Vertical GaN-based LED and method of manufacturing the same
    1.
    发明授权
    Vertical GaN-based LED and method of manufacturing the same 有权
    垂直GaN基LED及其制造方法

    公开(公告)号:US07436001B2

    公开(公告)日:2008-10-14

    申请号:US11490254

    申请日:2006-07-21

    IPC分类号: H01L27/15

    CPC分类号: H01L33/22 H01L33/14

    摘要: A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED includes an n-electrode, a first n-type GaN layer, a first AlGaN layer, a GaN layer, a second AlGaN layer, a second n-type GaN layer, an active layer, a p-type GaN layer, and a structure support layer. The first n-type GaN layer has uneven patterns having a plurality of protuberances. The first AlGaN layer is formed under the first n-type GaN layer, and the GaN layer is formed under the first AlGaN layer. The active layer is formed under the second n-type GaN layer, and the p-type GaN layer is formed under the active layer. A p-electrode is formed under the p-type GaN layer, and the structure support layer is formed under the p-electrode.

    摘要翻译: 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED包括n电极,第一n型GaN层,第一AlGaN层,GaN层,第二AlGaN层,第二n型GaN层,有源层,p型 GaN层和结构支撑层。 第一n型GaN层具有具有多个突起的不均匀图案。 第一AlGaN层形成在第一n型GaN层下方,并且GaN层形成在第一AlGaN层的下方。 有源层形成在第二n型GaN层下面,p型GaN层形成在有源层下面。 在p型GaN层的下方形成有p电极,在p电极的下方形成有结构支撑层。

    Nitride semiconductor light emitting device and method of manufacturing the same
    2.
    发明授权
    Nitride semiconductor light emitting device and method of manufacturing the same 有权
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US07012284B2

    公开(公告)日:2006-03-14

    申请号:US10837780

    申请日:2004-05-04

    IPC分类号: H01L33/00

    CPC分类号: H01L33/32 H01L33/025

    摘要: Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises an n-type nitride semiconductor layer on a substrate, an active layer formed on the n-type nitride semiconductor layer so that a portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer formed on the active layer, a high-concentration dopant area on the p-type nitride semiconductor layer, a counter doping area on the high-concentration dopant areas, an n-side electrode formed on an exposed portion of the n-type nitride semiconductor layer, and a p-side electrode formed on the counter doping area. A satisfactory ohmic contact for the p-side electrode is provided by an ion implantation process and heat treatment.

    摘要翻译: 这里公开了一种氮化物半导体发光器件。 氮化物半导体发光器件包括在衬底上的n型氮化物半导体层,形成在n型氮化物半导体层上的有源层,以使n型氮化物半导体层的一部分露出,p型氮化物 形成在有源层上的半导体层,p型氮化物半导体层上的高浓度掺杂剂区域,高浓度掺杂剂区域上的相对掺杂区域,形成在n型氮化物半导体层的暴露部分上的n侧电极 氮化物半导体层和形成在反掺杂区域上的p侧电极。 通过离子注入工艺和热处理提供了用于p侧电极的令人满意的欧姆接触。

    Gallium nitride-based light emitting diode and method of manufacturing the same
    3.
    发明授权
    Gallium nitride-based light emitting diode and method of manufacturing the same 有权
    基于氮化镓的发光二极管及其制造方法

    公开(公告)号:US08012779B2

    公开(公告)日:2011-09-06

    申请号:US11878360

    申请日:2007-07-24

    IPC分类号: H01L21/00 H01L33/00

    CPC分类号: H01L33/02 H01L33/22

    摘要: A vertical GaN-based LED comprises an n-electrode; an n-type GaN layer formed under the n-electrode, the n-type GaN layer having an irregular-surface structure which includes a first irregular-surface structure having irregularities formed at even intervals and a second irregular-surface structure having irregularities formed at uneven intervals, the second irregular-surface structure being formed on the first irregular-surface structure; an active layer formed under the n-type GaN layer; a p-type GaN layer formed under the active layer; a p-electrode formed under the p-type GaN layer; and a structure support layer formed under the p-electrode.

    摘要翻译: 垂直GaN基LED包括n电极; 形成在n电极下面的n型GaN层,所述n型GaN层具有不规则表面结构,所述n型GaN层包括具有以均匀间隔形成的凹凸的第一不规则表面结构和具有不规则形状的第二不规则表面结构 第二不规则表面结构形成在第一不规则表面结构上; 形成在n型GaN层下面的有源层; 形成在有源层下面的p型GaN层; 形成在p型GaN层下面的p电极; 以及在p电极下面形成的结构支撑层。

    Vertical gallium nitride-based light emitting diode and method of manufacturing the same
    4.
    发明授权
    Vertical gallium nitride-based light emitting diode and method of manufacturing the same 有权
    立式氮化镓系发光二极管及其制造方法

    公开(公告)号:US07872276B2

    公开(公告)日:2011-01-18

    申请号:US11742818

    申请日:2007-05-01

    IPC分类号: H01L33/00

    摘要: A method of manufacturing a vertical GaN-based LED comprises forming a light emission structure in which an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer are sequentially laminated on a substrate; etching the light emission structure such that the light emission structure is divided into units of LED; forming a p-electrode on each of the divided light emission structures; filling a non-conductive material between the divided light emission structures; forming a metal seed layer on the resulting structure; forming a first plated layer on the metal seed layer excluding a region between the light emission structures; forming a second plated layer on the metal seed layer between the first plated layers; separating the substrate from the light emission structures; removing the non-conductive material between the light emission structures exposed by separating the substrate; forming an n-electrode on the n-type GaN-based semiconductor layer; and removing portions of the metal seed layer and the second plated layer between the light emission structures.

