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公开(公告)号:US07374704B2
公开(公告)日:2008-05-20
申请号:US10483315
申请日:2002-07-26
申请人: Shenglei Che , Ikuka Chiba , Shigeo Okamoto , Tomohiro Sogabe
发明人: Shenglei Che , Ikuka Chiba , Shigeo Okamoto , Tomohiro Sogabe
IPC分类号: C04B35/468 , C08K3/10
CPC分类号: C01B13/145 , B82Y30/00 , C01G1/02 , C01G23/006 , C01P2004/03 , C01P2004/32 , C01P2004/52 , C01P2004/61 , C01P2004/64 , C01P2006/10 , C04B35/468 , C04B35/4682 , C04B35/62655 , C04B35/62665 , C04B2235/3203 , C04B2235/3206 , C04B2235/3215 , C04B2235/3224 , C04B2235/3236 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3262 , C04B2235/3275 , C04B2235/3287 , C04B2235/3298 , C04B2235/528 , C04B2235/5296 , C04B2235/5436 , C04B2235/5481 , H01B3/10 , H05K1/0373
摘要: The present invention provides a production method of spherical oxide powder which includes a feeding step in which a granular powder composed of an oxide composition is fed into a combustion flame together with a carrier gas; a melting step in which said fed granular powder is melted in said combustion flame to obtain a melt; and a solidifying step in which said melt is solidified by being moved and placed outside said combustion flame.
摘要翻译: 本发明提供一种球形氧化物粉末的制造方法,其包括将由氧化物组合物构成的粒状粉末与载气一起供给到燃烧火焰中的供给工序; 熔融步骤,其中所述进料的颗粒粉末在所述燃烧火焰中熔化以获得熔体; 以及固化步骤,其中所述熔体通过移动并放置在所述燃烧火焰的外部而固化。
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公开(公告)号:US06680269B2
公开(公告)日:2004-01-20
申请号:US09892364
申请日:2001-06-27
IPC分类号: C04B35495
CPC分类号: C04B35/495 , H01B3/12
摘要: The disclosed invention relates to Bi2O3—ZnO—Ta2O5 dielectric compounds and compositions, and to their manufacture. The compounds of the invention have outstanding K, Q, TCF, and TCC. Examples of these properties include a K of between 58 and 80, a low dielectric loss (tan &dgr;
摘要翻译: 所公开的发明涉及Bi2O3-ZnO-Ta2O5介电化合物和组合物及其制造。 本发明化合物具有优异的K,Q,TCF和TCC。 这些性质的实例包括58至80之间的K,低介电损耗(tanδ<0.003)和TCC <30ppm /℃。所生产的陶瓷组合物包括由Bi2(ZnTa2)xO6x + 3表示的组成,其中0.57 <= X&LE; 1.0,BI2(ZnTay)2 / 3O((5y + 11)/ 3)其中1.0 <= y <= 3.0,以及Bi2(ZnTay)2 / 3O((5y + 11)/ 3 ),其中1.0 <= y <= 3.0,条件是y不为2.0。 由式r(Bi2(Zn1 / 3Ta2 / 3)2O7) - (1-r)(Bi3 / 2Zn2 / 3)(Zn1 / 2Ta3 / 2)O7))定义的化合物的固溶体,其中0
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公开(公告)号:US5084426A
公开(公告)日:1992-01-28
申请号:US379420
申请日:1989-07-13
申请人: Shoichi Iwaya , Hitoshi Masumura , Haruo Taguchi , Munemitsu Hamada , Tomohiro Sogabe , Shigeya Takahashi , Hiroyuki Satoh
发明人: Shoichi Iwaya , Hitoshi Masumura , Haruo Taguchi , Munemitsu Hamada , Tomohiro Sogabe , Shigeya Takahashi , Hiroyuki Satoh
IPC分类号: C04B35/46 , C04B35/47 , C04B35/472 , H01C7/02 , H01C7/04
CPC分类号: C04B35/47 , C04B35/472
摘要: A semiconductive ceramic composition capable of permitting its resistance-temperature characteristics and resistance to be controlled as desired and a firing temperature of the composition to be lowered to a degree sufficient to facilitate the mass-production at a low cost. The composition contains a main component consisting of SrO, PbO and TiO.sub.2 and is subjected to firing in an oxidizing atmosphere. The composition may contain at least one of SiO.sub.2 and M as a minor component. A variation in amount of the main and minor components permits characteristics and properties of the composition to be varied as desired.
