公开(公告)号：US06573590B1

公开(公告)日：2003-06-03

申请号：US10074721

申请日：2002-02-11

申请人： Sergiu Radu ,  John E. Will ,  Steven Boyle ,  David Hockanson

发明人： Sergiu Radu ,  John E. Will ,  Steven Boyle ,  David Hockanson

IPC分类号： H01L23552

CPC分类号： H01L23/49838 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/552 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3011

摘要： An integrated circuit package comprising EMI containment features. The EMI containment features include a first EMI containment configuration and a second EMI containment configuration. The second EMI containment configuration is disposed around the first EMI containment configuration. The first and second EMI containment configurations include vias coupled to at least one ground plane of the integrated circuit package.

摘要翻译： 一种集成电路封装，包括EMI抑制特征。 EMI抑制特征包括第一EMI容纳配置和第二EMI容纳配置。 第二EMI容纳构造设置在第一EMI容纳构造周围。 第一和第二EMI容纳配置包括耦合到集成电路封装的至少一个接地平面的通孔。

公开(公告)号：US06956285B2

公开(公告)日：2005-10-18

申请号：US10345015

申请日：2003-01-15

申请人： Sergiu Radu ,  Bidyut K. Sen ,  David Hockanson ,  John E. Will

发明人： Sergiu Radu ,  Bidyut K. Sen ,  David Hockanson ,  John E. Will

IPC分类号： H01L23/552 ,  H01L23/48 ,  H01L23/06 ,  H01L23/12 ,  H01L23/52

CPC分类号： H01L23/552 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.

摘要翻译： 集成电路封装包括EMI抑制特征。 EMI容纳特征可以包括集成电路封装的衬底上的多个引脚。 引脚可以是引脚阵列中的外围引脚排。 引脚可以将封装的盖子耦合到电路板的至少一个接地平面。

公开(公告)号：US08514549B2

公开(公告)日：2013-08-20

申请号：US13048738

申请日：2011-03-15

申请人： David Hockanson ,  Istvan Novak ,  Leesa Noujeim

发明人： David Hockanson ,  Istvan Novak ,  Leesa Noujeim

IPC分类号： H01G4/228

CPC分类号： H05K1/0231 ,  H01G4/228 ,  H01G4/35 ,  H01L23/642 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19103 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10719 ,  Y10T29/49117 ,  H01L2224/0401

摘要： A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

摘要翻译： 公开了一种用于连接电子设备和电路板的稳定功率，低电磁干扰（EMI）装置和方法。 该装置包括电容器，其包括主体构件，一组电源端子和连接到主体构件的顶部的一组接地端子。 电源端子组和接地端子组彼此交替。 作为该结构的结果，实现了PCB侧的高电感。 电容器还包括连接到本体构件的底部并且包括主体构件内的金属平面的一组端子。 金属平面定位成将一组电源端子或一组接地端子电连接到该组端子。

公开(公告)号：US20070188997A1

公开(公告)日：2007-08-16

申请号：US11353897

申请日：2006-02-14

申请人： David Hockanson ,  Rodney Slone

发明人： David Hockanson ,  Rodney Slone

IPC分类号： H05K7/00 ,  H05K7/20 ,  H01L21/00 ,  H05K1/14

CPC分类号： H05K1/0262 ,  G06F1/182 ,  G06F1/189 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/10253 ,  H05K1/0263 ,  H05K1/112 ,  H05K1/181 ,  H05K2201/10734 ,  H01L2924/00

摘要： An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

摘要翻译： 集成电路器件和印刷电路板之间的互连系统可以包括集成电路器件和印刷电路板的电源子系统之间的滤波器。 滤波器可以是低通滤波器，其在较低频率范围内减少电流，而不会在较低频率范围内对电流进行负调整，并可减少集成电路运行期间产生的辐射发射。 滤波器可以通过将第一或第二电平互连处的核心电源电压导体和接地导体布置成一个或多个电压组和一个或多个相邻的接地组来实现，使得串联电感增加。 在一些实施例中，第一级互连可以包括集成电路和衬底之间的导电凸块或焊盘。 在一些实施例中，第二级互连可以包括焊球，引脚，焊盘或封装，插座或插入件的其它导体。

公开(公告)号：US20110164392A1

公开(公告)日：2011-07-07

申请号：US13048738

申请日：2011-03-15

申请人： David Hockanson ,  Istvan Novak ,  Leesa Noujeim

发明人： David Hockanson ,  Istvan Novak ,  Leesa Noujeim

IPC分类号： H05K7/02 ,  H01G4/06 ,  H05K1/18 ,  H05K13/04

CPC分类号： H05K1/0231 ,  H01G4/228 ,  H01G4/35 ,  H01L23/642 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19103 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10719 ,  Y10T29/49117 ,  H01L2224/0401

