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公开(公告)号：US20110259568A1
公开(公告)日：2011-10-27
申请号：US13016726
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： C09K5/14
摘要： A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tanδ obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more.
摘要翻译： 一种含有板状氮化硼颗粒的导热片，其中与导热片的厚度方向垂直的方向的热导率为4W / m·K以上，玻璃化转变点为峰值 通过以10Hz的频率测量导热片的动态粘弹性得到的tanδ为125℃以上。
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公开(公告)号：US20110259564A1
公开(公告)日：2011-10-27
申请号：US13016424
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： C08L23/06 , B32B37/10 , B32B2307/202 , B32B2457/00 , B32B2457/20 , C08K3/38 , C08K7/00 , C08L63/00 , C08L101/12 , H01L2924/0002 , H01L2924/00
摘要： A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more.
摘要翻译： 导热片包含板状氮化硼颗粒，其中与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。 根据JIS C 2110（2010）测量的导热片的击穿电压为10kV / mm以上。
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公开(公告)号：US20110267557A1
公开(公告)日：2011-11-03
申请号：US13017442
申请日：2011-01-31
IPC分类号： G02F1/13357 , F21V7/22
CPC分类号： G02F1/1336 , G02F2001/133628
摘要： A back light includes an irradiating portion for applying light to a liquid crystal panel and a heat diffusing member which is in contact with the irradiating portion. The heat diffusing member is made of a thermal conductive sheet containing a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 背光包括用于向液晶面板施加光的照射部和与照射部接触的散热构件。 散热构件由含有板状氮化硼颗粒的导热片形成，并且与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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公开(公告)号：US20110259566A1
公开(公告)日：2011-10-27
申请号：US13016507
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： C09K5/14
摘要： A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test (1) below:Initial adhesion test (1):The thermal conductive sheet is temporarily fixed on an adherend along the horizontal direction, and thereafter the adherend is turned over to be upside down. The maximum cutting resistance on the cutting blade at the time of cutting the thermal conductive sheet is 120 N/30 mm or less.
摘要翻译： 导热片包含板状氮化硼颗粒。 导热片的导热性在与导热片的厚度方向垂直的方向上为4W / m·K以上。 初次粘合试验（1）中，导热片不从被粘物脱落。初次粘合试验（1）：导热片沿水平方向临时固定在被粘物上，然后将被粘物翻转 被颠倒 在切割导热片时切割刀片上的最大切割阻力为120N / 30mm以下。
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5.发明申请公开(公告)号：US20110262728A1
公开(公告)日：2011-10-27
申请号：US13016685
申请日：2011-01-28
CPC分类号： H01L33/641 , C08K3/38 , C08K7/00 , C08K2003/382 , C08L23/06 , C08L63/00 , C09J7/22 , C09J2205/106 , H01L2224/48091 , Y10T428/25 , H01L2924/00014
摘要： A thermal conductive sheet contains a plate-like boron nitride particle, has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and has a volume resistivity of 1×1010 Ω·cm or more. The transmittance of light at a wavelength of 500 nm is 10% or less. The surface reflectance R of light at 500 nm is 70% or more relative to the surface reflectance of barium sulfate as 100%. A light-emitting diode mounting substrate includes a substrate for mounting a light-emitting diode; and a thermal conductive light reflection layer being formed on the surface of the substrate and including the above-described thermal conductive sheet. A thermal conductive adhesive sheet includes a thermal conductive layer including the above-described thermal conductive sheet, and an adhesive layer or a pressure-sensitive adhesive layer laminated on at least one side of the thermal conductive layer.
摘要翻译： 热传导片包含板状氮化硼颗粒，在与导热片的厚度方向垂直的方向上的导热率为4W / m·K以上，体积电阻率为1×1010Ω·OHgr ;·cm以上。 波长500nm的光的透射率为10％以下。 500nm处的光的表面反射率R相对于100％的硫酸钡的表面反射率为70％以上。 发光二极管安装基板包括用于安装发光二极管的基板; 以及形成在所述基板的表面上并且包括所述导热片的导热光反射层。 导热性粘合片包括包含上述导热片的导热层和层压在导热层的至少一侧上的粘合层或粘合剂层。
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公开(公告)号：US20110259567A1
公开(公告)日：2011-10-27
申请号：US13016549
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： C09K5/14
摘要： A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.
摘要翻译： 导热片包括板状氮化硼颗粒。 导热片在与导热片的厚度方向垂直的方向上的热导率为4W / m·K以上，5％的重量损失温度为250℃以上。 导热片的吸水率为3体积％以下。
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公开(公告)号：US20110259565A1
公开(公告)日：2011-10-27
申请号：US13016467
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： H01L23/3737 , C08K3/38 , C09J9/02 , C09J11/04 , H01L2924/0002 , H01L2924/09701 , H05K7/20454 , H05K7/20481 , H01L2924/00
摘要： A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member.
摘要翻译： 散热结构包括：基板，安装在基板上的电子部件，用于散发从电子部件产生的热的散热部件;以及设置在该基板上以覆盖该电子部件的导热性粘接片。 导热性粘合片包括含有板状氮化硼粒子的导热层。 导热层的导热性与导热层的厚度方向垂直的方向为4W / m·K以上，导热性粘接片与散热部件接触。
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公开(公告)号：US20110260185A1
公开(公告)日：2011-10-27
申请号：US13016594
申请日：2011-01-28
IPC分类号： H01L33/64
CPC分类号： H01L33/642 , F21Y2115/10 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 发光二极管装置包括发光二极管，用于向发光二极管供电的电源电路部分和用于耗散由发光二极管产生的热量的散热构件。 散热构件由含有板状氮化硼颗粒的导热片构成。 与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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公开(公告)号：US20110259569A1
公开(公告)日：2011-10-27
申请号：US13016822
申请日：2011-01-28
IPC分类号： F28F7/00
CPC分类号： C09K5/14 , H01L2924/0002 , H01L2924/00
摘要： A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 导热片包含板状氮化硼颗粒。 氮化硼粒子的比例为35体积％以上，与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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公开(公告)号：US20110261535A1
公开(公告)日：2011-10-27
申请号：US13016521
申请日：2011-01-28
申请人： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA
发明人： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA
IPC分类号： H05K7/20
CPC分类号： H01L23/3737 , H01L23/36 , H01L24/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/73265 , H01L2924/10253 , H01L2924/1301 , Y10T428/24917 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
摘要翻译： 功率模块包括功率模块板，其包括形成在绝缘层上的绝缘层和导电电路，设置在电源模块板上并电连接到导电电路的功率器件，以及用于耗散由 电源模块板和/或电源设备。 导热片包含板状氮化硼颗粒，并且在与导热片的厚度方向垂直的方向上的导热率为4W / m·K以上。
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