公开(公告)号：US07012284B2

公开(公告)日：2006-03-14

申请号：US10837780

申请日：2004-05-04

申请人： Seok Beom Choi ,  Bang Won Oh ,  Hee Seok Choi

发明人： Seok Beom Choi ,  Bang Won Oh ,  Hee Seok Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/32 ,  H01L33/025

摘要： Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises an n-type nitride semiconductor layer on a substrate, an active layer formed on the n-type nitride semiconductor layer so that a portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer formed on the active layer, a high-concentration dopant area on the p-type nitride semiconductor layer, a counter doping area on the high-concentration dopant areas, an n-side electrode formed on an exposed portion of the n-type nitride semiconductor layer, and a p-side electrode formed on the counter doping area. A satisfactory ohmic contact for the p-side electrode is provided by an ion implantation process and heat treatment.

摘要翻译： 这里公开了一种氮化物半导体发光器件。 氮化物半导体发光器件包括在衬底上的n型氮化物半导体层，形成在n型氮化物半导体层上的有源层，以使n型氮化物半导体层的一部分露出，p型氮化物 形成在有源层上的半导体层，p型氮化物半导体层上的高浓度掺杂剂区域，高浓度掺杂剂区域上的相对掺杂区域，形成在n型氮化物半导体层的暴露部分上的n侧电极 氮化物半导体层和形成在反掺杂区域上的p侧电极。 通过离子注入工艺和热处理提供了用于p侧电极的令人满意的欧姆接触。

公开(公告)号：US07436001B2

公开(公告)日：2008-10-14

申请号：US11490254

申请日：2006-07-21

申请人： Jae Hoon Lee ,  Bang Won Oh ,  Hee Seok Choi ,  Jeong Tak Oh ,  Seok Beom Choi ,  Su Yeol Lee

发明人： Jae Hoon Lee ,  Bang Won Oh ,  Hee Seok Choi ,  Jeong Tak Oh ,  Seok Beom Choi ,  Su Yeol Lee

IPC分类号： H01L27/15

CPC分类号： H01L33/22 ,  H01L33/14

摘要： A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED includes an n-electrode, a first n-type GaN layer, a first AlGaN layer, a GaN layer, a second AlGaN layer, a second n-type GaN layer, an active layer, a p-type GaN layer, and a structure support layer. The first n-type GaN layer has uneven patterns having a plurality of protuberances. The first AlGaN layer is formed under the first n-type GaN layer, and the GaN layer is formed under the first AlGaN layer. The active layer is formed under the second n-type GaN layer, and the p-type GaN layer is formed under the active layer. A p-electrode is formed under the p-type GaN layer, and the structure support layer is formed under the p-electrode.

摘要翻译： 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED包括n电极，第一n型GaN层，第一AlGaN层，GaN层，第二AlGaN层，第二n型GaN层，有源层，p型 GaN层和结构支撑层。 第一n型GaN层具有具有多个突起的不均匀图案。 第一AlGaN层形成在第一n型GaN层下方，并且GaN层形成在第一AlGaN层的下方。 有源层形成在第二n型GaN层下面，p型GaN层形成在有源层下面。 在p型GaN层的下方形成有p电极，在p电极的下方形成有结构支撑层。

公开(公告)号：US07695989B2

公开(公告)日：2010-04-13

申请号：US12406540

申请日：2009-03-18

申请人： Doo Go Baik ,  Bang Won Oh ,  Seok Beom Choi ,  Su Yeol Lee

发明人： Doo Go Baik ,  Bang Won Oh ,  Seok Beom Choi ,  Su Yeol Lee

IPC分类号： H01L21/00

CPC分类号： H01L33/14 ,  H01L33/02 ,  H01L33/32

摘要： A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

摘要翻译： 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏，从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括：支撑层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。

公开(公告)号：US07573076B2

公开(公告)日：2009-08-11

申请号：US11634112

申请日：2006-12-06

申请人： Doo Go Baik ,  Bang Won Oh ,  Seok Beom Choi ,  Su Yeol Lee

发明人： Doo Go Baik ,  Bang Won Oh ,  Seok Beom Choi ,  Su Yeol Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/14 ,  H01L33/02 ,  H01L33/32

