摘要:
A novel redundancy scheme to repair no more than one defect per I/O in a One-Time-Programmable (OTP) memory is disclosed. An OTP memory has a plurality of OTP cells in a plurality of I/Os and at least one auxiliary OTP cell associated with each I/O. At least one volatile cell in each I/O corresponds to the auxiliary OTP cells. At least one Boolean gate to invert the data into and/or out of the main OTP memory in each I/O independently based on the data in the volatile cells. The data in each I/O of the OTP memory can be inverted if no more than one defect per I/O is found. Furthermore, the inversion scheme can be achieved by reading the auxiliary OTP cells and storing into the volatile cells by automatically generating at least one read cycle upon initialization.
摘要:
At least one junction diode fabricated in standard CMOS logic processes can be used as program selectors for the memory cells that can be programmed based on the directions of current flow. These memory cells are MRAM, RRAM, CBRAM, or other memory cells that have a resistive element coupled to the P terminal of the first diode and to the N terminal of a second diode. The diodes can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diodes. By applying a high voltage to a resistive element and switching the N terminal of the first diode to a low voltage while disabling the second diode, a current flows through the memory cell can change the resistance into one state. Similarly, by applying a low voltage to a resistive element and switching the P terminal of the second diode to a high voltage while disabling the first diode, a current flows through the memory cell can change the resistance into another state. The P+ active region of the diode can be isolated from the N+ active region in an N well by using dummy MOS gate, SBL, or STI isolations.
摘要:
A low-pin-count non-volatile (NVM) memory to be provided in an integrated circuit for a 3D IC to repair defects, trim devices, or adjust parameters is presented here. At least one die in a 3D IC can be built with at least one low-pin-count OTP memory. The low-pin-count OTP memory can be built with a serial interface such as I2C-like or SPI-like of interface. The pins of the low-pin-count OTP in at least one die can be coupled together to have only one set of low-pin-count bus for external access. With proper device ID, each die in a 3D IC can be accessed individually for soft programming, programming, erasing, or reading. This technique can improve the manufacture yield, device, circuit, or logic performance or to store configuration parameters for customization after 3D IC are built.
摘要:
A method and system for multiple-bit programmable resistive cells having a multiple-bit programmable resistive element and using diode as program selector are disclosed. The first and second terminals of the diode having a first and second types of dopants can be fabricated from source/drain of MOS in a well for MOS devices or fabricated on the same polysilicon structure. If a multiple-bit programmable resistive cell has 2n (n>1) distinct resistance levels to store n-bit data, at least 2n−1 reference resistance levels can be designated to differential resistances between two adjacent states. Programming multiple-bit programmable resistive elements can start by applying a program pulse with initial program voltage (or current) and duration. A read verification cycle can follow to determine if the desirable resistance level is reached. If the desired resistance level has not been reached, additional program pulses can be applied.
摘要:
Gate oxide breakdown anti-fuse suffers notorious soft breakdown that reduces yield and reliability. This invention discloses circuit and system to enhance electrical field by blocking LDD so that the electrical field is higher and more focused near the drain junction, to make electrical field in the channel more uniform by creating slight conductive or conductive in part or all of the channel, or to neutralize excess carriers piled up in the oxide by applying alternative polarity pulses. The embodiments can be applied in part, all, or any combinations, depending on needs. This invention can be embodied as a 2 T anti-fuse cell having an access and a program MOS with drain area in the program MOS, or 1.5 T anti-fuse cell without any drain in the program MOS. Similarly this invention can also be embodied as a 1 T anti-fuse cell having a portion of the channel made conductive or slightly conductive to merge the access and program MOS into one device with drain area, or 0.5 T anti-fuse cell without any drain.
摘要:
An OTP (One-Time Programmable) element can be fabricated in CMOS FinFET processes are disclosed. The OTP cell can be implemented as a MOS device, dummy-gate diode, or Schottky diode as selector is disclosed here. In one embodiment, the OTP element includes a MOS gate with at least one portion of the MOS gate can have at least one extended area to accelerate programming. An extended area is an extension of the OTP element beyond two nearest cathode and anode contacts and are longer than required by design rules. The extended area can also have reduced or substantially no current flowing through. The selector can be built with a MOS gate to divide at least one fin structure into two different active regions. By using different source/drain implant schemes on the two active regions, the selector can be turned on as MOS device, MOS device and/or diode, dummy-gate diode, or Schottky diode.
摘要:
A low-pin-count non-volatile (NVM) memory to be provided in an integrated circuit for a 3D IC to repair defects, trim devices, or adjust parameters is presented here. At least one die in a 3D IC can be built with at least one low-pin-count OTP memory. The low-pin-count OTP memory can be built with a serial interface such as I2C-like or SPI-like of interface. The pins of the low-pin-count OTP in at least one die can be coupled together to have only one set of low-pin-count bus for external access. With proper device ID, each die in a 3D IC can be accessed individually for soft programming, programming, erasing, or reading. This technique can improve the manufacture yield, device, circuit, or logic performance or to store configuration parameters for customization after 3D IC are built.
摘要:
A low-pin-count non-volatile (NVM) memory to be provided in an integrated circuit. In one embodiment, the low-pin-count non-volatile (NVM) memory can use only one external control signal and one internal clock signal to generate start, stop, device ID, read/program/erase pattern, starting address, and actual read/program/erase cycles. When programming or erasing begins, toggling of the control signal increments/decrements a program or erase address and a pulse width of the control signal determines the actual program or erase time. A data out of the low-pin-count non-volatile (NVM) memory can be multiplexed with the control signal. Since the clock signal can be derived and shared from the system clock of the integrated circuit, the NVM memory need only have one external control pin for I/O transactions to realize a low-pin-count interface.
摘要:
Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for reversible resistive devices, such as PCM, RRAM, CBRAM, or other memory cells. The reversible resistive devices have a reversible resistive element coupled to a diode. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a voltage or a current between a reversible resistive element and the N terminal of a diode, the reversible resistive device can be programmed into different states based on magnitude, duration, voltage-limit, or current-limit in a reversible manner. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI/LOCOS isolations.
摘要:
In-system repairing or configuring faulty memories after being used in a system. In one embodiment, a memory chip can include at least one OTP memory to store defective addresses that are to be repaired. The OTP memory can operate without requiring additional I/O pins or high voltage supplies for reading or programming. The memory chip can also include control logic to control reading or programming of the OTP memory as needed.