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公开(公告)号：US07641966B2
公开(公告)日：2010-01-05
申请号：US10013543
申请日：2001-12-13
CPC分类号： C09J7/385 , C09J2203/326 , Y10T428/2809 , Y10T428/2861 , Y10T428/2896
摘要： A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.
摘要翻译： 一种可固化的再剥离粘合剂，当经受由辐射照射引起的固化反应时，表现出足够的粘附力降低，并且使被粘物由于由固化反应引起的收缩力而变形到最小程度。 再释放粘合剂含有包含主链和多个分子内侧链的辐射反应性聚合物，每个这样的侧链具有末端碳 - 碳双键，以原子数计为6个或更多个链长度， 并且与聚合物中每个其它侧链相同或不同数目的原子。 剥离粘合剂显示出通过照射时的固化反应产生的收缩力为30MPa以下。 还公开了一种再剥离粘合片，包括在其一个表面上设置有基底膜和含有再释放粘合剂的粘合剂层。
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公开(公告)号：US08492791B2
公开(公告)日：2013-07-23
申请号：US13325850
申请日：2011-12-14
申请人： Takashi Ozaki , Takashi Kondo , Koji Akazawa
发明人： Takashi Ozaki , Takashi Kondo , Koji Akazawa
CPC分类号： H01L33/644 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.
摘要翻译： 本发明涉及一种光学半导体器件，包括：其上安装有LED芯片的衬底; 嵌入LED芯片的封装树脂层; 无机高导热层; 以及包含无机荧光体粉末的波长转换层，其中密封树脂层，无机高热传导层和波长转换层按顺序直接或间接地层压在基板上。
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公开(公告)号：US07521122B2
公开(公告)日：2009-04-21
申请号：US10876651
申请日：2004-06-28
CPC分类号： B32B27/08 , B32B27/26 , B32B27/38 , B32B2457/00 , H01L21/56 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/3157 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/3025 , Y10T29/49002 , Y10T428/12528 , Y10T428/24802 , Y10T428/24942 , Y10T428/265 , Y10T428/31551 , Y10T428/31565 , H01L2924/00014 , H01L2224/13099 , H01L2924/01028 , H01L2924/00 , H01L2924/3512
摘要： A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40° to 80° C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25° C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.
摘要翻译： 一种用于在研磨晶片背面的步骤中粘附到突出的电极安装晶片的电路侧的层压片，其中所述层叠片材至少包括与电路侧接触的层（层A），其由热固性 树脂，直接层压在层A上的由在40℃至80℃下的拉伸模量为1至300MPa的热塑性树脂制成的层（层B）和由 在至少25℃的温度下是非塑性的热塑性树脂; 一种制造半导体器件的方法，包括以下步骤：研磨投影电极安装晶片的背面，其中所述层压片粘附到所述晶片的电路侧，除去所述层压片的层A之外的其它层，以及切割 晶圆成为单芯片; 以及可通过该方法获得的半导体器件。
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公开(公告)号：US5476565A
公开(公告)日：1995-12-19
申请号：US180385
申请日：1994-01-12
申请人： Yuzo Akada , Koji Akazawa , Keiji Nakamoto
发明人： Yuzo Akada , Koji Akazawa , Keiji Nakamoto
IPC分类号： C09J7/02 , C09J4/00 , C09J163/00 , H01L21/301 , H01L21/302 , H01L21/58 , H01L21/68 , B32B31/00
CPC分类号： H01L21/6836 , H01L21/302 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2224/83194 , H01L2224/8385 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , Y10T428/24826 , Y10T428/2486 , Y10T428/28 , Y10T428/2809 , Y10T428/2848 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/2891
摘要： A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.
摘要翻译： 一种切割/芯片接合薄膜，其具有紫外线透射性基板，其上设有紫外线固化型粘合剂层和粘合剂层，所述粘合剂层已被部分紫外线固化以具有固化部分和未固化 部分。 该膜在切割和释放性能方面具有用于支撑半导体晶片的保持力的良好平衡的组合，以使切割的芯片能够与粘合剂层一起容易地释放，使得即使大于10mm×10mm的大尺寸芯片也可以容易地 被拾起
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公开(公告)号：US09190584B2
公开(公告)日：2015-11-17
申请号：US13017063
申请日：2011-01-31
申请人： Takashi Kondo , Koji Akazawa , Takashi Ozaki
发明人： Takashi Kondo , Koji Akazawa , Takashi Ozaki
CPC分类号： H01L33/56 , B29C43/18 , H01L33/50 , H01L33/505 , H01L33/507 , H01L2224/48227 , H01L2933/005 , H05B33/04 , Y10T428/31663
摘要： The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.
