利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.023 秒)

    Printed circuit board with embedded capacitors therein, and process for manufacturing the same
    1.
    发明授权
    Printed circuit board with embedded capacitors therein, and process for manufacturing the same 有权
    具有嵌入式电容器的印刷电路板及其制造方法

    公开(公告)号：US07092237B2

    公开(公告)日：2006-08-15

    申请号：US11117315

    申请日：2005-04-29

    申请人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    发明人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    IPC分类号： H01G4/06 ,  H01G4/005

    CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photo resist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

    摘要翻译： 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR的铜箔 -4形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。

    Printed circuit board with embedded capacitors therein, and process for manufacturing the same
    6.
    发明授权
    Printed circuit board with embedded capacitors therein, and process for manufacturing the same 失效
    具有嵌入式电容器的印刷电路板及其制造方法

    公开(公告)号：US06910266B2

    公开(公告)日：2005-06-28

    申请号：US10609618

    申请日：2003-07-01

    申请人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    发明人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    IPC分类号： H05K3/46 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  H05K3/30

    CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photoresist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

    摘要翻译： 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR- 4以形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。