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公开(公告)号：US08735177B2
公开(公告)日：2014-05-27
申请号：US11918465
申请日：2007-02-20
IPC分类号： G01N33/547 , G01N33/544
CPC分类号： A61K49/0039 , A61K49/0002 , A61K49/0043 , A61K49/0052 , A61K49/0056 , A61K49/0093
摘要： A diagnostic marker is composed of particles that have a diameter of from 1 nm to 100 μm, the particles possessing on their surfaces a site that has a high specific bonding ability to a specific antigen residing on the mucosa of digestive cancers and a site that has a low bonding ability to the mucosa of digestive organs, and further incorporating an identification material.
摘要翻译： 诊断标记由直径为1nm至100μm的颗粒组成，颗粒在其表面上具有与存在于消化性癌症粘膜上的特异性抗原具有高特异性结合能力的位点，以及具有 对消化器官粘膜的粘合能力低，并进一步掺入鉴定材料。
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公开(公告)号：US20090075301A1
公开(公告)日：2009-03-19
申请号：US11918465
申请日：2007-02-20
IPC分类号： G01N33/574 , G01N33/53
CPC分类号： A61K49/0039 , A61K49/0002 , A61K49/0043 , A61K49/0052 , A61K49/0056 , A61K49/0093
摘要： A diagnostic marker is composed of particles that have a diameter of from 1 nm to 100 μm, the particles possessing on their surfaces a site that has a high specific bonding ability to a specific antigen residing on the mucosa of digestive cancers and a site that has a low bonding ability to the mucosa of digestive organs, and further incorporating an identification material.
摘要翻译： 诊断标记由直径为1nm至100μm的颗粒组成，颗粒在其表面上具有对存在于消化性癌症粘膜上的特异性抗原具有高特异性结合能力的位点，以及具有 对消化器官粘膜的粘合能力低，并进一步掺入鉴定材料。
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公开(公告)号：US20070197755A1
公开(公告)日：2007-08-23
申请号：US10594221
申请日：2005-05-10
摘要： A curable composition which comprises at least one of the following (A), (B), and (C) and further contains the following (D) (provided that when (C) is not contained, both (A) and (B) are contained). (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′ and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst. The reactive group A′ is any of Si—R1, Si—O—R2, and Si—R3—OCOC(R4)═CH2, provided that R1 and R2 each is alkenyl, R3 is alkylene and/or arylene, and R4 is hydrogen or methyl.
摘要翻译： 包含以下（A），（B）和（C）中的至少一个的可固化组合物，并且还包含以下（D）（前提是不含（C）时，（A）和（B） 被包含）。 （A）：重均分子量为1000以下的成分的含量为20重量％的含硅聚合物。 ％以下，具有反应性基团A'和一个或多个Si-O-Si键。 （B）：重均分子量为1000以下的成分的含量为20重量％的含硅聚合物。 ％以下，并且具有Si-H基和一个或多个Si-O-Si键。 （C）：重均分子量为1000以下的成分的含量为20重量％的含硅聚合物。 ％以下，具有反应性基团A'，Si-H基和一个或多个Si-O-Si键。 （D）：铂催化剂用于固化反应的催化剂。 反应性基团A'是Si-R 1，Si-OR 2和Si-R 3 -OCOC（R SUP）中的任何一种 > 4 ） - CH 2，条件是R 1和R 2各自为烯基，R 3， SUP>是亚烷基和/或亚芳基，R 4是氢或甲基。
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公开(公告)号：US08003736B2
公开(公告)日：2011-08-23
申请号：US12596933
申请日：2008-04-21
申请人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
发明人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
IPC分类号： C08F283/00
摘要： A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra-Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.
摘要翻译： 一种式（1）的含硅化合物和含有其中Z是氢的式（1）的含硅化合物的固化组合物，其中Z是C 2 -C 4烯基或炔基的式（1）的含硅化合物 和氢化硅烷化催化剂。 该组合物具有优异的处理和固化性能，并提供具有优异的耐热性和柔韧性的固化产物。 在式（1）中，Ra-Rg = C1-C12饱和脂族烃基或C6-C12芳族烃基。 Re和Rf不同时代表C1-C12饱和脂族烃基; Y = C2-C4亚烷基; Z =氢或C 2 -C 4烯基或炔基; K为2-7; T为1-7; P为0-3; 并且M和N是选择为N:M = 1:1至1:100的数字，所有M和N的总数至少为15，并且式（1）化合物的质均分子量为3,000至1,000,000 。
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公开(公告)号：US07939614B2
公开(公告)日：2011-05-10
申请号：US10594221
申请日：2005-05-10
摘要： A curable composition which comprises at least one of the following (A), (B), and (C) and further contains (D) (provided that when (C) is not contained, both (A) and (B) are in the composition. (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′ and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst. The reactive group A′ is any of Si—R1, Si—O—R2, and Si—R3—OCOC(R4)═CH2, provided that R1 and R2 each is alkenyl, R3 is alkylene and/or arylene, and R4 is hydrogen or methyl.
