SELF-ALIGNED VERTICAL NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    3.
    发明申请
    SELF-ALIGNED VERTICAL NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 审中-公开
    自对准垂直非线性半导体存储器件

    公开(公告)号:US20140167134A1

    公开(公告)日:2014-06-19

    申请号:US13514032

    申请日:2012-02-02

    IPC分类号: H01L27/115

    摘要: The present invention belongs to the technical field of semiconductor memory devices and specifically relates to a self-aligned vertical nonvolatile semiconductor memory device, Including: a semiconductor substrate, a drain region of a first doping type, two source regions of a second doping type, a stacked gate used to capture electrons; wherein the drain region, the two source regions and the stacked gate form two tunneling field effect transistors (TFETs) sharing one gate and one drain, the drain region current of each of the TFET is affected by the quantity and distribution of the charges in the stacked gate used to capture electrons, the drain is buried in the semiconductor substrate, the source regions above the drain region are separated from the drain through a channel and separated form each other through a region of the first doping type. The semiconductor memory device of the present invention features small unit area and simple manufacturing process. The memory chip using the present invention is of low manufacturing cost and high storage density.

    摘要翻译: 本发明属于半导体存储器件的技术领域,具体涉及一种自对准的垂直非易失性半导体存储器件,包括:半导体衬底,第一掺杂类型的漏极区域,第二掺杂型的两个源极区域, 用于捕获电子的堆叠栅; 其中漏极区域,两个源极区域和堆叠的栅极形成共享一个栅极和一个漏极的两个隧道场效应晶体管(TFET),每个TFET的漏极区域电流受到电荷的量和分布的影响 用于捕获电子的堆叠栅极,漏极埋在半导体衬底中,漏极区域上方的源极区域通过沟道与漏极分离,并通过第一掺杂类型的区域彼此分离。 本发明的半导体存储器件具有小的单位面积和简单的制造工艺。 使用本发明的存储芯片的制造成本低,存储密度高。

    SEMICONDUCTOR MEMORY STRUCTURE AND ITS MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SEMICONDUCTOR MEMORY STRUCTURE AND ITS MANUFACTURING METHOD THEREOF 审中-公开
    半导体存储器结构及其制造方法

    公开(公告)号:US20140034891A1

    公开(公告)日:2014-02-06

    申请号:US13376994

    申请日:2011-08-15

    IPC分类号: H01L27/24

    摘要: The present invention belongs to the technical field of microelectronic devices, specifically relates to a semiconductor memory structure and its manufacturing method thereof. The semiconductor memory structure which carries out erasing, writing and reading operation on the phase change memory or the resistance change memory through a tunneling field-effect transistor is formed, for one hand, the high current passed through the tunneling field-effect transistor when the p-n junction the biased positively, meeting the high current requirements for erasing of and writing of the phase change memory and the resistance change memory, and on the other hand, Vertical structure of the field-effect transistor can greatly improve the density of memory devices arrays. The present invention also discloses a method, which is very suitable for the memory chips, for the manufacturing of the semiconductor memory structure using self-aligned process.

    摘要翻译: 本发明属于微电子器件的技术领域,具体涉及一种半导体存储器结构及其制造方法。 形成通过隧道场效应晶体管对相变存储器或电阻变化存储器进行擦除,写入和读取操作的半导体存储器结构,一方面,当电流通过隧道场效应晶体管时, pn结积极偏置,满足擦除和写入相变存储器和电阻变化存储器的高电流要求,另一方面,场效应晶体管的垂直结构可以大大提高存储器件阵列的密度 。 本发明还公开了一种非常适用于存储芯片的方法,用于使用自对准工艺制造半导体存储器结构。

    Method for manufacturing a gate-control diode semiconductor memory device
    5.
    发明授权
    Method for manufacturing a gate-control diode semiconductor memory device 有权
    栅极控制二极管半导体存储器件的制造方法

    公开(公告)号:US08574958B2

    公开(公告)日:2013-11-05

    申请号:US13535032

    申请日:2012-06-27

    IPC分类号: H01L21/00

    CPC分类号: H01L29/7391 H01L29/8616

    摘要: This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor storage device. When the floating gate voltage is relatively high, the channel under the floating gate is of n type and a simple gate-control pn junction structure is configured; by controlling effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through a floating gate and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed while the quantity of charges in the floating gate determines the device threshold voltage, thus realizing memory functions. This invention features capacity of manufacturing gate-control diode memory devices able to reduce the chip power consumption through advantages of high driving current and small sub-threshold swing. This invention is applicable to semiconductor devices manufacturing based on flexible substrate and flat panel displays and floating gate memories, etc.

