导电聚合物层和包括导电聚合物层的有机光电装置，该导电聚合物掺杂有多酸共聚物，该多酸共聚物由以下化学式1表示：

公开(公告)号：US08467262B2

公开(公告)日：2013-06-18

申请号：US13116214

申请日：2011-05-26

申请人： Hyun-Jin Choi ,  Chan-Ik Park ,  Jeong-Woo Lee ,  Sung-Joo Yoo

发明人： Hyun-Jin Choi ,  Chan-Ik Park ,  Jeong-Woo Lee ,  Sung-Joo Yoo

IPC分类号： G11C8/00

CPC分类号： G11C11/5628 ,  G11C16/0483 ,  G11C16/10

摘要： A method of controlling a non-volatile memory device includes comparing the number of banks that are in operating states with a threshold value. If the number of the banks is smaller than the threshold value, data stored in a standby bank is read. If there is no bank having data to be read, a standby bank is programmed. If the number of the banks is equal to or greater than the threshold value or if the reading or the programming is performed, it is determined whether there is a reading or programming command to be performed. If there is the reading or programming command to be performed, the process is repeated from the comparing step. The programming may include programming of a most significant bit (MSB) page or a least significant bit (LSB) page.

摘要翻译： 控制非易失性存储器件的方法包括将处于工作状态的存储体的数量与阈值进行比较。 如果存储体的数量小于阈值，则读取存储在备用库中的数据。 如果没有银行有要读取的数据，则编程一个备用银行。 如果存储体的数量等于或大于阈值，或者如果执行读取或编程，则确定是否存在要执行的读取或编程命令。 如果要执行读取或编程命令，则从比较步骤重复该过程。 编程可以包括对最高有效位（MSB）页或最低有效位（LSB）页的编程。

公开(公告)号：US20120245791A1

公开(公告)日：2012-09-27

申请号：US13284780

申请日：2011-10-28

申请人： Un-Il Yun ,  Shin-Kyung Lee ,  Hyeon-Il Shin ,  Gwang-Bum Pyun ,  Jeong-Woo Lee ,  Oh-Cheon Kwon ,  Hyun-Seo Oh ,  Heung-Mo Ryang

发明人： Un-Il Yun ,  Shin-Kyung Lee ,  Hyeon-Il Shin ,  Gwang-Bum Pyun ,  Jeong-Woo Lee ,  Oh-Cheon Kwon ,  Hyun-Seo Oh ,  Heung-Mo Ryang

IPC分类号： G06F7/00

CPC分类号： B60W50/0205 ,  F02D41/1405

摘要： The apparatus includes a data normalization unit, a neural network problem prediction unit, and a transition change prediction unit. The data normalization unit creates normalization transformation values by performing normalization transformation based on threshold value ranges for a plurality of pieces of vehicle network data. The neural network problem prediction unit creates a neural network problem prediction value by predicting a mixed problem with the vehicle using a multi-artificial neural network model, created based on a learning data set related to mixed problems having previously occurred in the vehicle and the normalization transformation values. The transition change prediction unit predicts a change in transition for the mixed problem according to a change in the neural network problem prediction value, by analyzing the neural network problem prediction value and previous neural network problem prediction values previously created in the vehicle.

摘要翻译： 该装置包括数据归一化单元，神经网络问题预测单元和过渡变化预测单元。 数据归一化单元通过基于多个车辆网络数据的阈值范围执行归一化变换来生成归一化变换值。 神经网络问题预测单元通过使用基于与先前在车辆中发生的混合问题相关联的学习数据集创建的多人造神经网络模型来预测与车辆的混合问题来创建神经网络问题预测值，并且归一化 转换值。 过渡变化预测单元通过分析神经网络问题预测值和先前在车辆中产生的先前的神经网络问题预测值来预测根据神经网络问题预测值的变化的混合问题的转变的变化。