公开(公告)号：US20110316038A1

公开(公告)日：2011-12-29

申请号：US13148977

申请日：2010-02-08

Applicant: Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

Inventor： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

IPC: H01L33/64 ,  B32B3/00 ,  B32B3/10 ,  B26D1/553 ,  B32B15/00

CPC classification number: C04B41/88 ,  B22F3/26 ,  B23D57/0023 ,  B23D61/185 ,  B28D5/045 ,  C04B41/009 ,  C04B41/5155 ,  C04B2111/00844 ,  H01L23/142 ,  H01L23/373 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/0323 ,  Y10T83/04 ,  Y10T428/24273 ,  Y10T428/24909 ,  Y10T428/24917 ,  C04B41/4519 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B35/522 ,  C04B38/00 ,  H01L2924/00

Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10−6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

Abstract translation: 一种生产基材的方法，其包括在下列条件（1）至（4）中使用多线锯将铝/石墨复合材料加工成厚度为0.5-3mm的板：（1）所述金属丝具有磨料 作为选自金刚石，C-BN，碳化硅，氧化铝中的一种或多种物质的平均粒径为10〜100μm的颗粒; （2）电线的直径为0.1-0.3mm; （3）电线以100-700m / min的速度运行; 和（4）以0.1-2mm / min的速率切割复合材料。 铝/石墨复合体的表面粗糙度（Ra）为0.1-3μm，25℃下的热导率为150-300W / mK，三个垂直方向的最大值与最小导热率之比 为1-1.3，25-150℃的热膨胀系数为4×10 6〜7.5×10 -6 / K，三个垂直方向的最大热膨胀系数与最小值之比为1 -1.3，三点弯曲强度为50-150MPa。

公开(公告)号：US08546842B2

公开(公告)日：2013-10-01

申请号：US13384479

申请日：2010-07-16

Applicant: Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

Inventor： Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

IPC: H01L33/00

CPC classification number: H01L33/641 ,  H01L23/142 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.

Abstract translation: 提供了一种高度可靠的LED封装，其具有显着改善的散热性能，LED封装的制造方法以及在LED封装中使用的LED芯片组件。 LED封装的特征在于，LED芯片组件（10）被结合到通过在其间具有绝缘层（4）的金属基板（5）上形成金属电路（3）而形成的电路板（11），而LED LED芯片组件的芯片（1）和电路板的金属电路（3）经由电连接构件（9）连接，并且至少LED芯片组件和电连接构件用树脂密封剂（8 ）包括荧光材料。

公开(公告)号：US20090092793A1

公开(公告)日：2009-04-09

申请号：US12298598

申请日：2007-04-23

Applicant: Hideki Hirotsuru ,  Goh Iwamoto ,  Hideo Tsukamoto ,  Satoshi Higuma ,  Nobuyuki Hashimoto

Inventor： Hideki Hirotsuru ,  Goh Iwamoto ,  Hideo Tsukamoto ,  Satoshi Higuma ,  Nobuyuki Hashimoto

IPC: B32B3/26

CPC classification number: H01L23/3733 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  C04B2111/00844 ,  C22C1/1036 ,  C22C29/065 ,  C22C32/0063 ,  C22C2001/1073 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12479 ,  Y10T428/24496 ,  Y10T428/24999 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B41/515 ,  C04B14/4631 ,  C04B41/4541 ,  C04B41/5144 ,  C04B35/565 ,  C04B38/00 ,  H01L2924/00

Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 μm in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies,wherein the aluminum layers each has an average thickness of from 10 to 150 μm, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 μm, and the difference between average thicknesses of the aluminum layers on the respective principal planes is at most 50 μm, and wherein the shape of the silicon carbide porous body is rectangle or a rectangle from which peripheral portions encompassing holes are removed.

Abstract translation: 一种用于功率模块的基板，包括铝 - 碳化硅复合材料和由在铝 - 碳化硅复合材料的相应主平面上形成的以铝为主要成分的金属制成的铝层，其中铝 - 碳化硅复合材料由 在整个多孔体中形成或制造平板状的碳化硅多孔体至少具有100微米的厚度差异，并将这些多孔体堆叠在各自夹在脱模板之间，使得在平面中的紧固扭矩 方向为1〜20Nm，将含有铝的金属作为主要成分浸渍到碳化硅多孔体中，其中，铝层的平均厚度为10〜150μm，最大厚度与最小值之差 每个主平面中铝层的厚度至多为80μm，铝的平均厚度之差 各个主面上的层为50μm以下，碳化硅多孔体的形状为长方形或长方形，除去周边部分。

公开(公告)号：US20120112236A1

公开(公告)日：2012-05-10

申请号：US13384479

申请日：2010-07-16

Applicant: Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

Inventor： Satoshi Higuma ,  Hideki Hirotsuru ,  Shinya Narita

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/641 ,  H01L23/142 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.

