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11 条记录 (耗时 0.016 秒)

    SILVER PASTE
    1.
    发明申请
    SILVER PASTE 有权

    公开(公告)号：US20220089885A1

    公开(公告)日：2022-03-24

    申请号：US17417905

    申请日：2019-11-28

    申请人： SHOEI CHEMICAL INC.

    发明人： Kousuke Nishimura ,  Naoto Shindo ,  Hiroshi Mashima

    IPC分类号： C09D5/24 ,  C09D7/61 ,  C09D7/40 ,  C09D101/02 ,  H01B1/22 ,  B22F1/10 ,  B22F1/05

    摘要： The present invention provides a silver paste, containing at least a silver powder, a binder resin, and an organic solvent, in which a content of the silver powder based on the silver paste is 80.00 to 97.00% by mass, D10 is 1.00 to 3.00 μm and D50 is 3.00 to 7.00 μm, where D10 and D50 respectively represent a 10% value and a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement of the silver powder, the silver powder has a specific surface area of 0.10 to 0.30 m2/g, the silver powder has a copper content of 10 to 5000 ppm by mass, a content of the binder resin based on the silver powder is 0.430 to 0.750% by mass, and the silver paste has a dry film density of 7.50 g/cm3 or more.

    CONDUCTIVE PASTE
    2.
    发明申请
    CONDUCTIVE PASTE 有权

    公开(公告)号：US20210323859A1

    公开(公告)日：2021-10-21

    申请号：US16322891

    申请日：2017-07-18

    申请人： SHOEI CHEMICAL INC.

    发明人： Hayato Tateno ,  Junichi Ikuno ,  Hiroshi Mashima

    IPC分类号： C03C8/04 ,  H01C1/14 ,  H01C17/28 ,  H01B1/22 ,  C03C8/18

    摘要： A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.

    Silver paste
    4.
    发明授权
    Silver paste 有权

    公开(公告)号：US11535767B2

    公开(公告)日：2022-12-27

    申请号：US17417895

    申请日：2019-11-28

    申请人： SHOEI CHEMICAL INC.

    发明人： Kousuke Nishimura ,  Naoto Shindo ,  Hiroshi Mashima ,  Yuji Akimoto

    IPC分类号： C09D11/52 ,  B22F1/107 ,  C09D11/033 ,  C09D11/037 ,  C09D11/14 ,  H01B1/22

    摘要： The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, wherein the silver powder contains a first silver powder having a D50 of 3.50 to 7.50 μm and a second silver powder having a D50 of 0.80 to 2.00 μm, where D50 represents a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement; a copper content of the whole silver powder is 10 to 5000 ppm by mass; a copper content of the second silver powder is 80 ppm by mass or more; and the first silver powder contains substantially no copper. The present invention provides a silver paste containing a powder in a high concentration and excellent in printability, and provides a silver conductor film that has a high filling factor, a high film density, high electrical conductivity, and excellent migration resistance.

    SILVER PASTE
    5.
    发明申请
    SILVER PASTE 有权

    公开(公告)号：US20220072607A1

    公开(公告)日：2022-03-10

    申请号：US17417885

    申请日：2019-11-28

    申请人： SHOEI CHEMICAL INC.

    发明人： Kousuke Nishimura ,  Naoto Shindo ,  Hiroshi Mashima

    IPC分类号： B22F1/00 ,  C08K3/08 ,  H01B1/22 ,  H01F27/29

    摘要： The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, in which a value CBND/SBET is 2.0 to 3.4 where SBET (m2/g) represents a specific surface area of the silver powder, and CBND (% by mass) represents a content percentage of the binder resin based on the silver powder, a copper content of the silver powder is 10 to 5000 ppm by mass, and the silver paste has a dry film density of 7.50 g/cm3 or more. The present invention can provide a silver paste containing a powder in a high concentration and excellent in printability, and accordingly provide a silver conductor film that has a high filling factor and a high film density, exhibits high electrical conductivity, and is excellent in migration resistance.

    Resistive composition
    6.
    发明授权
    Resistive composition 有权

    公开(公告)号：US10446290B2

    公开(公告)日：2019-10-15

    申请号：US15718802

    申请日：2017-09-28

    申请人： Shoei Chemical Inc.

    发明人： Hiroshi Mashima ,  Yukari Morofuji

    IPC分类号： H01B1/20 ,  C03C8/02 ,  C03C8/04 ,  C03C8/10 ,  C03C8/16 ,  C09D5/24 ,  H01C7/00 ,  C03C3/066 ,  C03C3/074 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C14/00

    摘要： A resistive composition that can form a thick film resistor excluding a toxic lead component from a conductive component and glass and having characteristics equivalent to or superior to conventional resistors in terms of, in a wide resistance range, resistance values, TCR characteristics, current noise characteristics, withstand voltage characteristics and the like. The resistive composition of the present invention includes: ruthenium-based conductive particles including ruthenium dioxide; a glass frit that is essentially free of a lead component; and an organic vehicle, wherein the glass frit is a glass frit which is constituted such that in a case where a fired product of a mixture of the glass frit and the ruthenium dioxide has in a range of 1 kΩ/□ to 1 MΩ/□, the fired product exhibits a temperature coefficient of resistance in a plus range.

    Conductive paste
    9.
    发明授权
    Conductive paste 有权

    公开(公告)号：US11183315B2

    公开(公告)日：2021-11-23

    申请号：US16322891

    申请日：2017-07-18

    申请人： SHOEI CHEMICAL INC.

    发明人： Hayato Tateno ,  Junichi Ikuno ,  Hiroshi Mashima

    IPC分类号： H01B1/22 ,  C03C8/04 ,  C03C8/18

    摘要： A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B2O3, 25 to 50 mol % Si in terms of SiO2, 7 to 23 mol % Al in terms of Al2O3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.