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公开(公告)号:US20070080317A1
公开(公告)日:2007-04-12
申请号:US11538089
申请日:2006-10-03
申请人: Kumiko Iezumi , Junichi Yamazaki , Takeo Tsukada , Norimasa Sakamoto , Tomohiro Sogabe , Masaru Nanao
发明人: Kumiko Iezumi , Junichi Yamazaki , Takeo Tsukada , Norimasa Sakamoto , Tomohiro Sogabe , Masaru Nanao
CPC分类号: C04B35/493 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3241 , C04B2235/3251 , C04B2235/3258 , C04B2235/3275 , C04B2235/3279 , C04B2235/3286 , C04B2235/3291 , C04B2235/3294 , C04B2235/5436 , C04B2235/5445 , H01L41/083 , H01L41/1876
摘要: For the purpose of preventing the degradation of the piezoelectric strain properties when Cu is used for internal electrodes, there is provided a piezoelectric ceramic composition including: a composite oxide, as a main constituent thereof, represented by (Pba-bMeb) [(Zn1/3Nb2/3)xTiyZrz]O3 with the proviso that 0.96≦a≦1.03, 0≦b≦0.1, 0.05≦x≦0.15, 0.25≦y≦0.5, 0.35≦z≦0.6, and x+y+z=1, and Me represents at least one selected from Sr, Ca and Ba; and at least one selected from Co, Mg, Ni, Cr and Ga as a first additive to the main constituent in a content of 0.5% by mass or less (not inclusive of 0) in terms of oxide, wherein an electrode made of Cu is to be disposed on the piezoelectric ceramic composition.
摘要翻译: 为了防止Cu用于内部电极时的压电应变特性的降低,提供了一种压电陶瓷组合物,其包括:作为其主要成分的复合氧化物,由(Pb Sb) )((III / 3/3)Nb 2/3)x u> 条件是0.96 <= a <= 1.03,0 <= b <= 0.1,0.05 <= x <= 0.15, 0.25≤y≤0.5,0.35≤z≤0.6,x + y + z = 1,Me表示选自Sr,Ca和Ba中的至少一种; 和以Co,Mg,Ni,Cr和Ga中的至少一种为主要成分的第一添加剂,以氧化物换算为0.5质量%以下(不包括0),其中,由Cu 将被设置在压电陶瓷组合物上。
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公开(公告)号:US5870273A
公开(公告)日:1999-02-09
申请号:US935135
申请日:1997-09-22
申请人: Tomohiro Sogabe , Yasushi Enokido
发明人: Tomohiro Sogabe , Yasushi Enokido
摘要: In a multi-functional multilayer device including a body (10) having a varistor section (2) and a capacitor section (3) stacked and integrated therewith, the adhesion between a varistor layer and a dielectric layer is improved when the varistor layer (22) contains zinc oxide as a main component and at least one lanthanide oxide as an auxiliary component, and the dielectric layer (32) contains titanium oxide or lanthanum/titanium oxide as a main component. The device experiences little warpage upon firing when glass is added to the dielectric layer. A high resistivity intermediate layer (5) disposed between the varistor and capacitor sections (2 and 3) prevents the deterioration or loss of varistor and capacitor properties by interdiffusion of elements between the varistor and capacitor sections.
