公开(公告)号：US08767351B1

公开(公告)日：2014-07-01

申请号：US13755175

申请日：2013-01-31

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Saravuth Keo ,  Kara L. Maytag ,  Pramit P. Parikh ,  Jeff R. O'Konski ,  Mark A. Herendeen ,  Joel W. Hoehn ,  Roger L. Hipwell ,  Joe J. Schobel ,  John L. Ibele ,  Ralph Marquart ,  Edward Knutson

IPC: G11B5/48

CPC classification number: G11B5/102 ,  G11B5/3169 ,  G11B5/3173 ,  G11B5/4826 ,  G11B2005/0021 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48644 ,  H01L2224/85012 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/12042 ,  H01L2924/20751 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20309 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Abstract translation: 目前公开的技术描述了使用超过千分之一英寸直径的金线使用超声波接合能量并且不加热下面的焊盘来获得球接合的系统和方法。 球接合允许使用特别接近相邻微电子结构的特别小的接合焊盘，其限制了具有浅起飞角的其它接合技术的使用。