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公开(公告)号：US08547465B2
公开(公告)日：2013-10-01
申请号：US13016616
申请日：2011-01-28
Applicant: Seiji Izutani , Hisae Uchiyama , Takahiro Fukuoka , Kazutaka Hara
Inventor： Seiji Izutani , Hisae Uchiyama , Takahiro Fukuoka , Kazutaka Hara
IPC: H04N5/335
CPC classification number: H01L27/14618 , H01L27/1464 , H01L2924/0002 , H04N5/2257 , H04N5/374 , H01L2924/00
Abstract: An imaging device module includes an imaging device including a light incident plane on which light is incident, and a reverse face disposed on an opposite side of the light incident plane; and a thermal conductive sheet provided on the reverse face for dissipating heat generated from the imaging device.The thermal conductive sheet contains a plate-like boron nitride particle, and the thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of 4 W/m·K or more.
Abstract translation: 一种成像装置模块包括：成像装置，包括入射光的光入射平面和设置在所述光入射平面相对侧的反面; 以及设置在反面上的散热从成像装置产生的热量的导热片。 导热片包含板状氮化硼颗粒，并且导热片在与厚度方向垂直的方向上的热导率为4W / m·K以上。
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公开(公告)号：US20110259568A1
公开(公告)日：2011-10-27
申请号：US13016726
申请日：2011-01-28
Applicant: Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA , Hitotsugu HIRANO
Inventor： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA , Hitotsugu HIRANO
IPC: F28F7/00
CPC classification number: C09K5/14
Abstract: A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tanδ obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more.
Abstract translation: 一种含有板状氮化硼颗粒的导热片，其中与导热片的厚度方向垂直的方向的热导率为4W / m·K以上，玻璃化转变点为峰值 通过以10Hz的频率测量导热片的动态粘弹性得到的tanδ为125℃以上。
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公开(公告)号：US20110259564A1
公开(公告)日：2011-10-27
申请号：US13016424
申请日：2011-01-28
Applicant: Seiji IZUTANI , Hisae Uchiyama , Takahiro Fukuoka , Kazutaka Hara , Hitotsugu Hirano
Inventor： Seiji IZUTANI , Hisae Uchiyama , Takahiro Fukuoka , Kazutaka Hara , Hitotsugu Hirano
IPC: F28F7/00
CPC classification number: C08L23/06 , B32B37/10 , B32B2307/202 , B32B2457/00 , B32B2457/20 , C08K3/38 , C08K7/00 , C08L63/00 , C08L101/12 , H01L2924/0002 , H01L2924/00
Abstract: A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more.
Abstract translation: 导热片包含板状氮化硼颗粒，其中与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。 根据JIS C 2110（2010）测量的导热片的击穿电压为10kV / mm以上。
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公开(公告)号：US20110129677A1
公开(公告)日：2011-06-02
申请号：US12737643
申请日：2009-10-29
Applicant: Takahiro Fukuoka , Seiji Izutani , Hisae Uchiyama , Saori Fukuzaki , Tadafumi Adschiri
Inventor： Takahiro Fukuoka , Seiji Izutani , Hisae Uchiyama , Saori Fukuzaki , Tadafumi Adschiri
CPC classification number: H01L23/293 , C08G59/42 , C08L33/04 , C08L63/00 , C08L79/08 , H01L2924/0002 , Y10T428/31511 , C08L2666/22 , C08L2666/04 , C08L2666/20 , H01L2924/00
Abstract: A first resin, a curable precursor of a second resin that differs from the first resin, an inorganic material and a solvent are blended and a mixed solution is prepared. Next, by heating the mixed solution, the solvent is removed and the curable precursor is cured, and an organic-inorganic composite is obtained that comprises a composite resin having a co-continuous phase-separated structure formed from a three-dimensionally continuous first phase made of the first resin and a three-dimensionally continuous second phase made of the second resin, and an inorganic material that is localized at the interface between the first phase and the second phase.
Abstract translation: 混合第一树脂，与第一树脂不同的第二树脂的可固化前体，无机材料和溶剂，并制备混合溶液。 接下来，通过加热混合溶液，除去溶剂并固化可固化前体，得到含有由三维连续的第一相形成的共连续相分离结构的复合树脂的有机 - 无机复合体 由第一树脂制成，和由第二树脂制成的三维连续的第二相，以及定位在第一相和第二相之间的界面处的无机材料。
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公开(公告)号：US20110261242A1
公开(公告)日：2011-10-27
申请号：US13016616
申请日：2011-01-28
Applicant: Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA
Inventor： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA
IPC: H04N5/335
CPC classification number: H01L27/14618 , H01L27/1464 , H01L2924/0002 , H04N5/2257 , H04N5/374 , H01L2924/00
Abstract: An imaging device module includes an imaging device including a light incident plane on which light is incident, and a reverse face disposed on an opposite side of the light incident plane; and a thermal conductive sheet provided on the reverse face for dissipating heat generated from the imaging device.The thermal conductive sheet contains a plate-like boron nitride particle, and the thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of 4 W/m·K or more.