摘要： A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

摘要翻译： 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏，从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括：支承层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。

公开(公告)号：US08012779B2

公开(公告)日：2011-09-06

申请号：US11878360

申请日：2007-07-24

申请人： Seok Beom Choi ,  Bang Won Oh ,  Jong Gun Woo ,  Doo Go Baik

发明人： Seok Beom Choi ,  Bang Won Oh ,  Jong Gun Woo ,  Doo Go Baik

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/02 ,  H01L33/22

摘要： A vertical GaN-based LED comprises an n-electrode; an n-type GaN layer formed under the n-electrode, the n-type GaN layer having an irregular-surface structure which includes a first irregular-surface structure having irregularities formed at even intervals and a second irregular-surface structure having irregularities formed at uneven intervals, the second irregular-surface structure being formed on the first irregular-surface structure; an active layer formed under the n-type GaN layer; a p-type GaN layer formed under the active layer; a p-electrode formed under the p-type GaN layer; and a structure support layer formed under the p-electrode.

摘要翻译： 垂直GaN基LED包括n电极; 形成在n电极下面的n型GaN层，所述n型GaN层具有不规则表面结构，所述n型GaN层包括具有以均匀间隔形成的凹凸的第一不规则表面结构和具有不规则形状的第二不规则表面结构 第二不规则表面结构形成在第一不规则表面结构上; 形成在n型GaN层下面的有源层; 形成在有源层下面的p型GaN层; 形成在p型GaN层下面的p电极; 以及在p电极下面形成的结构支撑层。

公开(公告)号：US07872276B2

公开(公告)日：2011-01-18

申请号：US11742818

申请日：2007-05-01

申请人： Su Yeol Lee ,  Bang Won Oh ,  Doo Go Baik ,  Tae Sung Jang ,  Jong Gun Woo ,  Seok Beom Choi ,  Sang Ho Yoon ,  Dong Woo Kim ,  In Tae Yeo

发明人： Su Yeol Lee ,  Bang Won Oh ,  Doo Go Baik ,  Tae Sung Jang ,  Jong Gun Woo ,  Seok Beom Choi ,  Sang Ho Yoon ,  Dong Woo Kim ,  In Tae Yeo

IPC分类号： H01L33/00

CPC分类号： H01L33/387 ,  H01L33/20 ,  H01L33/22 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a vertical GaN-based LED comprises forming a light emission structure in which an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer are sequentially laminated on a substrate; etching the light emission structure such that the light emission structure is divided into units of LED; forming a p-electrode on each of the divided light emission structures; filling a non-conductive material between the divided light emission structures; forming a metal seed layer on the resulting structure; forming a first plated layer on the metal seed layer excluding a region between the light emission structures; forming a second plated layer on the metal seed layer between the first plated layers; separating the substrate from the light emission structures; removing the non-conductive material between the light emission structures exposed by separating the substrate; forming an n-electrode on the n-type GaN-based semiconductor layer; and removing portions of the metal seed layer and the second plated layer between the light emission structures.

摘要翻译： 制造垂直GaN基LED的方法包括：形成其中n型GaN基半导体层，有源层和p型GaN基半导体层依次层压在基板上的发光结构; 蚀刻发光结构，使得发光结构被分为LED单元; 在每个划分的发光结构上形成p电极; 在分开的发光结构之间填充非导电材料; 在所得结构上形成金属种子层; 在所述金属种子层上形成除了所述发光结构之间的区域的第一镀层; 在所述第一镀层之间的所述金属种子层上形成第二镀层; 将衬底与发光结构分离; 去除通过分离衬底而暴露的发光结构之间的非导电材料; 在n型GaN基半导体层上形成n电极; 以及去除所述发光结构之间的所述金属种子层和所述第二镀层的部分。

公开(公告)号：US20090181485A1

公开(公告)日：2009-07-16

申请号：US12406540

申请日：2009-03-18

申请人： Doo Go BAIK ,  Bang Won Oh ,  Seok Beom Choi ,  Su Yeo Lee

发明人： Doo Go BAIK ,  Bang Won Oh ,  Seok Beom Choi ,  Su Yeo Lee

IPC分类号： H01L21/20

CPC分类号： H01L33/14 ,  H01L33/02 ,  H01L33/32

摘要： A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

摘要翻译： 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏，从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括：支承层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。

