摘要:
Disclosed is a process for the production of a semiconductor device, which comprises forming a film of a resist composed of a substance generating an acid catalyst by being irradiated with radiation and a polymer having an Si-containing group that can be eliminated by the acid catalyst, irradiating the resist film with radiations and patterning the irradiated resist film by oxygen reactive ion etching, ECR etching or reactive ion beam etching. This process is advantageously used for preparing a semiconductor device by the two-layer resist method.
摘要:
A positive-type resist material for forming resist patterns having submicron geometries on a substrate, the resist material comprising a copolymer of a first monomer of silicon containing methacrylic ester and a second monomer of either acrylic ester or acrylonitrile, the alpha-position of the second monomer being substituted by an electron attracting group. The first monomer has a high resistance to an oxygen plasma and the second monomer has a high sensitivity to e-beam/X-ray irradiation. As the electron attracting group, a trifluoromethyl group, a halogen group, a cyano group and a CH.sub.2 CO.sub.2 R group are used. The embodied first monomers are trimethylsilylmethyl methacrylate and (diphenylmethylsilyl)methyl methacrylate, and the embodied second monomers are .alpha.-trifluoromethyl (2,2,2-trifluoroethyl) acrylate and .alpha.-chloroacrylonitrile.
摘要:
A pattern formation process using a positive-working resist material of the formula (I): ##STR1## in which R.sup.1 and R.sup.2 may be the same or different, and each represents a substituted or unsubstituted lower alkyl group, X represents a halogen atom, and m and n each is larger than 0 and smaller than 100; and carrying out the development of the selectively exposed resist material with xylene for 10 to 20 minutes, or with other solvent(s). This process effectively obtains fine resist patterns having an increased sensitivity and excellent resolution without a reduction of the layer thickness in an unexposed area of the resist and resist residues in an exposed area of the same.
摘要:
A positive-type resist material for forming resist patterns having submicron geometries on a substrate, the resist material comprising a copolymer of a first monomer of silicon containing methacrylic ester and a second monomer of either acrylic ester or acrylonitrile, the alpha-position of the second monomer being substituted by an electron attracting group. The first monomer has a high resistance to an oxygen plasma and the second monomer has a high sensitivity to e-beam/X-ray irradiation. As the electron attracting group, a trifluoromethyl group, a halogen group, a cyano group and a CH.sub.2 CO.sub.2 R group are used. The embodied first monomers are trimethylsilylmethyl methacrylate and (diphenylmethylsilyl)methyl methacrylate, and the embodied second monomers are .alpha.-trifluoromethyl (2,2,2-trifluoroethyl) acrylate and .alpha.-chloroacrylonitrile.
摘要:
A process for the preparation of a semiconductor device and a pattern-forming coating solution used for this process are disclosed. In this process, a coating solution formed by dissolving an .alpha.-methylstyrene/methyl .alpha.-chloroacrylate copolymer as a specific positive resist material in a specific solvent is coated on a layer to be etched, which is formed on a semiconductor substrate. In this process, penetration between the substrate and the resist of the resist into the clayer to be etched, and a formation of cracks in the resist after the etching, are prevented.
摘要:
Electrically conductive layer-providing compositions comprising a conducting or semiconducting polymer and/or a non-conducting precursor thereof and a photo-acid generator having a sensitivity to an ultraviolet radiation having a wavelength of 300 nm or less. The electrically conductive layer, when an electron beam resist layer adjacent thereto is exposed to a pattern of the electron beam, can effectively prevent an accumulation of an electrical charge on the resist layer and accordingly a misalignment of the resist pattern. In addition, the compositions and electrically conductive layer resulting therefrom can be stably stored if not exposed to ultraviolet radiation. Pattern formation processes using the electrically conductive layer-providing compositions are also provided.
摘要:
Compound represented by formula (1) or a pharmaceutically acceptable solvate thereof, useful for treating or preventing Paget's disease of bone, hypercalcaemia, osteoporosis or asthma. (1) R1 represents a C1-C6 alkyl group or C7-C15 aralkyl group (the aromatic ring of which can be substituted by a C1-C6 alkyl group, C1-C6 alkoxy group, a hydroxyl group, a halogenatom or a trifluoromethyl group), R2 represents a C1-C6 alkyl group, and R3 represents a C1-C6 alkyl or alkoxy group, which can be substituted with a hydroxyl group.
摘要:
Polyether type antibiotics are produced by culturing a polyether type antibiotic-producing microorganism is a medium containing a fatty acid or its precursor and ammonia or an ammonium salt or urea.
摘要:
A tyrosinase activity inhibitor and an ameliorant for facial blood flow that are excellent in terms of safety, and medicinal compositions, food compositions, and cosmetic preparations that contain the inhibitor and the ameliorant as active ingredients are provided. A tyrosinase activity inhibitor and an ameliorant for facial blood flow that contain anthocyan obtained by concentration or extraction of plant material, and medicinal compositions, food compositions, and cosmetic preparations that have an inhibitory action on tyrosinase activity and ameliorating action on facial blood flow are provided.
摘要:
A process for producing a photocatalyst material, the photocatalyst material exhibiting highly active photocatalytic action and capable of reducing special odor generated at the time of ultraviolet irradiation. This process comprises the raw photocatalyst material preparation step (P1) of obtaining a photocatalyst material (raw photocatalyst material) being in the state of not bearing any base metal on its surface and the base metal superimposition step (P3) of causing the raw photocatalyst material obtained in the step P1 to bear base metal fine particles on its surface to thereby obtain the photocatalyst material bearing a base metal. The base metal superimposition step P3 comprises the solution treatment step (P31) of dipping the raw photocatalyst material in a base metal compound solution according to photoprecipitation, the ultraviolet irradiation step (P32) of irradiating the base metal bearing photocatalyst material obtained in the step P31 with ultraviolet light and the drying step (P33) of drying the photocatalyst material resulting from the step P32.