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公开(公告)号:US20120126711A1
公开(公告)日:2012-05-24
申请号:US13383785
申请日:2010-11-24
申请人: Shinji Suminoe , Mitsuru Hineno , Masato Onoue
发明人: Shinji Suminoe , Mitsuru Hineno , Masato Onoue
IPC分类号: H05B37/02
CPC分类号: H01L25/0753 , G02F1/133603 , G02F2001/133613 , H01L2924/0002 , H01L2924/00
摘要: A sensor circuit or a display apparatus from which a highly accurate sensor output can be obtained includes a photodiode, a capacitor that is connected to the photodiode via an accumulation node and accumulates charges according to an electric current in the photodiode; a sensor switching element transistor that causes the accumulation node and an output line to be conductive with respect to each other in response to a readout signal and outputs an output signal according to the potential of the accumulation node to the output line; a variable capacitor that is provided between the accumulation node and an input electrode, and whose capacitance varies when a pressure is applied by a touching operation; and a control switching element transistor to which a control signal for switching conduction and non-conduction between the variable capacitor and the accumulation node is input.
摘要翻译: 可以从其获得高精度传感器输出的传感器电路或显示装置包括光电二极管,经由累积节点连接到光电二极管的电容器,并根据光电二极管中的电流累积电荷; 传感器开关元件晶体管,其响应于读出信号使所述累积节点和输出线相对于彼此导电,并且根据所述累积节点的电位将输出信号输出到所述输出线; 设置在所述蓄积节点和输入电极之间的可变电容器,并且当通过触摸操作施加压力时,其电容变化; 以及输入用于切换可变电容器和累积节点之间的导通和非导通的控制信号的控制开关元件晶体管。
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公开(公告)号:US09158151B2
公开(公告)日:2015-10-13
申请号:US13502693
申请日:2010-11-09
申请人: Nobuo Ogata , Mitsuru Hineno , Shinji Suminoe
发明人: Nobuo Ogata , Mitsuru Hineno , Shinji Suminoe
IPC分类号: G02F1/1335
CPC分类号: F21K9/50 , F21K9/60 , F21V5/04 , F21V17/101 , F21V23/001 , F21Y2115/10 , G02F1/133603 , G02F1/133606 , G02F1/133611 , G02F2202/28 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要: A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1)is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.
摘要翻译: 本发明的面发光单元是用于经由光通量的光束控制部(22)从发光元件部(1)的LED芯片(6)发光的LED模块(30) 控制部分(2),所述光束控制部分(22)由固定在所述发光元件部分(1)固定的基板(4)的固定表面上的多个柱状部分(21)固定 。 这提供了用于放热的发光元件部分(1)和光束控制部分(22)之间的适当间隙。
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公开(公告)号:US08297784B2
公开(公告)日:2012-10-30
申请号:US12835492
申请日:2010-07-13
申请人: Toshiya Ishio , Mitsuru Hineno , Nobuo Ogata , Shinji Suminoe
发明人: Toshiya Ishio , Mitsuru Hineno , Nobuo Ogata , Shinji Suminoe
IPC分类号: F21V1/00
CPC分类号: G02B19/0014 , G02B19/0061 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A surface-emission unit to prevent irregularity in brightness from being generated is provided. The surface-emission unit is composed of light-emission element parts each having a light-emission element, aligned and arranged on a substrate two-dimensionally, and optical lenses each arranged on the substrate with respect to each light-emission element part, to diffuse light from the light-emission element, and a support part to fix the optical lens onto the substrate is arranged so as not overlap a line connecting the light-emission element part corresponding to the optical lens fixed by the support part, to another light-emission element part adjacent to the light-emission element part.
摘要翻译: 提供了防止产生亮度不均的表面发射单元。 表面发射单元由二维排列并排列在基板上的发光元件和相对于每个发光元件部分配置在基板上的光学透镜的发光元件部分组成, 将发光元件的漫射光和将光学透镜固定在基板上的支撑部被配置为不与将与由支撑部固定的光学透镜对应的发光元件部连接到另一个光 - 发光元件部分。
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公开(公告)号:US20120206673A1
公开(公告)日:2012-08-16
申请号:US13502693
申请日:2010-11-09
申请人: Nobuo Ogata , Mitsuru Hineno , Shinji Suminoe
发明人: Nobuo Ogata , Mitsuru Hineno , Shinji Suminoe
IPC分类号: G02F1/13357 , F21V7/00 , F21V9/16 , F21V11/00
CPC分类号: F21K9/50 , F21K9/60 , F21V5/04 , F21V17/101 , F21V23/001 , F21Y2115/10 , G02F1/133603 , G02F1/133606 , G02F1/133611 , G02F2202/28 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要: A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1)is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.
