公开(公告)号：US08512873B2

公开(公告)日：2013-08-20

申请号：US13055353

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

IPC分类号： B32B15/20

CPC分类号： H05K3/384 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/20 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/714 ,  B32B2457/08 ,  C22C19/03 ,  C25D3/562 ,  C25D7/0614 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包括未处理的铜箔 其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积物的至少一个表面为Ni-Zn合金，Zn沉积量 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔在至少一个表面上包含未处理的铜箔 其中沉积Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm2以上。

公开(公告)号：US08557392B2

公开(公告)日：2013-10-15

申请号：US13055375

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

IPC分类号： B32B15/08 ,  H05K1/09

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

摘要： In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.

摘要翻译： 为了在由铜箔形成的柔性层压电路板中提供一种柔性层叠电路板，该柔性层压电路板使用表面处理铜箔来满足所有铜箔的相对于聚酰亚胺的接合强度，耐酸性和蚀刻性能 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，并且Zn沉积量为0.08mg / dm 2以上，以提供柔性覆铜层压板。

公开(公告)号：US20110189501A1

公开(公告)日：2011-08-04

申请号：US13055375

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno ,  Koichi Hattori ,  Naoya Kuwasaki

IPC分类号： B32B15/08 ,  B32B15/088

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

摘要： In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible cupper clad laminate.

摘要翻译： 为了在由铜箔形成的柔性层压电路板中提供一种柔性层叠电路板，该柔性层压电路板使用表面处理铜箔来满足所有铜箔的相对于聚酰亚胺的接合强度，耐酸性和蚀刻性能 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，并且Zn沉积量为0.08mg / dm 2以上，以提供柔性的覆铜层压板。

公开(公告)号：US20110189499A1

公开(公告)日：2011-08-04

申请号：US13055353

申请日：2009-07-22

申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

IPC分类号： C25D7/06 ,  B32B15/088 ,  B32B15/01

CPC分类号： H05K3/384 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/20 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/714 ,  B32B2457/08 ,  C22C19/03 ,  C25D3/562 ,  C25D7/0614 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包括未处理的铜箔 其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积物的至少一个表面为Ni-Zn合金，Zn沉积量 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔在至少一个表面上包含未处理的铜箔 其中沉积Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm2以上。

公开(公告)号：US20110209903A1

公开(公告)日：2011-09-01

申请号：US13062335

申请日：2009-09-04

申请人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

发明人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

IPC分类号： H05K1/03 ,  B32B15/04 ,  B32B7/02

CPC分类号： C25D1/20 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C22C9/00 ,  C25D1/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/48 ,  H05K3/025 ,  H05K2203/0315 ,  Y10T428/2495 ,  Y10T428/31678

摘要： The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.

摘要翻译： 本发明的目的是提供一种具有抑制起泡发生并且剥离强度稳定的载体的超薄铜箔，特别是提供具有能够容易地从载体箔剥离的载体的超薄铜箔 超薄铜箔甚至在高温环境下。 作为其手段，提供了具有由载体箔，剥离层和铜箔构成的载体的超薄铜箔，其中剥离层由设置在载体箔侧的第一剥离层形成， 设置在超薄铜箔侧的第二释放层，在载体箔和第一剥离层之间存在第一界面，超薄铜箔和第二剥离层之间的第二界面，以及第三界面 第一释放层和第二释放层，并且界面处的剥离强度是第一界面>第三界面，第二界面>第三界面。

公开(公告)号：US08674229B2

公开(公告)日：2014-03-18

申请号：US13062335

申请日：2009-09-04

申请人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

发明人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

IPC分类号： H01B1/04

CPC分类号： C25D1/20 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C22C9/00 ,  C25D1/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/48 ,  H05K3/025 ,  H05K2203/0315 ,  Y10T428/2495 ,  Y10T428/31678

摘要： The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.