摘要翻译： 光半导体装置技术领域本发明涉及一种光半导体装置，其通过以下方式制备：将包含能够嵌入光半导体元件的封装树脂层和含有光波长转换粒子的波长转换层的光半导体元件封装用片， 在光学半导体元件安装基板上直接或间接地层叠在封装树脂层上，使得封装树脂层面向光半导体元件安装基板; 接着进行压缩成型，其中波长转换层存在于其中嵌入光半导体元件的成型体的上部，但不存在于成型体的侧表面上。
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公开(公告)号：US20120153345A1
公开(公告)日：2012-06-21
申请号：US13325850
申请日：2011-12-14
申请人： Takashi Ozaki , Takashi Kondo , Koji Akazawa
发明人： Takashi Ozaki , Takashi Kondo , Koji Akazawa
CPC分类号： H01L33/644 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.
摘要翻译： 本发明涉及一种光学半导体器件，包括：其上安装有LED芯片的衬底; 嵌入LED芯片的封装树脂层; 无机高导热层; 以及包含无机荧光体粉末的波长转换层，其中密封树脂层，无机高热传导层和波长转换层按顺序直接或间接地层压在基板上。
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公开(公告)号：US20050008873A1
公开(公告)日：2005-01-13
申请号：US10876651
申请日：2004-06-28
IPC分类号： B32B27/00 , B32B27/08 , H01L21/00 , H01L21/304 , H01L21/56 , H01L21/60 , H01L21/68 , H01L23/00 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31
CPC分类号： B32B27/08 , B32B27/26 , B32B27/38 , B32B2457/00 , H01L21/56 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/3157 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/3025 , Y10T29/49002 , Y10T428/12528 , Y10T428/24802 , Y10T428/24942 , Y10T428/265 , Y10T428/31551 , Y10T428/31565 , H01L2924/00014 , H01L2224/13099 , H01L2924/01028 , H01L2924/00 , H01L2924/3512
摘要： A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40° to 80° C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25° C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.
摘要翻译： 一种用于在研磨晶片背面的步骤中粘附到突出的电极安装晶片的电路侧的层压片，其中所述层叠片材至少包括与电路侧接触的层（层A），其由热固性 树脂，直接层压在层A上的由在40℃至80℃下的拉伸模量为1至300MPa的热塑性树脂制成的层（层B）和由 在至少25℃的温度下是非塑性的热塑性树脂; 一种制造半导体器件的方法，包括以下步骤：研磨投影电极安装晶片的背面，其中所述层压片粘附到所述晶片的电路侧，除去所述层压片的A层以外的其它层，以及切割 晶圆成为单芯片; 以及可通过该方法获得的半导体器件。
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公开(公告)号：US5304418A
公开(公告)日：1994-04-19
申请号：US998847
申请日：1992-12-30
申请人： Yuzo Akada , Koji Akazawa , Keiji Nakamoto
发明人： Yuzo Akada , Koji Akazawa , Keiji Nakamoto
IPC分类号： C09J7/02 , C09J4/00 , C09J163/00 , H01L21/301 , H01L21/302 , H01L21/58 , H01L21/68 , B32B7/12
CPC分类号： H01L21/6836 , H01L21/302 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2224/83194 , H01L2224/8385 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , Y10T428/24826 , Y10T428/2486 , Y10T428/28 , Y10T428/2809 , Y10T428/2848 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/2891
摘要： A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.
摘要翻译： 一种切割/芯片接合薄膜，其具有紫外线透射性基板，其上设有紫外线固化型粘合剂层和粘合剂层，所述粘合剂层已被部分紫外线固化以具有固化部分和未固化 部分。 该薄膜在切割和释放性能方面具有用于支撑半导体晶片的保持力的良好平衡的组合，以使切割的芯片能够与粘合剂层一起容易地释放，使得即使大于10mm×10mm的大尺寸芯片 可以很容易地拿起来
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