公开(公告)号：US5309108A

公开(公告)日：1994-05-03

申请号：US921583

申请日：1992-07-30

申请人： Shunji Maeda ,  Hitoshi Kubota ,  Makoto Ono

发明人： Shunji Maeda ,  Hitoshi Kubota ,  Makoto Ono

IPC分类号： G06T7/00 ,  G09G3/00 ,  G01R31/02 ,  G06K9/00

CPC分类号： G09G3/006 ,  G06T7/001 ,  G06T2207/10048 ,  G06T2207/30121

摘要： The invention relates to a method of inspecting and correcting a thin film transistor liquid crystal substrate and an apparatus therefor, where a plurality of scan lines and signal lines are connected electrically in common at each one terminal side respectively, and an infrared image outside the pixel domain is detected after lapse of a prescribed time from the time point of applying voltage between the scan lines and the signal lines, and an infrared image outside the pixel domain is detected after lapse of a prescribed time from the time point of stopping the voltage application, and the scan lines and the signal lines relating to variation of the heating state are detected from difference or quotient between an infrared image at the voltage applying state and an infrared image at the stopping state of voltage application, thereby a pixel address with a shortcircuit defect occurring is specified. If an image part being equal to the set threshold value or more does not exist in the difference infrared image in the pixel address, a wiring pattern position in the pixel address is detected from a visible image of the pixel address, and this wiring pattern and one from a neighboring pixel address are compared to detect a short circuit defect which can be removed by laser.

摘要翻译： 本发明涉及一种薄膜晶体管液晶基板的检查和校正方法及其装置，其中多个扫描线和信号线分别在每个一个端子侧共同电连接，并且在该像素之外的红外图像 在从施加扫描线和信号线之间的电压的时间点经过规定时间之后检测域，并且在从停止施加电压的时间点经过规定时间之后检测像素域外的红外图像 ，并且在电压施加状态下的红外图像与在施加电压的停止状态的红外图像之间的差或商检测与加热状态的变化相关的扫描线和信号线，从而具有短路的像素地址 指定缺陷发生。 如果像素地址中的差异红外图像中不存在等于设定阈值的图像部分，则从像素地址的可视图像检测像素地址中的布线图案位置，并且该布线图案和 比较来自相邻像素地址的一个，以检测可以通过激光去除的短路缺陷。

公开(公告)号：US07061600B2

公开(公告)日：2006-06-13

申请号：US10098478

申请日：2002-03-18

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.

公开(公告)号：US06263099B1

公开(公告)日：2001-07-17

申请号：US09107432

申请日：1998-06-30

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G06K900

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

摘要翻译： 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

公开(公告)号：US4791586A

公开(公告)日：1988-12-13

申请号：US812928

申请日：1985-12-23

申请人： Shunji Maeda ,  Hitoshi Kubota ,  Satoru Fushimi ,  Hiroshi Makihira ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Shunji Maeda ,  Hitoshi Kubota ,  Satoru Fushimi ,  Hiroshi Makihira ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： H01L21/66 ,  G06T7/00 ,  G06K9/00

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30148

摘要： Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.

摘要翻译： 用于检查具有相同功能的IC结构的多层图案的几何形状的方法和装置，每个多层图案包括布置在不同层级中的层图案，其中对应于多层图案中的任何两个的电图像信号 并且具有两个以上的级别彼此登记，然后进行比较以确定不匹配和匹配的部分。 登记的电图像信号的比较可以相对于它们的振幅或梯度进行。 对于所有的层图案，可以对匹配的部分不再进行注册和比较来重复两个电图像信号的配准和比较。 如果有的话，经过所述登记和比较的电子图像信号的最终不匹配的部分产生缺陷检测信号。

公开(公告)号：US20080302964A1

公开(公告)日：2008-12-11

申请号：US12190388

申请日：2008-08-12

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： G01N23/00 ,  G01R31/305

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined changed state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.

摘要翻译： 电路图案检查方法及其装置，其中待检查的样品的待检查部分的整体部分处于预定的改变状态，被检查的部分用成像高分辨率照射， 在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

公开(公告)号：US20050052642A1

公开(公告)日：2005-03-10

申请号：US10893988

申请日：2004-07-20

申请人： Yukihiro Shibata ,  Shunji Maeda ,  Hitoshi Kubota

发明人： Yukihiro Shibata ,  Shunji Maeda ,  Hitoshi Kubota

IPC分类号： G01B11/30 ,  G01N21/13 ,  G01N21/15 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956 ,  G06K9/00 ,  H01L21/66

CPC分类号： G01N21/9501 ,  G01N21/13 ,  G01N21/8806 ,  G01N21/95607 ,  G01N21/95623 ,  G01N2021/154 ,  G01N2021/8825 ,  G01N2021/9513

摘要： The present invention relates to a high-sensitivity inspection method and apparatus adapted for the fine-structuring of patterns, wherein defect inspection sensitivity is improved using the following technologies: detection optical system is improved in resolution by filling the clearance between an objective lens 30 and a sample 1, with a liquid, and increasing effective NA (Numerical Aperture); and when a transparent interlayer-insulating film is formed on the surface of the sample, amplitude splitting at the interface between the liquid and the insulating film is suppressed for reduction in the unevenness of optical images in brightness due to interference of thin-film, by immersing the clearance between the objective lens and the sample, with a liquid of a refractive index close to that of the transparent film.