Abstract translation: 提供了一种高度可靠的LED封装，其具有显着改善的散热性能，LED封装的制造方法以及在LED封装中使用的LED芯片组件。 LED封装的特征在于，LED芯片组件（10）被结合到通过在其间具有绝缘层（4）的金属基板（5）上形成金属电路（3）而形成的电路板（11），而LED LED芯片组件的芯片（1）和电路板的金属电路（3）经由电连接构件（9）连接，并且至少LED芯片组件和电连接构件用树脂密封剂（8 ）包括荧光材料。

公开(公告)号：US07993728B2

公开(公告)日：2011-08-09

申请号：US12298598

申请日：2007-04-23

Applicant: Hideki Hirotsuru ,  Goh Iwamoto ,  Hideo Tsukamoto ,  Satoshi Higuma ,  Nobuyuki Hashimoto

Inventor： Hideki Hirotsuru ,  Goh Iwamoto ,  Hideo Tsukamoto ,  Satoshi Higuma ,  Nobuyuki Hashimoto

IPC: B32B3/26

CPC classification number: H01L23/3733 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  C04B2111/00844 ,  C22C1/1036 ,  C22C29/065 ,  C22C32/0063 ,  C22C2001/1073 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12479 ,  Y10T428/24496 ,  Y10T428/24999 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B41/515 ,  C04B14/4631 ,  C04B41/4541 ,  C04B41/5144 ,  C04B35/565 ,  C04B38/00 ,  H01L2924/00

Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 μm in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies,wherein the aluminum layers each has an average thickness of from 10 to 150 μm, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 μm, and the difference between average thicknesses of the aluminum layers on the respective principal planes is at most 50 μm, and wherein the shape of the silicon carbide porous body is rectangle or a rectangle from which peripheral portions encompassing holes are removed.

Abstract translation: 一种用于功率模块的基板，包括铝 - 碳化硅复合材料和由在铝 - 碳化硅复合材料的相应主平面上形成的以铝为主要成分的金属制成的铝层，其中铝 - 碳化硅复合材料由 在整个多孔体中形成或制造平板状碳化硅多孔体至多具有100μm的厚度差，并将这些多孔体堆叠在各自夹在脱模板之间，使得在平面中的紧固扭矩 方向为1〜20Nm，将含有铝的金属作为主要成分浸渍到碳化硅多孔体中，其中，铝层的平均厚度为10〜150μm，最大厚度与最小值之间的差 每个主平面中铝层的厚度至多为80μm，铝的平均厚度之差 各个主面上的层为50μm以下，碳化硅多孔体的形状为矩形或长方形，除去周边部分。

公开(公告)号：US08883564B2

公开(公告)日：2014-11-11

申请号：US13148977

申请日：2010-02-08

Applicant: Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

Inventor： Hideki Hirotsuru ,  Satoshi Higuma ,  Shinya Narita ,  Yoshihiko Tsujimura

IPC: H01L33/64 ,  C04B41/88 ,  H05K1/05 ,  C04B41/51 ,  H01L23/373 ,  H01L23/14 ,  C04B41/00 ,  B22F3/26 ,  C04B111/00

CPC classification number: C04B41/88 ,  B22F3/26 ,  B23D57/0023 ,  B23D61/185 ,  B28D5/045 ,  C04B41/009 ,  C04B41/5155 ,  C04B2111/00844 ,  H01L23/142 ,  H01L23/373 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/0323 ,  Y10T83/04 ,  Y10T428/24273 ,  Y10T428/24909 ,  Y10T428/24917 ,  C04B41/4519 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B35/522 ,  C04B38/00 ,  H01L2924/00

Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10−6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

Abstract translation: 一种生产基材的方法，其包括在下列条件（1）至（4）中使用多线锯将铝/石墨复合材料加工成厚度为0.5-3mm的板：（1）所述金属丝具有磨料 作为选自金刚石，C-BN，碳化硅，氧化铝中的一种或多种物质的平均粒径为10〜100μm的颗粒; （2）电线的直径为0.1-0.3mm; （3）电线以100-700m / min的速度运行; 和（4）以0.1-2mm / min的速率切割复合材料。 铝/石墨复合体的表面粗糙度（Ra）为0.1-3μm，25℃下的热导率为150-300W / mK，三个垂直方向的最大值与最小导热率之比 为1-1.3，25-150℃的热膨胀系数为4×10 6〜7.5×10 -6 / K，三个垂直方向的最大热膨胀系数与最小值之比为1 -1.3，三点弯曲强度为50-150MPa。