公开(公告)号：US20190284351A1

公开(公告)日：2019-09-19

申请号：US16351092

申请日：2019-03-12

申请人： Shigenori YAGUCHI ,  Yasuyuki Yamashita ,  Akira Saito ,  Kiichi Kamoda

发明人： Shigenori YAGUCHI ,  Yasuyuki Yamashita ,  Akira Saito ,  Kiichi Kamoda

IPC分类号： C08J5/04 ,  C08J3/12 ,  B29C70/62

摘要： Provided are resin particles including columnar resin particles each including filaments of a fibrous material, wherein the filaments of the fibrous material are aligned in an axial direction of each of the columnar resin particles.

公开(公告)号：US20210317601A1

公开(公告)日：2021-10-14

申请号：US17346497

申请日：2021-06-14

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US10800096B2

公开(公告)日：2020-10-13

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10 ,  B33Y30/00 ,  B29C64/10 ,  B33Y70/00 ,  B29C64/165 ,  B33Y10/00 ,  B29B9/06 ,  B29B9/12 ,  B29K67/00 ,  B29K71/00 ,  B29K77/00

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US20180264721A1

公开(公告)日：2018-09-20

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

CPC分类号： B29C64/153 ,  B29B9/06 ,  B29B9/12 ,  B29B2009/125 ,  B29C64/10 ,  B29C64/165 ,  B29C64/264 ,  B29K2067/003 ,  B29K2067/006 ,  B29K2067/046 ,  B29K2071/00 ,  B29K2077/10 ,  B29K2995/0041 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US11066758B2

公开(公告)日：2021-07-20

申请号：US15656214

申请日：2017-07-21

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B32B5/16 ,  D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US10682808B2

公开(公告)日：2020-06-16

申请号：US16056855

申请日：2018-08-07

申请人： Takashi Fujita ,  Akira Saito ,  Kiichi Kamoda ,  Yasutada Shitara ,  Kazuhiko Watanabe ,  Hitoshi Iwatsuki ,  Yuuya Endoh ,  Kazufumi Kimura ,  Yasuyuki Yamashita ,  Shinnosuke Koshizuka ,  Yuuki Kamon ,  Nozomu Tamoto

发明人： Takashi Fujita ,  Akira Saito ,  Kiichi Kamoda ,  Yasutada Shitara ,  Kazuhiko Watanabe ,  Hitoshi Iwatsuki ,  Yuuya Endoh ,  Kazufumi Kimura ,  Yasuyuki Yamashita ,  Shinnosuke Koshizuka ,  Yuuki Kamon ,  Nozomu Tamoto

IPC分类号： B29C64/147 ,  B29C64/218 ,  B29C64/40

摘要： A fabrication method includes laminating a fabrication material to form an object, and applying a release material on a surface of the object to form a release layer on the surface of the object. A surface free energy of the release material is equal to or smaller than 25 mN/m.

公开(公告)号：US11045978B2

公开(公告)日：2021-06-29

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00 ,  B33Y10/00 ,  B29B9/06 ,  C08J3/12 ,  B29K101/12

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20190241734A1

公开(公告)日：2019-08-08

申请号：US16268529

申请日：2019-02-06

申请人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

发明人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

IPC分类号： C08L67/02 ,  B29C64/153 ,  B33Y70/00 ,  C08J3/12

CPC分类号： C08L67/02 ,  B29B9/04 ,  B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29C64/153 ,  B29K2105/0094 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12 ,  C08J2367/02 ,  C08J2467/02 ,  C08L2205/025

摘要： A powder for solid freeform fabrication includes a first resin particle and a second resin particle, wherein MFR2 is greater than MFR1 and a ratio of MFR2 to MFR1 is from 2 to 5, where MFR1 represents a melt mass-flow rate (MFR) of the first resin particle and MFR2 represents a melt mass-flow rate of the second resin particle.

公开(公告)号：US11052649B2

公开(公告)日：2021-07-06

申请号：US16007064

申请日：2018-06-13

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Hitoshi Iwatsuki

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Hitoshi Iwatsuki

IPC分类号： B33Y70/00 ,  C08K5/52 ,  C08K5/09 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/521 ,  B29C64/153 ,  C08L71/00 ,  C08L77/06 ,  C08L59/00 ,  B33Y10/00 ,  C08L77/02 ,  C08K5/00 ,  B29K71/00 ,  B29K105/00 ,  B29K77/00 ,  B29K67/00 ,  B33Y30/00 ,  B29K23/00 ,  C08L23/12 ,  C08K5/36 ,  C08K5/49 ,  C08K5/098 ,  C08K5/13

摘要： A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

公开(公告)号：US09173754B2

公开(公告)日：2015-11-03

申请号：US13060395

申请日：2009-08-28

申请人： Yoshihiko Yokoi ,  Yasushi Hashimoto ,  Akira Saito

发明人： Yoshihiko Yokoi ,  Yasushi Hashimoto ,  Akira Saito

IPC分类号： A61F2/82 ,  A61F2/89

CPC分类号： A61F2/89 ,  A61F2250/0018

摘要： A stent including a plurality of loop stents connected by struts so that it bends uniformly as a whole.A stent A including a plurality of loop stents 2 connected by a plurality of struts 3, the loop stents 2 each formed of a stent main wire 1 folded into a zigzag shape and joined at its ends, wherein the bending strength of each strut 3 is larger than the bending strength of the stent main wire 1.

摘要翻译： 一种支架，其包括通过支柱连接的多个环形支架，使得其整体上均匀地弯曲。 支架A，其包括多个由多个支柱3连接的环形支架2，每个支架2由支架主线1形成，折叠成Z字形并在其端部连接，其中每个支柱3的弯曲强度为 大于支架主线1的弯曲强度。