公开(公告)号：US07576432B2

公开(公告)日：2009-08-18

申请号：US11270071

申请日：2005-11-09

申请人： Sarah E. Kim ,  R. Scott List ,  James G. Maveety ,  Alan M. Myers ,  Quat T. Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

发明人： Sarah E. Kim ,  R. Scott List ,  James G. Maveety ,  Alan M. Myers ,  Quat T. Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/82

摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

摘要翻译： 要冷却的集成电路可以与冷却集成电路面对面邻接。 冷却集成电路可以包括电渗泵，以通过微通道将冷却流体泵送通过冷却集成电路，从而冷却发热集成电路。 电渗泵可以流体耦合到从包括集成电路的包装向上延伸的外部散热器。 特别地，外部散热器可以安装在使散热器远离封装的管上。

公开(公告)号：US06992381B2

公开(公告)日：2006-01-31

申请号：US10698749

申请日：2003-10-31

申请人： Sarah E. Kim ,  R. Scott List ,  James G. Maveety ,  Alan M. Myers ,  Quat T. Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

发明人： Sarah E. Kim ,  R. Scott List ,  James G. Maveety ,  Alan M. Myers ,  Quat T. Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/82

摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

公开(公告)号：US20050093138A1

公开(公告)日：2005-05-05

申请号：US10698749

申请日：2003-10-31

申请人： Sarah Kim ,  R. List ,  James Maveety ,  Alan Myers ,  Quat Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

发明人： Sarah Kim ,  R. List ,  James Maveety ,  Alan Myers ,  Quat Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

IPC分类号： H01L23/473 ,  H01L23/34

CPC分类号： H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/82

摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

摘要翻译： 要冷却的集成电路可以与冷却集成电路面对面邻接。 冷却集成电路可以包括电渗泵，以通过微通道将冷却流体泵送通过冷却集成电路，从而冷却发热集成电路。 电渗泵可以流体耦合到从包括集成电路的包装向上延伸的外部散热器。 特别地，外部散热器可以安装在使散热器远离封装的管上。

公开(公告)号：US20060055030A1

公开(公告)日：2006-03-16

申请号：US11270071

申请日：2005-11-09

申请人： Sarah Kim ,  R. List ,  James Maveety ,  Alan Myers ,  Quat Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

发明人： Sarah Kim ,  R. List ,  James Maveety ,  Alan Myers ,  Quat Vu ,  Ravi Prasher ,  Ravi Mahajan ,  Gilroy Vandentop

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/82

摘要： An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

公开(公告)号：US06903929B2

公开(公告)日：2005-06-07

申请号：US10404213

申请日：2003-03-31

申请人： Ravi Prasher ,  Ravi Mahajan

发明人： Ravi Prasher ,  Ravi Mahajan

IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is thermally coupled to a pair of microchannel heat exchangers disposed on opposite sides of the die. Top-side microchannel heat exchangers include a thermal mass having a plurality of open microchannels having wall bases that are hermetically sealed with the top surface of the die, thus forming a plurality of closed microchannels. Alternatively, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. Bottom-side heat exchangers include substrates and chip carriers having microchannels formed therethrough that are thermally coupled to the IC die. The cooling systems employ a plurality of microchannel heat exchangers to cool selected electronic components.

摘要翻译： 公开了采用两相微通道热交换器来冷却封装IC芯片的集成电路（IC）封装以及采用其的冷却系统。 热交换器包括其中形成有多个微通道的热质量。 在一组配置中，IC管芯热耦合到设置在管芯的相对侧上的一对微通道热交换器。 顶侧微通道热交换器包括具有多个开口微通道的热质，其具有与模具顶表面气密密封的壁基，从而形成多个闭合微通道。 或者，单独的微通道热交换器热耦合到IC管芯，并且通过耦合到IC芯片上安装有IC管芯的基板而可操作地耦合到IC管芯。 底侧热交换器包括具有热连接到IC管芯的通过其形成的微通道的衬底和芯片载体。 冷却系统采用多个微通道热交换器来冷却选定的电子部件。

公开(公告)号：US20050117299A1

公开(公告)日：2005-06-02

申请号：US11029000

申请日：2005-01-03

申请人： Ravi Prasher ,  Ravi Mahajan

发明人： Ravi Prasher ,  Ravi Mahajan

IPC分类号： F28D15/02 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H05K7/20

CPC分类号： F28D15/0233 ,  F28F3/12 ,  F28F2215/06 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/4006 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20809 ,  H01L2224/0401

摘要： A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defines an internal channel having walls configured to condense a working fluid from a vapor phase upon entering the channel into a liquid phase upon exiting the channel. The chassis comprises a shell formed from a base coupled to a plurality of walls. At least one condensing volume is formed in the base and/or the walls of the chassis. The condensing volume is configured to condense a working fluid from a vapor phase to a liquid phase as the working fluid is passed through it.