摘要： A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

摘要翻译： 公开了一种用于连接电子设备和电路板的稳定功率，低电磁干扰（EMI）装置和方法。 该装置包括电容器，其包括主体构件，一组电源端子和连接到主体构件的顶部的一组接地端子。 电源端子组和接地端子组彼此交替。 作为该结构的结果，实现了PCB侧的高电感。 电容器还包括连接到本体构件的底部并且包括主体构件内的金属平面的一组端子。 金属平面定位成将一组电源端子或一组接地端子电连接到该组端子。

公开(公告)号：US07969712B2

公开(公告)日：2011-06-28

申请号：US11737484

申请日：2007-04-19

申请人： Leesa Noujeim ,  David Hockanson ,  Istvan Novak

发明人： Leesa Noujeim ,  David Hockanson ,  Istvan Novak

IPC分类号： H01G4/228

CPC分类号： H05K1/0231 ,  H01G4/228 ,  H01G4/35 ,  H01L23/642 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19103 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10719 ,  Y10T29/49117 ,  H01L2224/0401

摘要： A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

摘要翻译： 公开了一种用于连接电子设备和电路板的稳定功率，低电磁干扰（EMI）装置和方法。 该装置包括电容器，其包括主体构件，一组电源端子和连接到主体构件的顶部的一组接地端子。 电源端子组和接地端子组彼此交替。 作为该结构的结果，实现了PCB侧的高电感。 电容器还包括连接到本体构件的底部并且包括主体构件内的金属平面的一组端子。 金属平面定位成将一组电源端子或一组接地端子电连接到该组端子。

公开(公告)号：US20080259521A1

公开(公告)日：2008-10-23

申请号：US11737484

申请日：2007-04-19

申请人： David Hockanson ,  Istvan Novak ,  Leesa Noujeim

发明人： David Hockanson ,  Istvan Novak ,  Leesa Noujeim

IPC分类号： H01G4/00

CPC分类号： H05K1/0231 ,  H01G4/228 ,  H01G4/35 ,  H01L23/642 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19103 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10719 ,  Y10T29/49117 ,  H01L2224/0401

摘要： A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

摘要翻译： 公开了一种用于连接电子设备和电路板的稳定功率，低电磁干扰（EMI）装置和方法。 该装置包括电容器，其包括主体构件，一组电源端子和连接到主体构件的顶部的一组接地端子。 电源端子组和接地端子组彼此交替。 作为该结构的结果，实现了PCB侧的高电感。 电容器还包括连接到本体构件的底部并且包括主体构件内的金属平面的一组端子。 金属平面定位成将一组电源端子或一组接地端子电连接到该组端子。

公开(公告)号：US06850878B2

公开(公告)日：2005-02-01

申请号：US09841912

申请日：2001-04-24

申请人： Larry D. Smith ,  David Hockanson

发明人： Larry D. Smith ,  David Hockanson

IPC分类号： G06F17/50 ,  H01P5/12 ,  G06F17/10

CPC分类号： G06F17/5036

摘要： A system and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor model. In one embodiment, a method for determining the decoupling capacitors for a power distribution system includes creating a model of the power distribution system using circuit simulation software, such as SPICE. The power distribution system model includes a plurality of cells interconnected at predetermined nodes. The method then selects one or more decoupling capacitors for the power distribution system. The decoupling capacitors are represented in the power distribution system model by a capacitor model, which is a mathematical model of an electrical circuit. The electrical circuit upon which the capacitor model is based is a ladder circuit. Following the selecting of the decoupling capacitors, the power distribution system model is update based on the selections, and operation of the power distribution system is then simulated. During the simulation, transfer impedance values are determined for each of the nodes, and compared to target impedance. The method is then repeated until each of the transfer impedance values is at or below the target impedance.

摘要翻译： 一种用于使用改进的电容器模型确定配电系统所需的去耦电容器的系统和方法。 在一个实施例中，用于确定配电系统的去耦电容器的方法包括使用诸如SPICE之类的电路仿真软件来创建配电系统的模型。 配电系统模型包括在预定节点处互连的多个小区。 该方法然后为配电系统选择一个或多个去耦电容器。 解耦电容器在电力分配系统模型中由电容器模型表示，电容器模型是电路的数学模型。 电容器型号所基于的电路是梯形电路。 在选择去耦电容器之后，根据选择更新配电系统模型，然后模拟配电系统的运行。 在模拟期间，为每个节点确定传输阻抗值，并与目标阻抗进行比较。 然后重复该方法，直到每个传输阻抗值处于或低于目标阻抗。