摘要:
A functional optical device has cores which are trenches, different portions of the cores being formed from different core materials. The optical device can be formed by forming trenches 5,7,9 within a substrate (normally a substrate 1 covered by a cladding layer 3), covering at least part of at least one trench 7 with a cover 11, depositing a first cladding material to fill the trenches 5,9 which are not covered, removing the cover 11, depositing a second cladding layer 15 of a second cladding material to fill the trenches 7 which were previously covered, removing core material outside the trenches 5,7,9 and applying a cladding layer to cover the trenches.
摘要:
A functional optical device has cores which are trenches, different portions of the cores being formed from different core materials. The optical device can be formed by forming trenches 5,7,9 within a substrate (normally a substrate 1 covered by a cladding layer 3), covering at least part of at least one trench 7 with a cover 11, depositing a first cladding material to fill the trenches 5,9 which are not covered, removing the cover 11, depositing a second cladding layer 15 of a second cladding material to fill the trenches 7 which were previously covered, removing core material outside the trenches 5,7,9 and applying a cladding layer to cover the trenches.
摘要:
A functional optical device has cores which are trenches, different portions of the cores being formed from different core materials. The optical device can be formed by forming trenches 5, 7, 9 within a substrate (normally a substrate 1 covered by a cladding layer 3), covering at least part of at least one trench 7 with a cover 11, depositing a first cladding layer 13 of a first cladding material to fill the trenches 5, 9 which are not covered, removing the cover 11, depositing a second cladding layer 15 of a second cladding material to fill the trenches 7 which were previously covered, removing core material outside the trenches 5, 7, 9, and applying a cladding layer to cover the trenches.
摘要:
An optical waveguide apparatus comprises a substrate (1), a patterned waveguide as a core (4), and an upper cladding layer (10) formed on the substrate. The core is surrounded by a cladding comprising the substrate as a lower cladding layer and the upper cladding layer and smaller in refractive index than the core. The core and the cladding are integrally coupled to each other in a manner such that temperature-dependent expansion or contraction is performed substantially in accordance the characteristic of the cladding. The core and the cladding are made of materials selected so that the variation in optical path length according to the temperature-dependent expansion or contraction of the cladding is canceled by the variation in optical path length according to temperature-dependent variation in refractive index of the core.
摘要:
A solid-state imaging device 1 according to one embodiment of the present invention is a charge multiplying solid-state imaging device, and includes an imaging area 10 that generates a charge according to the amount of incident light, a plurality of output register units 21 to 24 that receive the charge from the imaging area 10, and a plurality of multiplication register units 31 to 34 that multiply charges from the output registers 21 to 24, respectively, and the multiplication register units 31 to 34 are different in the number of multiplication stages from each other.
摘要:
In a back-illuminated solid-state image pickup device including a semiconductor substrate 4 having a light incident surface at a back surface side and a charge transfer electrode 2 disposed at a light detection surface at an opposite side of the semiconductor substrate 4 with respect to the light incident surface, the light detection surface has an uneven surface. By the light detection surface having the uneven surface, etaloning is suppressed because lights reflected by the uneven surface have scattered phase differences with respect to a phase of incident light and resulting interfering lights offset each other. A high quality image can thus be acquired by the back-illuminated solid-state image pickup device.
摘要:
A solid-state imaging device 1 according to one embodiment of the present invention is a charge multiplying solid-state imaging device, and includes an imaging area 10 that generates a charge according to the amount of incident light, an output register unit 20 that receives the charge from the imaging area 10, and a multiplication register unit 28 that multiplies the charge from the output register 20, and performs feed-forward control of the multiplication factor of the multiplication register unit 28 according to the charge amount from the imaging area 10.
摘要:
A multi-port solid-state imaging device of one embodiment includes an imaging region and a plurality of units. The imaging region contains a plurality of pixel columns. The units are arrayed in a direction in which the pixel columns are arrayed, and generate signals based on charges from the imaging region. Each unit has an output register, a multiplication register, and an amplifier. The output register transfers a charge from one or more corresponding pixel columns. The multiplication register receives the charge from the output register to generate a multiplied charge. The amplifier generates a signal based on the multiplied charge from the multiplication register. The solid-state imaging device contains a region where the units are provided, and a first dummy region and a second dummy region located on both sides in the above-mentioned direction of the region. In each of the first dummy region and the second dummy region, a multiplication register and an amplifier are provided.
摘要:
Provided are a wiring board capable of mounting either a frontside incident type solid-state imaging element and a backside incident type solid-state imaging element and a solid-state imaging device. The wiring board 1 is a wiring board having a to-be-arranged region 1a at which the solid-state imaging element is arranged, and is provided with a plurality of first electrode pads 12 formed inside the to-be-arranged region 1a and a plurality of second electrode pads 13 formed outside the to-be-arranged region 1a, each of which is electrically connected to each of the first electrode pads 12. Further, the solid-state imaging device mounts the backside incident type solid-state imaging element or the frontside incident type solid-state imaging element on the wiring board 1.
摘要:
A semiconductor energy detector as disclosed herein is arranged so that an aluminum wiring pattern is formed on the front side of transfer electrodes of a CCD vertical shift register, which pattern includes meander-shaped auxiliary wirings for performing auxiliary application/supplement and additional wirings for performing auxiliary supplement of transfer voltages in a way independent of the auxiliary wirings with respective ones of such wirings being connected to corresponding transfer electrodes to thereby avoid a problem as to lead resistivities at those transfer electrodes made of polycrystalline silicon, thus achieving the intended charge transfer at high speeds with high efficiency.