摘要翻译: 本发明的面发光单元是用于经由光通量的光束控制部(22)从发光元件部(1)的LED芯片(6)发光的LED模块(30) 控制部分(2),所述光束控制部分(22)由固定在所述发光元件部分(1)固定的基板(4)的固定表面上的多个柱状部分(21)固定 。 这提供了用于放热的发光元件部分(1)和光束控制部分(22)之间的适当间隙。
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公开(公告)号:US20110013393A1
公开(公告)日:2011-01-20
申请号:US12835492
申请日:2010-07-13
申请人: Toshiya Ishio , Mitsuru Hineno , Nobuo Ogata , Shinji Suminoe
发明人: Toshiya Ishio , Mitsuru Hineno , Nobuo Ogata , Shinji Suminoe
CPC分类号: G02B19/0014 , G02B19/0061 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A surface-emission unit to prevent irregularity in brightness from being generated is provided. The surface-emission unit is composed of light-emission element parts each having a light-emission element, aligned and arranged on a substrate two-dimensionally, and optical lenses each arranged on the substrate with respect to each light-emission element part, to diffuse light from the light-emission element, and a support part to fix the optical lens onto the substrate is arranged so as not overlap a line connecting the light-emission element part corresponding to the optical lens fixed by the support part, to another light-emission element part adjacent to the light-emission element part.
摘要翻译: 提供了防止产生亮度不均的表面发射单元。 表面发射单元由二维排列并排列在基板上的发光元件和相对于每个发光元件部分配置在基板上的光学透镜的发光元件部分组成, 将发光元件的漫射光和将光学透镜固定在基板上的支撑部被配置为不与将与由支撑部固定的光学透镜对应的发光元件部连接到另一个光 - 发光元件部分。
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公开(公告)号:US20110110046A1
公开(公告)日:2011-05-12
申请号:US13002806
申请日:2009-05-07
申请人: Kohji Itoh , Shinji Suminoe , Masato Onoue , Daisuke Takeda
发明人: Kohji Itoh , Shinji Suminoe , Masato Onoue , Daisuke Takeda
IPC分类号: H05K7/20
CPC分类号: H05K7/20963 , G02F1/133308 , G02F2001/133628 , G02F2203/60
摘要: Disclosed is a reinforcement frame (38) fixed to an outer package (37) of a heated component unit in a display (69), wherein a first heat dissipation fin is included in the reinforcement frame (38). With such an arrangement, even when heat generated when a component unit (such as a backlight unit in a liquid crystal display) is driven, e.g. driving heat of various elements included in the component unit, is transmitted to the outer package (37) of the component unit, the driving heat is further transmitted to the reinforcement frame (38) which is in contact with the outer package (37) and dissipated by means of the first heat dissipation fin. Consequently, the various elements in the component unit are not impaired by driving heat.
摘要翻译: 公开了一种固定在显示器(69)中的加热部件单元的外包装(37)上的加强框架(38),其中第一散热片包括在加强框架(38)中。 通过这样的布置,即使当驱动组件单元(诸如液晶显示器中的背光单元)时产生的热量,例如, 包括在部件单元中的各种元件的驱动热量传递到部件单元的外包装(37),驱动热量进一步传递到与外包装(37)接触的加强框架(38)和 通过第一散热片消散。 因此,组件单元中的各种元件不受驱动热的影响。
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公开(公告)号:US08514345B2
公开(公告)日:2013-08-20
申请号:US13111262
申请日:2011-05-19
申请人: Masato Onoue , Shinji Suminoe , Koji Sakai
发明人: Masato Onoue , Shinji Suminoe , Koji Sakai
IPC分类号: G02F1/1333 , G02F1/1335 , F21V7/04
CPC分类号: G02B6/009 , G02B6/0068 , G02B6/0073 , G02F2001/133317
摘要: A backlight unit comprising: a light guide plate for causing light to exit in a planar manner from an upper surface of the light guide plate, the light having entered the light guide plate from an LED; a substrate provided along an end surface of the light guide plate and having an LED mounted on a counter surface of the substrate, the counter surface facing the end surface of the light guide plate; a frame provided along the substrate and attached to the substrate on a rear surface of the substrate, the rear surface being opposite to the counter surface; and one or a plurality of insulating members arranged in such a manner that the one or the plurality of insulating members and the frame sandwich the substrate, the one or the plurality of insulating members each fixing a screw point of a screw inserted from the frame into a through-hole provided through the frame and the substrate.
