公开(公告)号：US08883564B2

公开(公告)日：2014-11-11

申请号：US13148977

申请日：2010-02-08

申请人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

发明人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

IPC分类号： H01L33/64 ,  C04B41/88 ,  H05K1/05 ,  C04B41/51 ,  H01L23/373 ,  H01L23/14 ,  C04B41/00 ,  B22F3/26 ,  C04B111/00

CPC分类号： C04B41/88 ,  B22F3/26 ,  B23D57/0023 ,  B23D61/185 ,  B28D5/045 ,  C04B41/009 ,  C04B41/5155 ,  C04B2111/00844 ,  H01L23/142 ,  H01L23/373 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/0323 ,  Y10T83/04 ,  Y10T428/24273 ,  Y10T428/24909 ,  Y10T428/24917 ,  C04B41/4519 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B35/522 ,  C04B38/00 ,  H01L2924/00

摘要： A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10−6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

摘要翻译： 一种生产基材的方法，其包括在下列条件（1）至（4）中使用多线锯将铝/石墨复合材料加工成厚度为0.5-3mm的板：（1）所述金属丝具有磨料 作为选自金刚石，C-BN，碳化硅，氧化铝中的一种或多种物质的平均粒径为10〜100μm的颗粒; （2）电线的直径为0.1-0.3mm; （3）电线以100-700m / min的速度运行; 和（4）以0.1-2mm / min的速率切割复合材料。 铝/石墨复合体的表面粗糙度（Ra）为0.1-3μm，25℃下的热导率为150-300W / mK，三个垂直方向的最大值与最小导热率之比 为1-1.3，25-150℃的热膨胀系数为4×10 6〜7.5×10 -6 / K，三个垂直方向的最大热膨胀系数与最小值之比为1 -1.3，三点弯曲强度为50-150MPa。

公开(公告)号：US08546842B2

公开(公告)日：2013-10-01

申请号：US13384479

申请日：2010-07-16

申请人： Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

发明人： Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L23/142 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.

摘要翻译： 提供了一种高度可靠的LED封装，其具有显着改善的散热性能，LED封装的制造方法以及在LED封装中使用的LED芯片组件。 LED封装的特征在于，LED芯片组件（10）被结合到通过在其间具有绝缘层（4）的金属基板（5）上形成金属电路（3）而形成的电路板（11），而LED LED芯片组件的芯片（1）和电路板的金属电路（3）经由电连接构件（9）连接，并且至少LED芯片组件和电连接构件用树脂密封剂（8 ）包括荧光材料。

公开(公告)号：US20120112236A1

公开(公告)日：2012-05-10

申请号：US13384479

申请日：2010-07-16

申请人： Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

发明人： Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

IPC分类号： H01L33/50 ,  H01L33/62

CPC分类号： H01L33/641 ,  H01L23/142 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.

摘要翻译： 提供了一种高度可靠的LED封装，其具有显着改善的散热性能，LED封装的制造方法以及在LED封装中使用的LED芯片组件。 LED封装的特征在于，LED芯片组件（10）被结合到通过在其间具有绝缘层（4）的金属基板（5）上形成金属电路（3）而形成的电路板（11），而LED LED芯片组件的芯片（1）和电路板的金属电路（3）经由电连接构件（9）连接，并且至少LED芯片组件和电连接构件用树脂密封剂（8 ）包括荧光材料。

公开(公告)号：US20110316038A1

公开(公告)日：2011-12-29

申请号：US13148977

申请日：2010-02-08

申请人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

发明人： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

IPC分类号： H01L33/64 ,  B32B3/00 ,  B32B3/10 ,  B26D1/553 ,  B32B15/00

CPC分类号： C04B41/88 ,  B22F3/26 ,  B23D57/0023 ,  B23D61/185 ,  B28D5/045 ,  C04B41/009 ,  C04B41/5155 ,  C04B2111/00844 ,  H01L23/142 ,  H01L23/373 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/0323 ,  Y10T83/04 ,  Y10T428/24273 ,  Y10T428/24909 ,  Y10T428/24917 ,  C04B41/4519 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B35/522 ,  C04B38/00 ,  H01L2924/00

摘要： A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10−6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

摘要翻译： 一种生产基材的方法，其包括在下列条件（1）至（4）中使用多线锯将铝/石墨复合材料加工成厚度为0.5-3mm的板：（1）所述金属丝具有磨料 作为选自金刚石，C-BN，碳化硅，氧化铝中的一种或多种物质的平均粒径为10〜100μm的颗粒; （2）电线的直径为0.1-0.3mm; （3）电线以100-700m / min的速度运行; 和（4）以0.1-2mm / min的速率切割复合材料。 铝/石墨复合体的表面粗糙度（Ra）为0.1-3μm，25℃下的热导率为150-300W / mK，三个垂直方向的最大值与最小导热率之比 为1-1.3，25-150℃的热膨胀系数为4×10 6〜7.5×10 -6 / K，三个垂直方向的最大热膨胀系数与最小值之比为1 -1.3，三点弯曲强度为50-150MPa。

公开(公告)号：US20090243915A1

公开(公告)日：2009-10-01

申请号：US12210370

申请日：2008-09-15

申请人： Yoshiteru Nishizato ,  Shinya Narita

发明人： Yoshiteru Nishizato ,  Shinya Narita

IPC分类号： G01S13/00

CPC分类号： G01S13/003 ,  G01S7/34 ,  G01S13/04 ,  G08B13/2491 ,  G08B29/20

摘要： A microwave sensor apparatus according to an embodiment of the invention includes a reception detection circuit which amplifies a microwave received through a reception antenna, performs wave detection, and supplies a reception detection signal, a monitoring unit for monitoring the reception detection signal supplied from the reception detection circuit, detecting that the reception detection signal is changed not lower than a predetermined value, and supplying an intrusion alarm, a reflected wave detection unit which detects presence or absence of a reflected wave in the detection area using the reception detection signal supplied from the reception detection circuit, and an AGC circuit which controls a gain of the reception detection circuit at a response speed faster than that of the case in which reflected wave is not detected when the reflected wave detection unit detects the reflected wave.

摘要翻译： 根据本发明的实施例的微波传感器装置包括：接收检测电路，其放大通过接收天线接收的微波，执行波检测，并提供接收检测信号;监视单元，用于监视从接收器提供的接收检测信号 检测电路，检测接收检测信号是否变化不低于预定值，并提供入侵报警，反射波检测单元，其使用从所述检测电路提供的接收检测信号检测检测区域中的反射波的有无。 接收检测电路和AGC电路，其以比反射波检测单元检测到反射波时没有检测到反射波的情况更快的响应速度来控制接收检测电路的增益。