摘要翻译： 本发明涉及一种适用于图案精细化的高灵敏度检测方法和装置，其中使用以下技术提高了缺陷检查灵敏度：通过填充物镜30与物镜30之间的间隙来提高检测光学系统的分辨率。 样品1，具有液体，并且增加有效NA（数值孔径）; 并且当在样品的表面上形成透明的层间绝缘膜时，抑制液体与绝缘膜之间的界面处的振幅分裂，以减少由于薄膜的干扰引起的光学图像在亮度上的不均匀性，由 将物镜与样品之间的间隙浸入折射率接近于透明膜的液体。

公开(公告)号：US07460220B2

公开(公告)日：2008-12-02

申请号：US11605242

申请日：2006-11-29

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A method of inspecting a specimen, including: emitting a light from a lamp of a light source; illuminating a specimen on which plural patterns are formed with the light emitted from the light source and, passed through an objective lens; forming an optical image of the specimen by collecting light reflected from the specimen by the illuminating and passed through the objective lens and a image forming lens; detecting the optical image with a TDI image sensor; and processing a signal outputted from the TDI image sensor and detecting a defect of a pattern among the plural patterns formed on the specimen, wherein the image detected by the TDI image sensor is formed with light having a wavelength selected from the wavelengths of the light emitted from the light source.

摘要翻译： 一种检查样本的方法，包括：从光源的灯发射光; 用从光源发射的光照射形成有多个图案的样本，并通过物镜; 通过照射通过收集从样本反射的光并通过物镜和成像透镜来形成样本的光学图像; 用TDI图像传感器检测光学图像; 并处理从TDI图像传感器输出的信号，并且检测在样本上形成的多个图案之间的图案的缺陷，其中由TDI图像传感器检测到的图像由具有选自发射的光的波长的波长的光形成 从光源。

公开(公告)号：US06172363B2

公开(公告)日：2001-01-09

申请号：US08811511

申请日：1997-03-04

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： H01J37244

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.

公开(公告)号：US5774222A

公开(公告)日：1998-06-30

申请号：US539886

申请日：1995-10-06

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/95 ,  G01N21/956 ,  G01N21/88

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

摘要翻译： 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

公开(公告)号：US5649022A

公开(公告)日：1997-07-15

申请号：US888494

申请日：1992-05-27

申请人： Shunji Maeda ,  Hitoshi Kubota ,  Hiroshi Makihira ,  Takashi Hiroi

发明人： Shunji Maeda ,  Hitoshi Kubota ,  Hiroshi Makihira ,  Takashi Hiroi

IPC分类号： G06T7/00 ,  G06K9/00

CPC分类号： G06T7/0044 ,  G06T7/001 ,  G06T2207/30148

摘要： A pattern checking method wherein an image of a certain position of one pattern is detected; the detected image is positioned with respect to an image of a position corresponding to the certain position, in a reference pattern image; and the positioned images are compared with each other, whereby a discrepant place among these positioned images is judged as a defect the positioning operations of the images of the detected patterns are controlled based upon either pattern information such as density of the images of the detected patterns, or information obtained from the positioning operations for images of other positions in the patterns. An image sensor unit for detecting images of patterns is constructed which has such a structure that a plurality of one-dimensional image sensors functioning as a pattern detector are arranged in a two-dimensional form, and an output of a certain one-dimensional image sensor for imaging a certain position of one pattern is delayed for a predetermined time period, and also both of an output of an one-dimensional image sensor adjoining the first-mentioned one-dimensional image sensor, which images the same position of the same pattern, and the delayed output of the certain one-dimensional image sensor are sequentially added to derive a summation output. The image sensor unit is inclined at a predetermined angle with respect to a plane perpendicular to the reflection light from the patterns, and the reflection light from the patterns is focused via a confocal focusing optical system onto this image sensor unit.

摘要翻译： 一种图案检查方法，其中检测到一个图案的某个位置的图像; 检测图像相对于与特定位置对应的位置的图像在参考图案图像中定位; 并且定位的图像彼此进行比较，由此将这些定位的图像中的不一致的位置判断为检测图案的图像的定位操作的缺陷，基于诸如检测图案的图像的密度的图案信息 或者从图案中的其他位置的图像的定位操作获得的信息。 用于检测图案的图像的图像传感器单元被构造成具有以二维形式配置作为图案检测器的多个一维图像传感器的结构，以及某一个一维图像传感器的输出 对于一个图案的某个位置的成像被延迟预定的时间段，并且与相同图案的相同位置成像的第一个提到的一维图像传感器邻接的一维图像传感器的输出， 并且依次添加特定一维图像传感器的延迟输出以导出求和输出。 图像传感器单元相对于与图案的反射光垂直的平面以预定角度倾斜，并且来自图案的反射光经由共聚焦聚焦光学系统聚焦到该图像传感器单元上​​。