Apparatus for and method for handling film in a photographic printer
    1.
    发明授权
    Apparatus for and method for handling film in a photographic printer 失效
    用于在照相打印机中处理胶片的设备和方法

    公开(公告)号:US5668625A

    公开(公告)日:1997-09-16

    申请号:US508619

    申请日:1995-07-28

    CPC分类号: G03B27/64

    摘要: An apparatus and method for handling photographic film within the print-exposure section of a photographic printer. A mask matches the film frame (negative) and has a window for the passage of the exposure light. The mask also has holes through which air can be directed onto the film. A guide for the edges of the film parallels, and demarcates a gap with the mask. A source of air under either overpressure or underpressure supplies such air to the mask (4) and the film (1) through the air-direction openings (15). The air is supplied with overpressure while the film is being advanced. The air is supplied with underpressure while the print is being exposed to clamp the film.

    摘要翻译: 一种用于在照相打印机的打印曝光部分内处理照相胶卷的设备和方法。 掩模与胶片框架(阴性)匹配,并具有用于曝光光通过的窗口。 该面具还具有可以将空气引导到薄膜上的孔。 膜的边缘的引导件平行,并且与掩模划分出间隙。 过压或负压下的空气源通过空气方向开口(15)向面罩(4)和膜(1)供应这种空气。 当电影进行时,空气被提供超压。 当印刷品暴露以夹住胶片时,空气被提供负压。

    Condensed memory cell structure using a FinFET
    2.
    发明授权
    Condensed memory cell structure using a FinFET 有权
    使用FinFET的冷凝存储单元结构

    公开(公告)号:US08665629B2

    公开(公告)日:2014-03-04

    申请号:US11864575

    申请日:2007-09-28

    IPC分类号: G11C11/00

    摘要: An integrated circuit and method for manufacturing an integrated circuit are described. In one embodiment, the integrated circuit includes a memory cell that includes a resistivity changing memory element. The resistivity changing memory element is electrically coupled to a select transistor that includes a FinFET including a source, a drain, and a fin structure formed above a surface of a substrate between the source and the drain. The fin structure includes a channel area extending in a direction substantially parallel to the surface of the substrate, and a dielectric layer formed around at least a portion of the channel area such that an effective channel width of the select transistor depends at least in part on a height of the fin structure.

    摘要翻译: 对集成电路的集成电路及其制造方法进行说明。 在一个实施例中,集成电路包括包括电阻率变化存储元件的存储单元。 电阻率变化存储元件电耦合到选择晶体管,该选择晶体管包括在源极和漏极之间形成在衬底表面上方的源极,漏极和鳍状结构的FinFET。 翅片结构包括在基本上平行于衬底的表面的方向上延伸的沟道区,以及围绕沟道区的至少一部分形成的介电层,使得选择晶体管的有效沟道宽度至少部分依赖于 翅片结构的高度。

    Integrated circuit, method of manufacturing an integrated circuit, and memory module
    4.
    发明授权
    Integrated circuit, method of manufacturing an integrated circuit, and memory module 有权
    集成电路,集成电路的制造方法和存储器模块

    公开(公告)号:US07855435B2

    公开(公告)日:2010-12-21

    申请号:US12047167

    申请日:2008-03-12

    IPC分类号: H01L23/48

    摘要: According to one embodiment of the present invention, an integrated circuit including a plurality of memory cells is provided. Each memory cell includes a resistivity changing memory element which includes a top electrode, a bottom electrode, and resistivity changing material being disposed between the top electrode and the bottom electrode. Each resistivity changing memory element is at least partially surrounded by a thermal insulating structure. The thermal insulating structures are arranged such that the dissipation of heat generated within the resistivity changing memory elements into the environment of the resistivity changing memory elements is lowered.

    摘要翻译: 根据本发明的一个实施例,提供了包括多个存储单元的集成电路。 每个存储单元包括电阻率变化存储元件,其包括设置在顶部电极和底部电极之间的顶部电极,底部电极和电阻率变化材料。 每个电阻率变化记忆元件至少部分地被绝热结构包围。 热绝缘结构被布置成使得在电阻率变化的存储元件内产生的热量消耗到电阻率变化存储元件的环境中降低。

    Condensed Memory Cell Structure Using a FinFET
    5.
    发明申请
    Condensed Memory Cell Structure Using a FinFET 有权
    使用FinFET的冷凝记忆单元结构

    公开(公告)号:US20090085121A1

    公开(公告)日:2009-04-02

    申请号:US11864575

    申请日:2007-09-28

    IPC分类号: H01L29/786 H01L21/336

    摘要: An integrated circuit and method for manufacturing an integrated circuit are described. In one embodiment, the integrated circuit includes a memory cell that includes a resistivity changing memory element. The resistivity changing memory element is electrically coupled to a select transistor that includes a FinFET including a source, a drain, and a fin structure formed above a surface of a substrate between the source and the drain. The fin structure includes a channel area extending in a direction substantially parallel to the surface of the substrate, and a dielectric layer formed around at least a portion of the channel area such that an effective channel width of the select transistor depends at least in part on a height of the fin structure.

    摘要翻译: 对集成电路的集成电路及其制造方法进行说明。 在一个实施例中,集成电路包括包括电阻率变化存储元件的存储单元。 电阻率变化存储元件电耦合到选择晶体管,该选择晶体管包括在源极和漏极之间形成在衬底表面上方的源极,漏极和鳍状结构的FinFET。 翅片结构包括在基本上平行于衬底的表面的方向上延伸的沟道区,以及围绕沟道区的至少一部分形成的介电层,使得选择晶体管的有效沟道宽度至少部分依赖于 翅片结构的高度。

    Photolithographic pattern generation
    10.
    发明授权
    Photolithographic pattern generation 失效
    光刻图案生成

    公开(公告)号:US5851733A

    公开(公告)日:1998-12-22

    申请号:US793310

    申请日:1997-03-12

    摘要: In a method for producing photolithographic patterns in the submicron range, applied on a substrate is a photoresist layer comprised of a polymer containing carboxylic acid anhydride groups and tert. butylester or tert. butoxy-carbonyloxy groups, a photoactive component--in the form of an ester of a naphthoquinonediazide-4-sulfonic acid with an aromatic or aliphatic-aromatic hydroxy compound--and a suitable solvent; the photoresist layer is then dried, exposed in an imaging manner, and subjected to a temperature treatment in the range of between 120.degree. and 150.degree. C. for a duration of 100 to 600 seconds. The photoresist layer is then subjected to a liquid silylation and is dry-developed in an anisotropic oxygen plasma.

    摘要翻译: PCT No.PCT / DE95 / 01184 Sec。 371日期1997年3月12日 102(e)1997年3月12日PCT PCT 1995年9月1日PCT公布。 出版物WO96 / 08750 日期1996年3月21日在用于制造亚微米范围内的光刻图案的方法中,施加在基底上的是由包含羧酸酐基团和叔碳酸酯的聚合物组成的光致抗蚀剂层。 丁酯或叔丁酯。 萘醌二叠氮-4-磺酸与芳族或脂族 - 芳族羟基化合物的酯形式的光活性组分和合适的溶剂; 然后将光致抗蚀剂层干燥,以成像方式曝光,并在120至150℃的温度范围内进行100至600秒的持续时间。 然后将光致抗蚀剂层进行液体甲硅烷基化,并在各向异性氧等离子体中干燥显影。