Multiple spacer steps for pitch multiplication

    公开(公告)号:US20060273456A1

    公开(公告)日:2006-12-07

    申请号:US11144543

    申请日:2005-06-02

    IPC分类号: H01L21/8242 H01L23/48

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    Method for positioning spacers for pitch multiplication
    2.
    发明授权
    Method for positioning spacers for pitch multiplication 有权
    定位用于间距乘法的间隔物的方法

    公开(公告)号:US08173550B2

    公开(公告)日:2012-05-08

    申请号:US13179851

    申请日:2011-07-11

    IPC分类号: H01L21/302

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    摘要翻译: 使用多个间距倍数的间隔物来形成具有特别小的临界尺寸的特征的掩模图案。 去除围绕多个心轴形成的每对间隔件中的一个,并且由两个相互选择性可蚀刻的材料形成的交替层围绕剩余的间隔物沉积。 然后蚀刻由一种材料形成的层,留下由形成掩模图案的另一种材料形成的垂直延伸层。 或者,代替沉积交替的层,非晶碳沉积在剩余的间隔物周围,随后在无定形碳上形成成对隔离物的多个循环,去除一对隔离物之一并沉积无定形碳层。 可以重复循环以形成所需的图案。 由于图案中的某些特征的临界尺寸可以通过控制间隔物之间​​的间隔的宽度来设定,所以可以形成特别小的掩模特征。

    MULTIPLE SPACER STEPS FOR PITCH MULTIPLICATION
    3.
    发明申请
    MULTIPLE SPACER STEPS FOR PITCH MULTIPLICATION 有权
    多种间距选择步骤

    公开(公告)号:US20090258492A1

    公开(公告)日:2009-10-15

    申请号:US12489337

    申请日:2009-06-22

    IPC分类号: H01L21/306

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    摘要翻译: 使用多个间距倍数的间隔物来形成具有特别小的临界尺寸的特征的掩模图案。 去除围绕多个心轴形成的每对间隔件中的一个,并且由两个相互选择性可蚀刻的材料形成的交替层围绕剩余的间隔物沉积。 然后蚀刻由一种材料形成的层,留下由形成掩模图案的另一种材料形成的垂直延伸层。 或者,代替沉积交替的层,非晶碳沉积在剩余的间隔物周围,随后在无定形碳上形成成对隔离物的多个循环,去除一对隔离物之一并沉积无定形碳层。 可以重复循环以形成所需的图案。 由于图案中的某些特征的临界尺寸可以通过控制间隔物之间​​的间隔的宽度来设定,所以可以形成特别小的掩模特征。

    Method for positioning spacers in pitch multiplication

    公开(公告)号:US08598041B2

    公开(公告)日:2013-12-03

    申请号:US13447520

    申请日:2012-04-16

    IPC分类号: H01L21/302

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    METHOD FOR POSITIONING SPACERS FOR PITCH MULTIPLICATION
    5.
    发明申请
    METHOD FOR POSITIONING SPACERS FOR PITCH MULTIPLICATION 有权
    用于定位多普勒空间的方法

    公开(公告)号:US20110269252A1

    公开(公告)日:2011-11-03

    申请号:US13179851

    申请日:2011-07-11

    IPC分类号: H01L21/66

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    摘要翻译: 使用多个间距倍数的间隔物来形成具有特别小的临界尺寸的特征的掩模图案。 去除围绕多个心轴形成的每对间隔件中的一个,并且由两个相互选择性可蚀刻的材料形成的交替层围绕剩余的间隔物沉积。 然后蚀刻由一种材料形成的层,留下由形成掩模图案的另一种材料形成的垂直延伸层。 或者,代替沉积交替的层,非晶碳沉积在剩余的间隔物周围,随后在无定形碳上形成成对隔离物的多个循环,去除一对隔离物之一并沉积无定形碳层。 可以重复循环以形成所需的图案。 由于图案中的某些特征的临界尺寸可以通过控制间隔物之间​​的间隔的宽度来设定,所以可以形成特别小的掩模特征。

    Multiple spacer steps for pitch multiplication
    6.
    发明授权
    Multiple spacer steps for pitch multiplication 有权
    用于间距倍增的多个间隔步长

    公开(公告)号:US07560390B2

    公开(公告)日:2009-07-14

    申请号:US11144543

    申请日:2005-06-02

    IPC分类号: H01L21/302

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed around a plurality of mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    摘要翻译: 使用多个间距倍数的间隔物来形成具有特别小的临界尺寸的特征的掩模图案。 去除围绕多个心轴形成的每对间隔件中的一个,并且由两个相互选择性可蚀刻的材料形成的交替层围绕剩余的间隔物沉积。 然后蚀刻由一种材料形成的层,留下由形成掩模图案的另一种材料形成的垂直延伸层。 或者,代替沉积交替层,无定形碳沉积在剩余的间隔物周围,随后在无定形碳上形成一对间隔物的多个循环,去除一对隔离物中的一个并沉积无定形碳层。 可以重复循环以形成所需的图案。 由于图案中的某些特征的临界尺寸可以通过控制间隔物之间​​的间隔的宽度来设定,所以可以形成特别小的掩模特征。

    METHOD FOR POSITIONING SPACERS IN PITCH MULTIPLICATION
    7.
    发明申请
    METHOD FOR POSITIONING SPACERS IN PITCH MULTIPLICATION 有权
    定位多功能定位空间的方法

    公开(公告)号:US20120202350A1

    公开(公告)日:2012-08-09

    申请号:US13447520

    申请日:2012-04-16

    IPC分类号: H01L21/302

    摘要: Multiple pitch-multiplied spacers are used to form mask patterns having features with exceptionally small critical dimensions. One of each pair of spacers formed mandrels is removed and alternating layers, formed of two mutually selectively etchable materials, are deposited around the remaining spacers. Layers formed of one of the materials are then etched, leaving behind vertically-extending layers formed of the other of the materials, which form a mask pattern. Alternatively, instead of depositing alternating layers, amorphous carbon is deposited around the remaining spacers followed by a plurality of cycles of forming pairs of spacers on the amorphous carbon, removing one of the pairs of spacers and depositing an amorphous carbon layer. The cycles can be repeated to form the desired pattern. Because the critical dimensions of some features in the pattern can be set by controlling the width of the spaces between spacers, exceptionally small mask features can be formed.