摘要翻译： 一种可固化的组合物，其包含以下的（A）中的至少一种，（B），和（C），还含有（D）（条件是当（C）不包含，无论（A）和（B）是在 该组合物（A）：含硅聚合物，其中具有1,000或更低的重均分子量成分的含量为20重量％或更低，其中有一个反应性基团A'和一个或多个SI- O-Si键（B）：A含硅聚合物，其中具有1,000或更低的重均分子量成分的含量为20重量％或更低，其具有Si-H基和一个或多个 Si-O-Si键（C）：其中重均分子量为1,000以下的成分的含量为20重量％以下且具有反应性基团A'的含硅聚合物， Si-H基和一个或多个Si-O-Si键;（D）：作为铂催化剂的用于固化反应的催化剂，反应性基团A'是Si-R 1，Si-O-R 2和 的Si-R3 OCOC（R 4）═CH2，条件是R1和R2各自是链烯基，R 3是亚烷基和/或亚芳基，并且R 4是氢或甲基。
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公开(公告)号：US20100179283A1
公开(公告)日：2010-07-15
申请号：US12596933
申请日：2008-04-21
申请人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
发明人： Takashi Sueyoshi , Ken-ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Seiichi Saito , Yoshitaka Sugawara
摘要： A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra—Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y═C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.
摘要翻译： 一种式（1）的含硅化合物和含有其中Z是氢的式（1）的含硅化合物的固化组合物，其中Z是C 2 -C 4烯基或炔基的式（1）的含硅化合物 和氢化硅烷化催化剂。 该组合物具有优异的处理和固化性能，并提供具有优异的耐热性和柔韧性的固化产物。 在式（1）中，Ra-Rg = C1-C12饱和脂族烃基或C6-C12芳族烃基。 Re和Rf不同时代表C1-C12饱和脂族烃基; Y = C 2 -C 4亚烷基; Z =氢或C 2 -C 4烯基或炔基; K为2-7; T为1-7; P为0-3; 并且M和N是选择为N:M = 1:1至1:100的数字，所有M和N的总数至少为15，并且式（1）化合物的质均分子量为3,000至1,000,000 。
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7.发明申请High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor 审中-公开树脂覆盖的高耐压半导体器件及其制造方法公开(公告)号：US20070262472A1
公开(公告)日：2007-11-15
申请号：US11664586
申请日：2005-10-05
申请人： Shinichi Okada , Yoshitaka Sugawara , Katsunori Asano , Daisuke Takayama , Yoshikazu Shoji , Tadashi Janado , Takashi Sueyoshi , Ken-Ichiro Hiwatari
发明人： Shinichi Okada , Yoshitaka Sugawara , Katsunori Asano , Daisuke Takayama , Yoshikazu Shoji , Tadashi Janado , Takashi Sueyoshi , Ken-Ichiro Hiwatari
CPC分类号： H01L23/24 , H01L23/296 , H01L23/3121 , H01L24/48 , H01L2224/48137 , H01L2224/4823 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/10272 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A high withstand voltage semiconductor chip mounted on a package or a board is covered with a sealing resin, and the resin is cured while a high voltage is applied between at least one of electrode terminals connected from a chip electrode or the chip via wiring of wires or the like and another electrode that necessitates a dielectric withstand voltage between the electrode and the electrode terminal during the curing. The sealing resin is provided by a synthetic high molecular compound structured in a manner that an organic silicon polymer C is constituted by alternately linearly linking an organic silicon polymer A having a crosslinking structure of siloxane with an organic silicon polymer B having a linear link structure of siloxane (Si—O—Si bond) by siloxane bond and the polymers are three-dimensionally linked together by covalent bond. With this arrangement, a dielectric withstand voltage capability, which is stable by suppression of an increase in the leakage current even when a high reverse voltage is applied and agrees with the designed value, can be obtained in a high withstand voltage semiconductor chip that is mounted on a board or a package and sealed with the resin.
