PHOTOVOLTAIC DEVICE
    4.
    发明申请
    PHOTOVOLTAIC DEVICE 有权
    光电器件

    公开(公告)号:US20130175648A1

    公开(公告)日:2013-07-11

    申请号:US13552594

    申请日:2012-07-18

    IPC分类号: H01L31/0232 H01L31/18

    摘要: A photovoltaic device including a semiconductor substrate having a first surface and a second surface, the second surface being opposite to the first surface; a first passivation layer on the first surface; and a second passivation layer on the second surface, wherein each of the first passivation layer and the second passivation layer comprises an aluminum-based compound, is disclosed. A method of preparing a photovoltaic device, the method including: forming a semiconductor substrate to have a first surface and a second surface, the second surface being opposite to the first surface; forming an emitter region and a back surface field (BSF) region at the second surface; and forming a first passivation layer on the first surface and a second passivation layer on the second surface, wherein the first passivation layer and the second passivation layer are formed concurrently, is also disclosed.

    摘要翻译: 一种光电器件,包括具有第一表面和第二表面的半导体衬底,所述第二表面与所述第一表面相对; 第一表面上的第一钝化层; 以及在第二表面上的第二钝化层,其中第一钝化层和第二钝化层中的每一个包括铝基化合物。 一种制备光伏器件的方法,所述方法包括:形成具有第一表面和第二表面的半导体衬底,所述第二表面与所述第一表面相对; 在所述第二表面处形成发射极区域和后表面场(BSF)区域; 并且还公开了在第一表面上形成第一钝化层和第二表面上的第二钝化层,其中同时形成第一钝化层和第二钝化层。

    PHOTOVOLTAIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    PHOTOVOLTAIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    光伏器件及其制造方法

    公开(公告)号:US20100024871A1

    公开(公告)日:2010-02-04

    申请号:US12399441

    申请日:2009-03-06

    IPC分类号: H01L31/00 H01L21/302

    摘要: A method of manufacturing a photovoltaic device includes preparing a semiconductor substrate having a light incidence surface receiving light and including single crystalline silicon, wet-etching the light incidence surface to form a plurality of first protrusions on the light incidence surface, dry etching a plurality of surfaces of the first protrusions to form a plurality of second protrusions on the plurality of surfaces of the first protrusions, and forming a semiconductor layer on the light incidence surface. The method further includes forming a first electrode on the semiconductor layer and forming a second electrode on a rear surface of the semiconductor substrate facing the light incidence surface.

    摘要翻译: 一种制造光伏器件的方法包括:制备具有光入射表面并包含单晶硅的半导体衬底,湿式蚀刻光入射表面以在光入射表面上形成多个第一突起,干蚀刻多个 所述第一突起的表面在所述第一突起的多个表面上形成多个第二突起,并且在所述光入射表面上形成半导体层。 该方法还包括在半导体层上形成第一电极,并在与半导体衬底相对的光入射面的后表面上形成第二电极。