公开(公告)号：US06934154B2

公开(公告)日：2005-08-23

申请号：US10404215

申请日：2003-03-31

申请人： Ravi Prasher ,  Ravi Mahajan

发明人： Ravi Prasher ,  Ravi Mahajan

IPC分类号： F28D15/02 ,  F28F7/02 ,  H01L21/56 ,  H01L23/427 ,  H05K7/20

CPC分类号： F28D15/0266 ,  F28D2021/0029 ,  F28F7/02 ,  F28F2260/02 ,  H01L21/563 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is coupled to a thermal mass having a plurality of open microchannels such that a hermetic seal is formed between the die and the bases of the microchannel walls, thus forming a plurality of closed microchannels. In another set of configurations, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. The microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The microchannels are configured to support two-phase heat transfer using a working fluid such as water.

摘要翻译： 公开了用于冷却集成电路（IC）模具的两相微通道热交换器及其采用的冷却系统。 热交换器包括其中形成有多个微通道的热质量。 在一组构造中，IC管芯耦合到具有多个开放微通道的热质量，使得在管芯和微通道壁的基部之间形成气密密封，从而形成多个封闭的微通道。 在另一组配置中，单独的微通道热交换器热耦合到IC管芯，并通过耦合到IC芯片上安装有IC管芯的基板而可操作地耦合到IC管芯。 微通道热交换器可以用于包括泵和排热器的闭环冷却系统中。 微通道被配置为支持使用诸如水的工作流体的两相热传递。

公开(公告)号：US20050117301A1

公开(公告)日：2005-06-02

申请号：US11029136

申请日：2005-01-03

申请人： Ravi Prasher ,  Ravi Mahajan

发明人： Ravi Prasher ,  Ravi Mahajan

IPC分类号： F28D15/02 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H05K7/20

CPC分类号： F28D15/0233 ,  F28F3/12 ,  F28F2215/06 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/4006 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20809 ,  H01L2224/0401

摘要： A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defines an internal channel having walls configured to condense a working fluid from a vapor phase upon entering the channel into a liquid phase upon exiting the channel. The chassis comprises a shell formed from a base coupled to a plurality of walls. At least one condensing volume is formed in the base and/or the walls of the chassis. The condensing volume is configured to condense a working fluid from a vapor phase to a liquid phase as the working fluid is passed through it.

公开(公告)号：US20050117300A1

公开(公告)日：2005-06-02

申请号：US11029001

申请日：2005-01-03

申请人： Ravi Prasher ,  Ravi Mahajan

发明人： Ravi Prasher ,  Ravi Mahajan

IPC分类号： F28D15/02 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H05K7/20

CPC分类号： F28D15/0233 ,  F28F3/12 ,  F28F2215/06 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/4006 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20809 ,  H01L2224/0401

摘要： A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defines an internal channel having walls configured to condense a working fluid from a vapor phase upon entering the channel into a liquid phase upon exiting the channel. The chassis comprises a shell formed from a base coupled to a plurality of walls. At least one condensing volume is formed in the base and/or the walls of the chassis. The condensing volume is configured to condense a working fluid from a vapor phase to a liquid phase as the working fluid is passed through it.

摘要翻译： 一个通道散热器和一个具有一个或多个积分冷凝体积的装置底盘，适用于与两相冷却回路导通的散热器。 通道散热器包括多个中空翅片从该基座延伸的基座。 每个中空的翅片限定了内部通道，其具有被配置为在离开通道时进入通道进入液相时从气相冷凝工作流体的壁。 底盘包括由联接到多个壁的基座形成的壳体。 在底座和/或底盘的壁中形成至少一个冷凝体积。 冷凝体积被配置为当工作流体通过工作流体时将工作流体从气相冷凝到液相。

公开(公告)号：US20090244874A1

公开(公告)日：2009-10-01

申请号：US12059133

申请日：2008-03-31

申请人： Ravi Mahajan ,  Sandeep Sane

发明人： Ravi Mahajan ,  Sandeep Sane

IPC分类号： H05K7/02 ,  H01L21/50

CPC分类号： H05K1/142 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15192 ,  H05K1/141 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05647

摘要： A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.

摘要翻译： 微电子封装包括衬底（110），嵌入衬底中的硅贴片（120），在硅贴片的第一位置处的第一互连结构（131）和在第二位置处的第二互连结构（132） 硅贴片以及将第一互连结构和第二互连结构彼此连接的硅贴片中的导电线（150）。