摘要翻译: 在包括具有压敏电阻部分(2)的本体(10)和与其集成并结合的电容器部分(3)的多功能多层器件中,当变阻器层(22) )含有氧化锌作为主要成分和至少一种镧系元素氧化物作为辅助成分,电介质层(32)含有氧化钛或镧/氧化钛作为主要成分。 当玻璃添加到电介质层时,该装置在烧制时几乎没有翘曲。 设置在变阻器和电容器部分(2和3)之间的高电阻率中间层(5)通过变阻器和电容器部分之间的元件的相互扩散来防止变阻器和电容器特性的劣化或损失。
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公开(公告)号:US07735713B2
公开(公告)日:2010-06-15
申请号:US11562644
申请日:2006-11-22
申请人: Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
发明人: Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
CPC分类号: H01L23/49816 , H01G2/065 , H01L23/49838 , H01L24/81 , H01L2224/1147 , H01L2224/1184 , H01L2224/13019 , H01L2224/16 , H01L2224/16105 , H01L2224/81024 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H05K3/3442 , H05K3/3457 , H05K3/3489 , H05K2201/0373 , H05K2201/10636 , H05K2203/0278 , H05K2203/043 , H05K2203/0485 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
摘要翻译: 一种用于安装芯片部件的方法包括以下步骤:使粘附在电路板的焊盘端子上的焊料沉积物变平; 在焊料沉积物平坦化之后或之后在焊料沉积物上形成凹槽; 用焊剂涂覆焊料沉积物; 并且将焊料沉积物中的芯片部件放置在其间。
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公开(公告)号:US07402337B2
公开(公告)日:2008-07-22
申请号:US10158398
申请日:2002-05-29
IPC分类号: C04B35/26
CPC分类号: H01F1/37 , C01P2004/61 , C01P2006/40 , C04B35/6262 , C04B35/6263 , C04B35/62655 , C04B35/62695 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3232 , C04B2235/3234 , C04B2235/3236 , C04B2235/3255 , C04B2235/326 , C04B2235/3262 , C04B2235/3272 , C04B2235/3274 , C04B2235/3279 , C04B2235/3284 , C04B2235/3293 , C04B2235/3298 , C04B2235/3817 , C04B2235/3852 , C04B2235/528 , C04B2235/5296 , C04B2235/5427 , C04B2235/5436 , C04B2235/5445 , C04B2235/96 , C09C3/006 , C09C3/043 , C09C3/045 , G11B5/70678 , H01F1/11 , H01F1/113 , H01F1/344 , H01F1/36 , Y10T428/2991 , Y10T428/2993
摘要: A method for manufacturing spherical ceramic powder is provided. The method includes essentially a spray drying step and a sintering step. In the spray drying step, a spray nozzle is used to spray slurry containing powdered raw material consisting essentially of ceramic ingredients to form liquid droplets, and liquid contents in the liquid droplets are heated and removed to obtain ceramic granular powder. In the sintering step, the ceramic granular powder is sintered to form spherical ceramic powder. The method provides ceramic powder having a mean particle size of about 1-50 μm and a sphericity of about 0.8 or higher, which is suited for mixing with resin material to form a compound. The ceramic powder has high dispersant and filling properties against the resin material.
摘要翻译: 提供一种制造球形陶瓷粉末的方法。 该方法基本上包括喷雾干燥步骤和烧结步骤。 在喷雾干燥工序中,使用喷嘴喷雾含有主要由陶瓷成分组成的粉末原料的浆料,形成液滴,加热除去液滴中的液体成分,得到陶瓷粒状粉末。 在烧结步骤中,将陶瓷粒状粉末烧结成球形陶瓷粉末。 该方法提供平均粒径为约1-50μm,球形度为约0.8或更高的陶瓷粉末,其适于与树脂材料混合以形成化合物。 陶瓷粉末对树脂材料具有高分散剂和填充性能。
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公开(公告)号:US20070145101A1
公开(公告)日:2007-06-28
申请号:US11562644
申请日:2006-11-22
申请人: Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
发明人: Naruki Kataoka , Taisuke Ahiko , Akitoshi Yoshii , Akira Goshima , Takashi Aoki , Tomohiro Sogabe
IPC分类号: A47J36/02
CPC分类号: H01L23/49816 , H01G2/065 , H01L23/49838 , H01L24/81 , H01L2224/1147 , H01L2224/1184 , H01L2224/13019 , H01L2224/16 , H01L2224/16105 , H01L2224/81024 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H05K3/3442 , H05K3/3457 , H05K3/3489 , H05K2201/0373 , H05K2201/10636 , H05K2203/0278 , H05K2203/043 , H05K2203/0485 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
摘要翻译: 一种用于安装芯片部件的方法包括以下步骤:使粘附在电路板的焊盘端子上的焊料沉积物变平; 在焊料沉积物平坦化之后或之后在焊料沉积物上形成凹槽; 用焊剂涂覆焊料沉积物; 并且将焊料沉积物中的芯片部件放置在其间。
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