利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.019 秒)

    Surface treated copper foil and copper clad laminate
    1.
    发明授权
    Surface treated copper foil and copper clad laminate 有权
    表面处理铜箔和覆铜层压板

    公开(公告)号：US08512873B2

    公开(公告)日：2013-08-20

    申请号：US13055353

    申请日：2009-07-22

    申请人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

    发明人： Satoshi Fujisawa ,  Yuji Suzuki ,  Takeo Uno

    IPC分类号： B32B15/20

    CPC分类号： H05K3/384 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/20 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/714 ,  B32B2457/08 ,  C22C19/03 ,  C25D3/562 ,  C25D7/0614 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

    摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

    摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包括未处理的铜箔 其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积物的至少一个表面为Ni-Zn合金，Zn沉积量 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔在至少一个表面上包含未处理的铜箔 其中沉积Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm2以上。

    ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
    5.
    发明申请
    ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD 审中-公开
    硬化铜箔，生产方法，铜箔层压板和印刷电路板

    公开(公告)号：US20120285734A1

    公开(公告)日：2012-11-15

    申请号：US13574377

    申请日：2011-01-21

    申请人： Takeo Uno ,  Satoshi Fujisawa

    发明人： Takeo Uno ,  Satoshi Fujisawa

    IPC分类号： B32B3/00 ,  B32B15/08 ,  B05D5/02 ,  C25D5/16 ,  B05D5/12 ,  H05K1/09 ,  B21D31/00

    CPC分类号： C22C19/03 ,  B32B15/01 ,  C22C19/002 ,  H05K1/09 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  Y10T428/12993 ,  Y10T428/31678

    摘要： Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 μm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 μm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 μm, a height of 0.4-1.8 μm and an aspect ratio [height/width] of 1.2-3.5.

    摘要翻译： 本发明提供一种在高频范围内形成精细图案化电路和良好的透射性的优异的铜箔，并且对树脂基材具有高粘合性和良好的耐化学性。 通过使基底铜箔（未处理铜箔）的至少一个表面粗糙化以使其表面粗糙度（Rz）相对于所述基底铜箔（未处理铜箔）的表面粗糙度（Rz）增加而获得的表面粗糙化的铜箔 箔，0.05-0.3μm，粗糙化后的表面粗糙度（Rz）为1.1μm以下的粗糙面，其中，粗糙面由粗糙度为0.3〜0.8μm的尖锐的凸状构成， ，高度为0.4-1.8μm，纵横比[高/宽]为1.2-3.5。

    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD
    6.
    发明申请
    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD 有权
    表面处理铜箔，其生产方法和铜层压板

    公开(公告)号：US20130040162A1

    公开(公告)日：2013-02-14

    申请号：US13574478

    申请日：2011-01-21

    申请人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    发明人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    IPC分类号： B32B15/08 ,  B32B37/14 ,  B05D7/14 ,  B05D5/00 ,  B32B15/04 ,  B32B33/00

    CPC分类号： C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

    摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

    摘要翻译： 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。

    Surface-treated copper foil, method for producing same, and copper clad laminated board
    7.
    发明授权
    Surface-treated copper foil, method for producing same, and copper clad laminated board 有权
    表面处理铜箔，其制造方法和铜包覆层压板

    公开(公告)号：US08852754B2

    公开(公告)日：2014-10-07

    申请号：US13574478

    申请日：2011-01-21

    申请人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    发明人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    IPC分类号： B32B15/20 ,  C25D3/56 ,  C22C19/00 ,  B32B15/01 ,  C25D5/48 ,  B32B15/08 ,  C22C19/03 ,  C25D5/34 ,  H05K3/38

    CPC分类号： C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

    摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

    摘要翻译： 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。

    Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate
    8.
    发明授权
    Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate 有权
    超薄铜箔带载体和覆铜层压板或印刷电路板基板

    公开(公告)号：US08674229B2

    公开(公告)日：2014-03-18

    申请号：US13062335

    申请日：2009-09-04

    申请人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

    发明人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

    IPC分类号： H01B1/04

    CPC分类号： C25D1/20 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C22C9/00 ,  C25D1/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/48 ,  H05K3/025 ,  H05K2203/0315 ,  Y10T428/2495 ,  Y10T428/31678

    摘要： The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.

    摘要翻译： 本发明的目的是提供一种具有抑制起泡发生并且剥离强度稳定的载体的超薄铜箔，特别是提供具有能够容易地从载体箔剥离的载体的超薄铜箔 超薄铜箔甚至在高温环境下。 作为其手段，提供了具有由载体箔，剥离层和铜箔构成的载体的超薄铜箔，其中剥离层由设置在载体箔侧的第一剥离层形成， 设置在超薄铜箔侧的第二释放层，在载体箔和第一剥离层之间存在第一界面，超薄铜箔和第二剥离层之间的第二界面，以及第三界面 第一释放层和第二释放层，并且界面处的剥离强度是第一界面>第三界面，第二界面>第三界面。

    ULTRA-THIN COPPER FOIL WITH CARRIER AND COPPER-CLAD LAMINATE BOARD OR PRINTED CIRCUIT BOARD SUBSTRATE
    9.
    发明申请
    ULTRA-THIN COPPER FOIL WITH CARRIER AND COPPER-CLAD LAMINATE BOARD OR PRINTED CIRCUIT BOARD SUBSTRATE 有权
    超薄铜箔带载体和铜箔层压板或印刷电路板基板

    公开(公告)号：US20110209903A1

    公开(公告)日：2011-09-01

    申请号：US13062335

    申请日：2009-09-04

    申请人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

    发明人： Takeo Uno ,  Akira Kawakami ,  Yuji Suzuki

    IPC分类号： H05K1/03 ,  B32B15/04 ,  B32B7/02

    CPC分类号： C25D1/20 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C22C9/00 ,  C25D1/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/48 ,  H05K3/025 ,  H05K2203/0315 ,  Y10T428/2495 ,  Y10T428/31678

    摘要： The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.

    摘要翻译： 本发明的目的是提供一种具有抑制起泡发生并且剥离强度稳定的载体的超薄铜箔，特别是提供具有能够容易地从载体箔剥离的载体的超薄铜箔 超薄铜箔甚至在高温环境下。 作为其手段，提供了具有由载体箔，剥离层和铜箔构成的载体的超薄铜箔，其中剥离层由设置在载体箔侧的第一剥离层形成， 设置在超薄铜箔侧的第二释放层，在载体箔和第一剥离层之间存在第一界面，超薄铜箔和第二剥离层之间的第二界面，以及第三界面 第一释放层和第二释放层，并且界面处的剥离强度是第一界面>第三界面，第二界面>第三界面。