    摘要翻译: 制造垂直GaN基LED的方法包括:形成其中n型GaN基半导体层,有源层和p型GaN基半导体层依次层压在基板上的发光结构; 蚀刻发光结构,使得发光结构被分为LED单元; 在每个划分的发光结构上形成p电极; 在分开的发光结构之间填充非导电材料; 在所得结构上形成金属种子层; 在所述金属种子层上形成除了所述发光结构之间的区域的第一镀层; 在所述第一镀层之间的所述金属种子层上形成第二镀层; 将衬底与发光结构分离; 去除通过分离衬底而暴露的发光结构之间的非导电材料; 在n型GaN基半导体层上形成n电极; 以及去除所述发光结构之间的所述金属种子层和所述第二镀层的部分。

    METHOD OF MANUFACTURING VERTICAL GALLIUM-NITRIDE BASED LIGHT EMITTING DIODE
    5.
    发明申请
    METHOD OF MANUFACTURING VERTICAL GALLIUM-NITRIDE BASED LIGHT EMITTING DIODE 有权
    立方氮化镓基发光二极管的制造方法

    公开(公告)号:US20090181485A1

    公开(公告)日:2009-07-16

    申请号:US12406540

    申请日:2009-03-18

    IPC分类号: H01L21/20

    CPC分类号: H01L33/14 H01L33/02 H01L33/32

    摘要: A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

    摘要翻译: 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏,从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括:支承层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。

    Method of manufacturing vertical gallium-nitride based light emitting diode
    6.
    发明授权
    Method of manufacturing vertical gallium-nitride based light emitting diode 有权
    制造垂直氮化镓基发光二极管的方法

    公开(公告)号:US07695989B2

    公开(公告)日:2010-04-13

    申请号:US12406540

    申请日:2009-03-18

    IPC分类号: H01L21/00

    CPC分类号: H01L33/14 H01L33/02 H01L33/32

    摘要: A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

    摘要翻译: 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏,从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括:支撑层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。

    Vertical gallium-nitride based light emitting diode
    7.
    发明授权
    Vertical gallium-nitride based light emitting diode 有权
    垂直氮化镓基发光二极管

    公开(公告)号:US07573076B2

    公开(公告)日:2009-08-11

    申请号:US11634112

    申请日:2006-12-06

    IPC分类号: H01L33/00

    CPC分类号: H01L33/14 H01L33/02 H01L33/32

    摘要: A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

    摘要翻译: 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏,从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括:支承层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。

    Semiconductor light emitting diode and method of manufacturing the same
    8.
    发明申请
    Semiconductor light emitting diode and method of manufacturing the same 审中-公开
    半导体发光二极管及其制造方法

    公开(公告)号:US20070267640A1

    公开(公告)日:2007-11-22

    申请号:US11436651

    申请日:2006-05-19

    IPC分类号: H01L33/00

    摘要: The present invention relates to a semiconductor light emitting diode. The semiconductor light emitting diode includes a substrate; an n-type nitride semiconductor layer that is formed on the substrate; an active layer that is formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the active layer; a first undoped GaN layer that is formed on the p-type nitride semiconductor layer; an AlGaN layer that is formed on the first undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the first undoped GaN layer; a second undoped GaN layer that is formed on the AlGaN layer and has irregularities such that the light generated in the active layer is not internally reflected toward the active layer; a p-type transparent electrode that is formed on the second undoped GaN layer; and an n-type electrode and p-type electrode that are formed to be respectively connected onto the n-type nitride semiconductor layer and the p-type transparent electrode.

    摘要翻译: 本发明涉及一种半导体发光二极管。 半导体发光二极管包括基板; 形成在所述基板上的n型氮化物半导体层; 形成在n型氮化物半导体层上的有源层; 形成在有源层上的p型氮化物半导体层; 在p型氮化物半导体层上形成的第一未掺杂GaN层; AlGaN层,形成在第一未掺杂的GaN层上,以便向与第一未掺杂GaN层的界面提供二维电子气层; 第二未掺杂的GaN层,其形成在AlGaN层上并且具有凹凸,使得在有源层中产生的光不向有源层内部反射; 形成在第二未掺杂GaN层上的p型透明电极; 以及形成为分别连接在n型氮化物半导体层和p型透明电极上的n型电极和p型电极。

    LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS
    9.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS 有权
    发光装置和发光装置

    公开(公告)号:US20120299038A1

    公开(公告)日:2012-11-29

    申请号:US13293858

    申请日:2011-11-10

    IPC分类号: H01L33/36

    摘要: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.

    摘要翻译: 可以提供一种发光器件,其包括衬底,发光结构,第一半导体层下的第一电极,第二导电半导体层下的反射电极层,反射电极层下的第二电极和支撑构件 在第一半导体层和第一和第二电极周围的反射电极层之下。 可以在第一电极下方设置第一连接电极。 第一连接电极的至少一部分设置在支撑构件中。 第二连接电极可以设置在第二电极下方第二连接电极的至少一部分可以设置在支撑构件中。