公开(公告)号：US07906785B2

公开(公告)日：2011-03-15

申请号：US11585212

申请日：2006-10-24

申请人： Doo Go Baik ,  Bang Won Oh ,  Tae Jun Kim

发明人： Doo Go Baik ,  Bang Won Oh ,  Tae Jun Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/145 ,  H01L33/0033 ,  H01L33/32

摘要： A vertical nitride semiconductor light emitting device and a manufacturing method thereof are provided. In the device, an ohmic contact layer, a p-type nitride semiconductor layer, an active layer, an n-type nitride semiconductor layer and an n-electrode are sequentially formed on a conductive substrate. At least one of a surface of the p-type nitride semiconductor layer contacting the ohmic contact layer and a surface of the n-type nitride layer contacting the n-electrode has a high resistance area of damaged nitride single crystal in a substantially central portion thereof. The high resistance area has a Schottky junction with at least one of the ohmic contact layer and the n-electrode.

摘要翻译： 提供了一种垂直氮化物半导体发光器件及其制造方法。 在该器件中，在导电性基板上依次形成欧姆接触层，p型氮化物半导体层，有源层，n型氮化物半导体层和n电极。 接触欧姆接触层的p型氮化物半导体层的表面和与n电极接触的n型氮化物层的表面中的至少一个在其基本中心部分具有高的受损氮化物单晶的电阻面积 。 高电阻区域具有与欧姆接触层和n电极中的至少一个的肖特基结。

公开(公告)号：US07078256B2

公开(公告)日：2006-07-18

申请号：US10875321

申请日：2004-06-25

申请人： Yung Ho Ryu ,  Kee Jeong Yang ,  Bang Won Oh ,  Jin Sub Park ,  Young Hoon Kim

发明人： Yung Ho Ryu ,  Kee Jeong Yang ,  Bang Won Oh ,  Jin Sub Park ,  Young Hoon Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/007

摘要： A nitride semiconductor LED improved in lighting efficiency and a fabrication method thereof, in which an n-doped semiconductor layer is formed on a substrate. An active layer is formed on the n-doped semiconductor layer to expose at least a partial area of the n-doped semiconductor layer. A p-doped semiconductor layer is formed on the active layer. A p+-doped semiconductor layer is formed on the p-doped semiconductor layer. An n+-doped semiconductor layer is formed in at least a partial upper region of the p+-doped semiconductor layer via n-dopant ion implantation. The n+-doped semiconductor layer cooperates with an underlying partial region of the p+-doped semiconductor layer to realize a reverse bias tunneling junction. Also, an upper n-doped semiconductor layer is formed on the n+-doped semiconductor layer to realize lateral current spreading. The invention can improve lighting efficiency by using the reverse bias tunneling junction and/or the lateral current spreading.

公开(公告)号：US06703677B2

公开(公告)日：2004-03-09

申请号：US10231029

申请日：2002-08-30

申请人： Kyung Ho Lee ,  Jeong Ho Yoon ,  Bang Won Oh ,  Si Young Yang ,  Jong Hwa Lee

发明人： Kyung Ho Lee ,  Jeong Ho Yoon ,  Bang Won Oh ,  Si Young Yang ,  Jong Hwa Lee

IPC分类号： H01L2714

CPC分类号： H01S5/02212 ,  H01S5/02248 ,  H01S5/02272 ,  Y10S257/918

摘要： Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.

摘要翻译： 公开了一种具有改进的金属层配置和使用其的激光二极管封装的基座集成光电二极管封装。 特别地，本发明的单一激光二极管提供了覆盖半导体衬底的光接收区域，以对应于从激光二极管发射的光的辐射面积，以便相对于常规光源减小芯片尺寸，同时保持监视电流相同 以及改善散热特征。 本发明提供了一种单一的激光二极管封装，其包括覆盖半导体衬底并具有与来自激光二极管的发射光的辐射面积和与光接收区域相邻的金属层的相同配置的光接收区域。