摘要:
A nonvolatile semiconductor memory device includes a first memory cell array including electrically re-programmable main memory cells, a second memory cell array including electrically data-programmable redundancy memory cells, a first storage configured to store a specified code, a first comparator configured to compare a selected code with the specified code to generate an activating signal, a faulty address latch circuit configured to be activated by the activating signal and controlled to temporarily latch a fault address corresponding to the fault, a second storage configured to store the faulty address latched by the faulty address latch circuit, a second comparator configured to compare an input address with the faulty address to generate a replacement control signal when the input address coincides with the faulty address, and a replacing circuit configured to replace an output of the first memory cell array with an output of the second memory cell array.
摘要:
A nonvolatile semiconductor memory device comprises a first memory cell array including electrically re-programmable main memory cells, a second memory cell array including electrically data-programmable redundancy memory cells, a first storage configured to store a specified code, a first comparator configured to compare a selected code with the specified code to generate an activating signal, a faulty address latch circuit configured to be activated by the activating signal and controlled to temporarily latch a fault address corresponding to the fault, a second storage configured to store the faulty address latched by the faulty address latch circuit, a second comparator configured to compare an input address with the faulty address to generate a replacement control signal when the input address coincides with the faulty address, and a replacing circuit configured to replace an output of the first memory cell array with an output of the second memory cell array.
摘要:
A nonvolatile semiconductor memory includes first and second nonvolatile memory banks, a data-line for read, a data-line for program and verify, a sense amplifier for read, a sense amplifier for program and verify, and a program circuit. The data-lines are arranged in a region between the first and second nonvolatile memory banks, and selectively connected to the bit-lines of the first and second nonvolatile memory banks. The sense amplifier for read is connected to the data-line for read. The sense amplifier for program and verify and the program circuit are connected to the data-line for program and verify.
摘要:
In a channel-erase EEPROM, there is a parasitic capacitance between node N1 to which a substrate voltage is supplied and node N2 to which the voltage on a word line is supplied. A negative voltage is applied to the word line in erasing the data in a memory cell. A switch circuit SW1 is connected between node N1 and node N2. Between node N1 and the ground, a switch SW4 is connected. A switch SW5 is connected between node N2 and the ground. When the erase operation has been completed, the switch circuit SW1 is first turned on, short-circuiting node N1 and node N2. Thereafter, the switch circuits SW4, SW5 are turned on, grounding node N1 and node N2 separately.
摘要:
In a channel-erase EEPROM, there is a parasitic capacitance between node N1 to which a substrate voltage is supplied and node N2 to which the voltage on a word line is supplied. A negative voltage is applied to the word line in erasing the data in a memory cell. A switch circuit SW1 is connected between node N1 and node N2. Between node N1 and the ground, a switch SW4 is connected. A switch SW5 is connected between node N2 and the ground. When the erase operation has been completed, the switch circuit SW1 is first turned on, short-circuiting node N1 and node N2. Thereafter, the switch circuits SW4, SW5 are turned on, grounding node N1 and node N2 separately.
摘要:
The semiconductor memory comprises a reference current generator, first and second current converters, sense amplifiers for read, and sense amplifiers for verify. The reference current generator generates a first voltage dependent upon the current flowing through a reference cell. The first current converters, to which the first voltage is input, each generate a second voltage. The second current converters, to which the first voltage is input, each generate a third voltage. The sense amplifiers for read output data of a selection memory cell, comparing the voltage of the data-line for read with the second voltage. The sense amplifiers for verify output verify data of the selection memory cell, comparing the voltage of the data-lines for verify and the third voltage.
摘要:
In a channel-erase EEPROM, there is a parasitic capacitance between node N1 to which a substrate voltage is supplied and node N2 to which the voltage on a word line is supplied. A negative voltage is applied to the word line in erasing the data in a memory cell. A switch circuit SW1 is connected between node N1 and node N2. Between node N1 and the ground, a switch SW4 is connected. A switch SW5 is connected between node N2 and the ground. When the erase operation has been completed, the switch circuit SW1 is first turned on, short-circuiting node N1 and node N2. Thereafter, the switch circuits SW4, SW5 are turned on, grounding node N1 and node N2 separately.
摘要:
In a channel-erase EEPROM, there is a parasitic capacitance between node N1 to which a substrate voltage is supplied and node N2 to which the voltage on a word line is supplied. A negative voltage is applied to the word line in erasing the data in a memory cell. A switch circuit SW1 is connected between node N1 and node N2. Between node N1 and the ground, a switch SW4 is connected. A switch SW5 is connected between node N2 and the ground. When the erase operation has been completed, the switch circuit SW1 is first turned on, short-circuiting node N1 and node N2. Thereafter, the switch circuits SW4, SW5 are turned on, grounding node N1 and node N2 separately.
摘要:
The non-volatile semiconductor memory device comprises memory cell array having a plurality of memory cells, word lines connected to control gates of the memory cells, bit lines connected to drains of the memory cells, a source line connected in common to sources of the memory cells and connected to a well region where the memory cells are formed, a row decoder consisting of a row main decoder and a row sub-decoder for selecting a word line in the memory cell array, a column gate circuits for selecting a bit line in the memory cell array, a control gate driver for biasing a word line in the memory cell array, and an well driver for biasing semiconductor region in which the memory cell array is formed.
摘要:
A memory cell is connected to a cell-based bit line. The cell-based bit line is connected to a bit line via a Y decoder. The bit line is connected to a sense bit line via a separation circuit. This sense bit line is connected to a sense line via a bias circuit. An amplifier circuit amplifies a signal voltage on the sense line together with a reference voltage for sensing data. The sense line is connected with a sense line initialization circuit for setting the sense line to a specified voltage. The bit line is connected with a bit line initialization circuit for setting the bit line to a specified voltage. Both the sense line initialization circuit and the bit line initialization circuit are activated in a given period before the amplifier circuit operates to sense data. Thus, the sense line and the bit line are set to specified voltages.