摘要翻译: 一种背光单元,包括:导光板,用于使光从所述导光板的上表面以平面方式退出,所述光从LED进入所述导光板; 沿着所述导光板的端面设置的基板,具有安装在所述基板的相对面上的LED,所述反面朝向所述导光板的端面; 沿所述基板设置并且在所述基板的后表面上附着到所述基板的框架,所述后表面与所述对置表面相对; 以及一个或多个绝缘构件,其布置成使得所述一个或多个绝缘构件和框架夹持所述基板,所述一个或多个绝缘构件将将从所述框架插入的螺钉的螺钉点固定到 通过所述框架和所述基板设置的通孔。
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公开(公告)号:US20110109834A1
公开(公告)日:2011-05-12
申请号:US13002050
申请日:2009-04-07
申请人: Kohji Itoh , Shinji Suminoe , Masato Onoue , Daisuke Takeda
发明人: Kohji Itoh , Shinji Suminoe , Masato Onoue , Daisuke Takeda
IPC分类号: G02F1/13357 , F21V21/00 , H05K7/00 , H05K7/20
CPC分类号: G02B6/008 , G02B6/0021 , G02B6/0046 , G02B6/0083 , G02B6/0085 , G02F1/133603 , G02F1/133608 , G02F2001/133314 , G02F2001/133628 , H05K7/20963
摘要: Accommodating spots (13) for accommodating circuit elements (25) are formed for the respective circuit elements (25) in an opposing surface (11U), which is one surface of a backlight frame (11) opposed to a circuit element mounting surface (23B) on which the circuit elements (25) are mounted.
摘要翻译: 在与电路元件安装表面(23B)相对的背光框架(11)的一个表面的相对表面(11U)中为各个电路元件(25)形成用于容纳电路元件(25)的容纳点(13) ),其上安装有电路元件(25)。
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公开(公告)号:US20110285937A1
公开(公告)日:2011-11-24
申请号:US13111262
申请日:2011-05-19
申请人: Masato ONOUE , Shinji Suminoe , Koji Sakai
发明人: Masato ONOUE , Shinji Suminoe , Koji Sakai
IPC分类号: G02F1/13357 , F21V7/22
CPC分类号: G02B6/009 , G02B6/0068 , G02B6/0073 , G02F2001/133317
摘要: A backlight unit comprising: a light guide plate for causing light to exit in a planar manner from an upper surface of the light guide plate, the light having entered the light guide plate from an LED; a substrate provided along an end surface of the light guide plate and having an LED mounted on a counter surface of the substrate, the counter surface facing the end surface of the light guide plate; a frame provided along the substrate and attached to the substrate on a rear surface of the substrate, the rear surface being opposite to the counter surface; and one or a plurality of insulating members arranged in such a manner that the one or the plurality of insulating members and the frame sandwich the substrate, the one or the plurality of insulating members each fixing a screw point of a screw inserted from the frame into a through-hole provided through the frame and the substrate.
摘要翻译: 一种背光单元,包括:导光板,用于使光从所述导光板的上表面以平面方式退出,所述光从LED进入所述导光板; 沿着所述导光板的端面设置的基板,具有安装在所述基板的相对面上的LED,所述反面朝向所述导光板的端面; 沿所述基板设置并且在所述基板的后表面上附着到所述基板的框架,所述后表面与所述对置表面相对; 以及一个或多个绝缘构件,其布置成使得所述一个或多个绝缘构件和框架夹持所述基板,所述一个或多个绝缘构件将将从所述框架插入的螺钉的螺钉点固定到 通过所述框架和所述基板设置的通孔。
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公开(公告)号:US07646094B2
公开(公告)日:2010-01-12
申请号:US11699077
申请日:2007-01-29
申请人: Shinji Suminoe
发明人: Shinji Suminoe
IPC分类号: H01L23/02
CPC分类号: H01L23/49811 , H01L23/057 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195 , H01L2924/16788 , H01L2924/3025 , H05K3/3442 , H05K2201/0212 , H05K2201/0221 , H05K2201/10727 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device (10) includes: a substrate (1), including an electrode pad (1a); an IC chip (4), mounted on the substrate (1); and an externally connecting terminal (7), formed on the electrode pad (1a) and electrically connected with the IC chip (4), the externally connecting terminal (7) including a resin core (7a) made of an elastic material and including a metal layer (7b) formed outside the resin core (7a), thereby providing a semiconductor device having high packaging reliability.
摘要翻译: 半导体器件(10)包括:包括电极焊盘(1a)的衬底(1); 安装在所述基板(1)上的IC芯片(4); 以及形成在所述电极焊盘(1a)上并与所述IC芯片(4)电连接的外部连接端子(7),所述外部连接端子(7)包括由弹性材料制成的树脂芯体(7a) 金属层(7b)形成在树脂芯(7a)的外侧,从而提供具有高封装可靠性的半导体器件。
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