Abstract translation: 一种成像装置模块包括：成像装置，包括入射光的光入射平面和设置在所述光入射平面相对侧的反面; 以及设置在反面上的散热从成像装置产生的热量的导热片。 导热片包含板状氮化硼颗粒，并且导热片在与厚度方向垂直的方向上的热导率为4W / m·K以上。
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Patent Agency Ranking
公开(公告)号：US20110259567A1
公开(公告)日：2011-10-27
申请号：US13016549
申请日：2011-01-28
Applicant: Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA , Hitotsugu HIRANO
Inventor： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA , Hitotsugu HIRANO
IPC: F28F7/00
CPC classification number: C09K5/14
Abstract: A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.
Abstract translation: 导热片包括板状氮化硼颗粒。 导热片在与导热片的厚度方向垂直的方向上的热导率为4W / m·K以上，5％的重量损失温度为250℃以上。 导热片的吸水率为3体积％以下。
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公开(公告)号：US20110259565A1
公开(公告)日：2011-10-27
申请号：US13016467
申请日：2011-01-28
Applicant: Seiji IZUTANI , Kazutaka HARA , Takahiro FUKUOKA , Hisae UCHIYAMA , Hitotsugu HIRANO
Inventor： Seiji IZUTANI , Kazutaka HARA , Takahiro FUKUOKA , Hisae UCHIYAMA , Hitotsugu HIRANO
IPC: F28F7/00
CPC classification number: H01L23/3737 , C08K3/38 , C09J9/02 , C09J11/04 , H01L2924/0002 , H01L2924/09701 , H05K7/20454 , H05K7/20481 , H01L2924/00
Abstract: A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member.
Abstract translation: 散热结构包括：基板，安装在基板上的电子部件，用于散发从电子部件产生的热的散热部件;以及设置在该基板上以覆盖该电子部件的导热性粘接片。 导热性粘合片包括含有板状氮化硼粒子的导热层。 导热层的导热性与导热层的厚度方向垂直的方向为4W / m·K以上，导热性粘接片与散热部件接触。
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公开(公告)号：US20110261535A1
公开(公告)日：2011-10-27
申请号：US13016521
申请日：2011-01-28
Applicant: Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA
Inventor： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA
IPC: H05K7/20
CPC classification number: H01L23/3737 , H01L23/36 , H01L24/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/73265 , H01L2924/10253 , H01L2924/1301 , Y10T428/24917 , H01L2924/00014 , H01L2924/00
Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
Abstract translation: 功率模块包括功率模块板，其包括形成在绝缘层上的绝缘层和导电电路，设置在电源模块板上并电连接到导电电路的功率器件，以及用于耗散由 电源模块板和/或电源设备。 导热片包含板状氮化硼颗粒，并且在与导热片的厚度方向垂直的方向上的导热率为4W / m·K以上。
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公开(公告)号：US20110260185A1
公开(公告)日：2011-10-27
申请号：US13016594
申请日：2011-01-28
Applicant: Seiji IZUTANI , Kazutaka HARA , Takahiro FUKUOKA , Hisae UCHIYAMA , Hitotsugu HIRANO
Inventor： Seiji IZUTANI , Kazutaka HARA , Takahiro FUKUOKA , Hisae UCHIYAMA , Hitotsugu HIRANO
IPC: H01L33/64
CPC classification number: H01L33/642 , F21Y2115/10 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
Abstract translation: 发光二极管装置包括发光二极管，用于向发光二极管供电的电源电路部分和用于耗散由发光二极管产生的热量的散热构件。 散热构件由含有板状氮化硼颗粒的导热片构成。 与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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公开(公告)号：US20110259569A1
公开(公告)日：2011-10-27
申请号：US13016822
申请日：2011-01-28
Applicant: Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA , Hitotsugu HIRANO
Inventor： Seiji IZUTANI , Hisae UCHIYAMA , Takahiro FUKUOKA , Kazutaka HARA , Hitotsugu HIRANO
IPC: F28F7/00
CPC classification number: C09K5/14 , H01L2924/0002 , H01L2924/00
Abstract: A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
Abstract translation: 导热片包含板状氮化硼颗粒。 氮化硼粒子的比例为35体积％以上，与导热片的厚度方向垂直的方向的导热率为4W / m·K以上。
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