    摘要翻译: 本发明属于半导体器件制造领域,并且公开了一种用于制造栅极控制二极管半导体存储器件的方法。 当浮动栅极电压相对较高时,浮动栅极下的沟道为n型,并配置了简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度,通过浮栅将n型ZnO反转为p型,并使用NiO作为p型半导体,形成npnp掺杂结构, 浮动门中的电荷决定了器件的阈值电压,从而实现了存储器的功能。 本发明具有制造栅极控制二极管存储器件的能力,其能够通过高驱动电流和小的次级阈值摆动的优点来降低芯片功耗。 本发明适用于基于柔性基板和平板显示器和浮动栅极存储器等的半导体器件制造。

    Method for manufacturing semiconductor substrate of large-power device
    6.
    发明授权
    Method for manufacturing semiconductor substrate of large-power device 有权
    大功率器件半导体衬底的制造方法

    公开(公告)号:US08557678B2

    公开(公告)日:2013-10-15

    申请号:US13498144

    申请日:2011-11-18

    IPC分类号: H01L21/30 H01L21/46

    摘要: The invention belongs to the technical field of high-voltage, large-power devices and in particular relates to a method for manufacturing a semiconductor substrate of a large-power device. According to the method, the ion implantation is carried out on the front face of a floating zone silicon wafer first, then a high-temperature resistant metal is used as a medium to bond the back-off floating zone silicon wafer, and a heavily CZ-doped silicon wafer forms the semiconductor substrate. After bonding, the floating zone silicon wafer is used to prepare an insulated gate bipolar transistor (IGBT), and the heavily CZ-doped silicon wafer is used as the low-resistance back contact, so the required amount of the floating zone silicon wafers used is reduced, and production cost is lowered. Meanwhile, the back metallization process is not required after bonding, so the processing procedures are simplified, and the production yield is enhanced.

    摘要翻译: 本发明属于高压大功率器件的技术领域,特别涉及大功率器件的半导体衬底的制造方法。 根据该方法,首先在浮动区硅晶片的正面进行离子注入,然后使用耐高温金属作为介质来接合浮渣区硅晶片,并且重CZ 掺杂硅晶片形成半导体衬底。 在接合之后,使用浮动区硅晶片来制备绝缘栅双极晶体管(IGBT),并且将重CZ掺杂的硅晶片用作低电阻背接触,因此使用所需量的浮区硅晶片 降低了生产成本。 同时,接合后不需要背面金属化处理,因此简化了处理程序,并且提高了生产成品率。

    MULTI-STRAND STEEL CORD WITH WAVED CORE STRAND
    7.
    发明申请
    MULTI-STRAND STEEL CORD WITH WAVED CORE STRAND 有权
    多条钢丝绳带波纹芯线

    公开(公告)号:US20130261223A1

    公开(公告)日:2013-10-03

    申请号:US13991969

    申请日:2011-11-15

    IPC分类号: D07B1/06

    摘要: A steel cord (10) adapted for the reinforcement of elastomeric products comprises a core strand (12) and a layer of outer strands (14) arranged around the core strand (12). The core strand (12) comprises a core and at least a layer arranged around the core. The core further comprises one to three core filaments and the layer further comprises three to nine layer filaments. The core strand (12) has a first wave form and each filament of the outer strands (14) has a second wave form such that the first wave form is substantially different from the second wave form. This allows to guarantee full rubber penetration.

    摘要翻译: 适于增强弹性体产品的钢丝帘线(10)包括芯线(12)和围绕芯股线(12)布置的外股线(14)层。 芯股线(12)包括芯部和至少围绕芯部布置的层。 核心还包括一至三根芯丝,并且该层还包含三至九层细丝。 芯股线(12)具有第一波形,并且外股线(14)的每个细丝具有第二波形,使得第一波形与第二波形基本不同。 这样可以保证橡胶的完全渗透。

    METHOD FOR MANUFACTURING A GATE-CONTROL DIODE SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD FOR MANUFACTURING A GATE-CONTROL DIODE SEMICONDUCTOR DEVICE 有权
    制造门控二极管半导体器件的方法

    公开(公告)号:US20130178013A1

    公开(公告)日:2013-07-11

    申请号:US13534983

    申请日:2012-06-27

    IPC分类号: H01L21/34

    摘要: This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor device. When the gate voltage is relatively high, the channel under the gate has an n type and the device has a simple gate-control pn junction structure; by way of controlling the effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through the gate and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed. The present invention features capacity of manufacturing gate-control diode devices able to reduce the chip power consumption through the advantages of a high driving current and small sub-threshold swing, is especially applicable to the manufacturing of reading & writing devices having flat panel displays & phase change memory, and semiconductor devices based on flexible substrates.