摘要翻译： 本发明的目的是提供一种具有抑制起泡发生并且剥离强度稳定的载体的超薄铜箔，特别是提供具有能够容易地从载体箔剥离的载体的超薄铜箔 超薄铜箔甚至在高温环境下。 作为其手段，提供了具有由载体箔，剥离层和铜箔构成的载体的超薄铜箔，其中剥离层由设置在载体箔侧的第一剥离层形成， 设置在超薄铜箔侧的第二释放层，在载体箔和第一剥离层之间存在第一界面，超薄铜箔和第二剥离层之间的第二界面，以及第三界面 第一释放层和第二释放层，并且界面处的剥离强度是第一界面>第三界面，第二界面>第三界面。

公开(公告)号：US11084682B2

公开(公告)日：2021-08-10

申请号：US16127554

申请日：2018-09-11

申请人： Takahiro Watanabe ,  Tomohiro Furuhashi ,  Michitaka Suzuki ,  Tomomichi Hoshino ,  Yuji Suzuki ,  Satoshi Saito ,  Takao Watanabe

发明人： Takahiro Watanabe ,  Tomohiro Furuhashi ,  Michitaka Suzuki ,  Tomomichi Hoshino ,  Yuji Suzuki ,  Satoshi Saito ,  Takao Watanabe

IPC分类号： B65H45/20 ,  B65H45/101 ,  B65H45/14 ,  G03G15/00 ,  G03G21/16

摘要： A sheet processing apparatus includes: a second conveying roller pair that receives and conveys a sheet conveyed by a first conveying roller pair; a first folding roller pair that forms a first fold on the sheet; and a first rotation unit capable of rotating the second conveying roller pair and the first folding roller pair. One roller of the second conveying roller pair and one roller of the first folding roller pair are a common roller shared therebetween. The second conveying roller pair causes the sheet to be deflected and guided to the first folding roller pair, and the first folding roller pair forms the first fold on the deflected sheet by rotating the first rotation unit in a certain direction in a state in which the sheet is held by the first conveying roller pair and the second conveying roller pair.

公开(公告)号：US20180024466A1

公开(公告)日：2018-01-25

申请号：US15709145

申请日：2017-09-19

申请人： NOBUO TAKAMI ,  Noriyuki Kimura ,  Eisuke Hori ,  Hideki Kimura ,  Kenji Kikuchi ,  Yuji Suzuki

发明人： NOBUO TAKAMI ,  Noriyuki Kimura ,  Eisuke Hori ,  Hideki Kimura ,  Kenji Kikuchi ,  Yuji Suzuki

IPC分类号： G03G15/08 ,  G03G21/16

CPC分类号： G03G15/0879 ,  G03G15/0863 ,  G03G15/0872 ,  G03G15/0886 ,  G03G21/1647 ,  G03G2215/0665 ,  G03G2215/0668 ,  G03G2215/0692 ,  G03G2215/0695 ,  G03G2215/0697

摘要： A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.

公开(公告)号：US09778596B2

公开(公告)日：2017-10-03

申请号：US15379985

申请日：2016-12-15

申请人： Nobuo Takami ,  Noriyuki Kimura ,  Eisuke Hori ,  Hideki Kimura ,  Kenji Kikuchi ,  Yuji Suzuki

发明人： Nobuo Takami ,  Noriyuki Kimura ,  Eisuke Hori ,  Hideki Kimura ,  Kenji Kikuchi ,  Yuji Suzuki

IPC分类号： G03G15/08

CPC分类号： G03G15/0879 ,  G03G15/0863 ,  G03G15/0872 ,  G03G15/0886 ,  G03G21/1647 ,  G03G2215/0665 ,  G03G2215/0668 ,  G03G2215/0692 ,  G03G2215/0695 ,  G03G2215/0697

摘要： A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.

公开(公告)号：US20170097586A1

公开(公告)日：2017-04-06

申请号：US15379985

申请日：2016-12-15

申请人： NOBUO TAKAMI ,  Noriyuki Kimura ,  Eisuke Hori ,  Hideki Kimura ,  Kenji Kikuchi ,  Yuji Suzuki

发明人： NOBUO TAKAMI ,  Noriyuki Kimura ,  Eisuke Hori ,  Hideki Kimura ,  Kenji Kikuchi ,  Yuji Suzuki

IPC分类号： G03G15/08

CPC分类号： G03G15/0879 ,  G03G15/0863 ,  G03G15/0872 ,  G03G15/0886 ,  G03G21/1647 ,  G03G2215/0665 ,  G03G2215/0668 ,  G03G2215/0692 ,  G03G2215/0695 ,  G03G2215/0697

摘要： A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.