摘要翻译： 安装在封装或板上的高耐压半导体芯片被密封树脂覆盖，并且在从芯片电极连接的至少一个电极端子或芯片之间施加高电压而使树脂固化， 或类似物以及在固化期间必须在电极和电极端子之间具有介电耐受电压的另一电极。 密封树脂由合成的高分子化合物提供，所述合成高分子化合物以有机硅聚合物C通过将具有硅氧烷的交联结构的有机硅聚合物A与具有硅氧烷的交联结构的有机硅聚合物A与具有直链结构 通过硅氧烷键的硅氧烷（Si-O-Si键），并且聚合物通过共价键三维连接在一起。 通过这种布置，即使在施加高的反向电压并且与设计值一致的情况下也可以通过抑制漏电流的增加而稳定的介电耐受电压能力可以在安装的高耐压半导体芯片中获得 在纸板或包装上，并用树脂密封。
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公开(公告)号：US20120256780A1
公开(公告)日：2012-10-11
申请号：US13439100
申请日：2012-04-04
申请人： Yoshikazu Shoji
发明人： Yoshikazu Shoji
CPC分类号： G01S13/28 , G01S13/18 , G01S13/524 , G01S13/582
摘要： According to one embodiment, a radar equipment includes a radio transmitter, a pulse compressor, a Doppler filter, and an integration processor. The radio transmitter receives pulse signals and digitizes the received pulse signals by oversampling with a frequency higher than that for generation of a pulse compression coefficient to generate digital data. The pulse compressor performs pulse compression on the digital data using the pulse compression coefficient to generate range bin data for each of the pulse signals. The Doppler filter processor performs Doppler filter processing on the range bin data. The integration processor integrates the range bin data subjected to the Doppler filter processing for each range bin.
摘要翻译： 根据一个实施例，雷达设备包括无线电发射机，脉冲压缩器，多普勒滤波器和集成处理器。 无线电发射机接收脉冲信号并通过用比产生脉冲压缩系数的频率更高的频率进行过采样对接收的脉冲信号进行数字化，以产生数字数据。 脉冲压缩器使用脉冲压缩系数对数字数据执行脉冲压缩，以产生每个脉冲信号的范围bin数据。 多普勒滤波器处理器对范围仓数据执行多普勒滤波处理。 集成处理器集成了对于每个范围仓进行多普勒滤波处理的范围仓数据。
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公开(公告)号：US20090074374A1
公开(公告)日：2009-03-19
申请号：US12224951
申请日：2007-03-07
CPC分类号： G02B6/1221 , C08G59/22 , C08G59/226 , C08G59/306 , C08G77/14 , C08G77/70 , C08L63/00 , C09D183/06 , G02B6/138 , C08L2666/14
摘要： A curable composition for an optical material including a specific silicon-containing polymer (A), a specific epoxy resin (B) and an energy ray-sensitive cationic polymerization initiator (C) as essential components.
摘要翻译： 作为必要成分的含有特定含硅聚合物（A），特定环氧树脂（B）和能量射线敏感性阳离子聚合引发剂（C）的光学材料用固化性组合物。
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公开(公告)号：US20130323391A1
公开(公告)日：2013-12-05
申请号：US13881816
申请日：2011-10-25
IPC分类号： A23L1/10
CPC分类号： A23L7/109 , A21D2/265 , A21D13/04 , A21D13/047 , A21D13/40 , A23L7/198 , B02C9/00 , B02C11/08
摘要： A grain flour includes milled grains of at least one grain selected from the group consisting of barley and oat. In the grain flour, the average grain diameter is in the range of 40-100 μm. The content of grains having a grain diameter less than 20 μm is not greater than 20 mass %, the content of grains having a grain diameter in the range of 20-100 μm is in the range of 20-60 mass %, the content of grains having a grain diameter greater than 100 μm and not greater than 500 μm is in the range of 20-60 mass %, and the content of grains having a grain diameter greater than 500 μm is not greater than 5%. An application food using the grain flour is produced from a starting material which contains at least 5% of the grain flour. A method for producing the grain flour is also provided.
摘要翻译： 谷物粉包括选自由大麦和燕麦组成的组中的至少一个谷物的磨碎的谷物。 在谷物粉中，平均粒径在40-100μm的范围内。 粒径小于20μm的颗粒的含量不大于20质量％，粒径在20-100μm的范围内的颗粒的含量在20-60质量％的范围内，其含量 粒径大于100μm且不大于500μm的颗粒在20-60质量％的范围内，粒径大于500μm的颗粒的含量不大于5％。 使用谷物粉的应用食品由含有至少5％的谷物粉的原料制成。 还提供了一种生产谷物粉的方法。
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