    摘要翻译: 本发明属于半导体器件制造领域,并且公开了一种用于制造栅极控制二极管半导体器件的方法。 当栅极电压相对较高时,栅极下方的沟道具有n型,器件具有简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度,通过栅极将n型ZnO转换成p型并使用NiO作为p型半导体,形成n-p-n-p掺杂结构。 本发明特征在于能够通过高驱动电流和小的次阈值摆幅的优点来制造能够降低芯片功耗的栅极控制二极管器件的能力,特别适用于具有平板显示器的读写装置的制造, 相变存储器以及基于柔性基板的半导体器件。

    METHOD FOR MANUFACTURING A TUNNELING FIELD EFFECT TRANSISTOR WITH A U-SHAPED CHANNEL
    9.
    发明申请
    METHOD FOR MANUFACTURING A TUNNELING FIELD EFFECT TRANSISTOR WITH A U-SHAPED CHANNEL 有权
    用U形通道制造隧道场效应晶体管的方法

    公开(公告)号:US20130149824A1

    公开(公告)日:2013-06-13

    申请号:US13537956

    申请日:2012-06-29

    IPC分类号: H01L21/336

    摘要: The present invention belongs to the technical field of semiconductor device manufacturing and specifically relates to a method for manufacturing a tunneling field effect transistor with a U-shaped channel. The U-shaped channel can effectively extend the transistor channel length, restrain the generation of leakage current in the transistor, and decrease the chip power consumption. The method for manufacturing a tunneling field effect transistor with a U-shaped channel put forward in the present invention is capable of realizing an extremely narrow U-shaped channel, overcoming the alignment deviation introduced by photoetching, and improving the chip integration degree.

    摘要翻译: 本发明属于半导体器件制造的技术领域,具体涉及一种具有U形沟道的隧道效应晶体管的制造方法。 U型通道可以有效地延长晶体管沟道长度,抑制晶体管中漏电流的产生,降低芯片功耗。 本发明提出的具有U形通道的隧道场效应晶体管的制造方法能够实现非常窄的U形沟道,克服由光刻引入的取向偏差,提高芯片集成度。

    METHOD FOR MANUFACTURING A FLEXIBLE TRANSPARENT 1T1R STORAGE UNIT BASED ON A COMPLETELY LOW-TEMPERATURE PROCESS
    10.
    发明申请
    METHOD FOR MANUFACTURING A FLEXIBLE TRANSPARENT 1T1R STORAGE UNIT BASED ON A COMPLETELY LOW-TEMPERATURE PROCESS 审中-公开
    基于完全低温过程制造柔性透明1T1R储存单元的方法

    公开(公告)号:US20130078761A1

    公开(公告)日:2013-03-28

    申请号:US13528462

    申请日:2012-06-20

    IPC分类号: H01L21/336

    摘要: The present invention belongs to the technical field of low temperature atomic layer deposition technology, and specifically relates to a method for manufacturing a flexible transparent 1T1R storage unit. In the present invention, a fully transparent 1T1R storage unit is developed on a flexible substrate through a completely low-temperature process, including an oxide layer dielectric, a transparent electrode and a transparent substrate which are deposited together through a low-temperature process, thus realizing a fully transparent device capable of achieving the functions of nontransparent devices. The present invention can be applied to the manufacturing of flexible low-temperature storage units in the future, as well as changing the packaging and existing modes of devices, which will make foldable and bendable portable storage units possible.

    摘要翻译: 本发明属于低温原子层沉积技术的技术领域,具体涉及柔性透明1T1R存储单元的制造方法。 在本发明中,完全透明的1T1R存储单元通过完全低温处理在柔性基板上开发,包括通过低温工艺沉积在一起的氧化物层电介质,透明电极和透明衬底,因此 实现能够实现非透明设备功能的完全透明的设备。 本发明可以应用于将来的柔性低温存储单元的制造,以及改变装置的现有模式,这使得可折叠和可弯曲的便携式存储装置成为可能。