Micromirror array assembly with in-array pillars
    1.
    发明申请
    Micromirror array assembly with in-array pillars 有权
    具有阵列支柱的微镜阵列组件

    公开(公告)号:US20050275930A1

    公开(公告)日:2005-12-15

    申请号:US10869539

    申请日:2004-06-15

    IPC分类号: G02B26/00 G02B26/08

    摘要: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

    摘要翻译: 本发明提供了一种微结构器件,其包括多个衬底,其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性,提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者,可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成,例如电接触区域,电接触焊盘和电接触弹簧。

    Micromirror array assembly with in-array pillars
    2.
    发明授权
    Micromirror array assembly with in-array pillars 有权
    具有阵列支柱的微镜阵列组件

    公开(公告)号:US07787170B2

    公开(公告)日:2010-08-31

    申请号:US10869539

    申请日:2004-06-15

    IPC分类号: G02B26/00

    摘要: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

    摘要翻译: 本发明提供了一种微结构器件,其包括多个衬底,其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性,提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者,可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成,例如电接触区域,电接触焊盘和电接触弹簧。

    Micromirror array assembly with in-array pillars
    3.
    发明授权
    Micromirror array assembly with in-array pillars 有权
    具有阵列支柱的微镜阵列组件

    公开(公告)号:US08693082B2

    公开(公告)日:2014-04-08

    申请号:US12853411

    申请日:2010-08-10

    IPC分类号: G02B26/00 G02B26/08

    摘要: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

    摘要翻译: 本发明提供了一种微结构器件,其包括多个衬底,其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性,提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者,可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成,例如电接触区域,电接触焊盘和电接触弹簧。

    Micromirror Array Assembly with In-Array Pillars
    4.
    发明申请
    Micromirror Array Assembly with In-Array Pillars 有权
    具有阵列支柱的微镜阵列组件

    公开(公告)号:US20100302618A1

    公开(公告)日:2010-12-02

    申请号:US12853411

    申请日:2010-08-10

    IPC分类号: G02B26/00 B32B37/14 B05D5/06

    摘要: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

    摘要翻译: 本发明提供了一种微结构器件,其包括多个衬底,其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性,提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者,可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成,例如电接触区域,电接触焊盘和电接触弹簧。