    摘要翻译: 使用多个间距倍数的间隔物来形成具有特别小的临界尺寸的特征的掩模图案。 去除每对间隔件形成的心轴中的一个,并且由两个相互选择性可蚀刻的材料形成的交替层围绕剩余的间隔物沉积。 然后蚀刻由一种材料形成的层,留下由形成掩模图案的另一种材料形成的垂直延伸层。 或者,代替沉积交替的层,非晶碳沉积在剩余的间隔物周围,随后在无定形碳上形成成对隔离物的多个循环,去除一对隔离物之一并沉积无定形碳层。 可以重复循环以形成所需的图案。 由于图案中的某些特征的临界尺寸可以通过控制间隔物之间​​的间隔的宽度来设定,所以可以形成特别小的掩模特征。

    Transistor Structures
    8.
    发明申请
    Transistor Structures 审中-公开
    晶体管结构

    公开(公告)号:US20070138577A1

    公开(公告)日:2007-06-21

    申请号:US11677923

    申请日:2007-02-22

    IPC分类号: H01L29/76 H01L21/8238

    摘要: The invention encompasses a method of incorporating nitrogen into a silicon-oxide-containing layer. The silicon-oxide-containing layer is exposed to a nitrogen-containing plasma to introduce nitrogen into the layer. The nitrogen is subsequently thermally annealed within the layer to bond at least some of the nitrogen to silicon within the layer. The invention also encompasses a method of forming a transistor. A gate oxide layer is formed over a semiconductive substrate. The gate oxide layer comprises silicon dioxide. The gate oxide layer is exposed to a nitrogen-containing plasma to introduce nitrogen into the layer, and the layer is maintained at less than or equal to 400° C. during the exposing. Subsequently, the nitrogen within the layer is thermally annealed to bond at least a majority of the nitrogen to silicon. At least one conductive layer is formed over the gate oxide layer. Source/drain regions are formed within the semiconductive substrate, and are gatedly connected to one another by the at least one conductive layer. The invention also encompasses transistor structures.

    摘要翻译: 本发明包括将氮掺入含氧化硅的层中的方法。 将含氧化硅的层暴露于含氮等离子体中以将氮引入层中。 氮气随后在层内热退火以将至少一些氮与硅结合在层内。 本发明还包括形成晶体管的方法。 在半导体衬底上形成栅氧化层。 栅氧化层包括二氧化硅。 将栅极氧化层暴露于含氮等离子体中以将氮引入层中,并且在暴露期间该层保持在小于或等于400℃。 随后,层内的氮被热退火以将至少大部分氮与硅结合。 在栅极氧化物层上形成至少一个导电层。 源极/漏极区域形成在半导体衬底内,并且通过至少一个导电层彼此门控连接。 本发明还包括晶体管结构。

    Gas delivery system for deposition processes, and methods of using same
    9.
    发明申请
    Gas delivery system for deposition processes, and methods of using same 审中-公开
    用于沉积工艺的气体输送系统及其使用方法

    公开(公告)号:US20050011449A1

    公开(公告)日:2005-01-20

    申请号:US10916918

    申请日:2004-08-12

    摘要: The present invention is generally directed to a novel gas delivery system for various deposition processes, and various methods of using same. In one illustrative embodiment, a deposition tool comprises a process chamber, a wafer stage adapted for holding a wafer positioned therein, and a gas delivery system positioned in the chamber above a position where a plasma will be generated in the chamber, wherein substantially all of a reactant gas is delivered into the chamber via the gas delivery system. In another illustrative embodiment, the reactant gas exiting the gas delivery system is directed so as to cover substantially all of an area defined by an upper surface of the wafer. In one illustrative embodiment, the method comprises positioning a wafer in a process chamber of a deposition tool, generating a plasma within the process chamber above the wafer, and forming a layer of material above the wafer by introducing substantially all of a reactant gas used to form the layer of material into the process chamber above the plasma via a gas delivery system positioned above the plasma. In another illustrative embodiment, the reactant gas exiting the gas delivery system is directed to cover substantially all of an area defined by an upper surface of the wafer.

    摘要翻译: 本发明一般涉及用于各种沉积工艺的新型气体输送系统及其使用方法。 在一个说明性实施例中,沉积工具包括处理室,适于保持位于其中的晶片的晶片台,以及定位在室中的气体输送系统,其位于室内将产生等离子体的位置,其中基本上全部 反应气体通过气体输送系统输送到室中。 在另一说明性实施例中,离开气体输送系统的反应物气体被引导以覆盖由晶片的上表面限定的基本上所有的区域。 在一个示例性实施例中,该方法包括将晶片定位在沉积工具的处理室中,在晶片上方的处理室内产生等离子体,并且通过将基本上所有的反应气体基本上引入到 通过位于等离子体上方的气体输送系统将材料层形成在等离子体上方的处理室中。 在另一示例性实施例中,离开气体输送系统的反应物气体被引导以覆盖由晶片的上表面限定的基本上所有的区域。