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公开(公告)号：US20080144322A1
公开(公告)日：2008-06-19
申请号：US11611518
申请日：2006-12-15
IPC分类号： F21V7/04
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： A light source having a rigid substrate, a first LED, and a flexible reflector housing is disclosed. The rigid substrate has a first surface having a plurality of electrical traces formed thereon, the first LED die being disposed on the first surface and connected to two of the electrical traces. The rigid substrate also includes a plurality of external electrical connections for accessing the electrical traces. The reflector housing includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The layer of flexible material is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The first die can be encapsulated in a layer of silicone encapsulant. The reflector can likewise be constructed from silicone.
摘要翻译： 公开了一种具有刚性基板，第一LED和柔性反射器壳体的光源。 所述刚性基板具有形成在其上的多个电迹线的第一表面，所述第一LED管芯设置在所述第一表面上并且连接到所述电迹线中的两个。 刚性基板还包括用于接近电迹线的多个外部电连接。 反射器壳体包括柔性材料层，其具有延伸穿过柔性材料层的至少一个空腔。 柔性材料层结合到第一表面，使得空腔覆盖在第一LED管芯上。 腔体具有反射在第一LED管芯中产生的光的壁。 第一个管芯可以封装在一层硅树脂密封剂中。 反射器同样可以由硅树脂构成。
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2.发明申请公开(公告)号：US20080117619A1
公开(公告)日：2008-05-22
申请号：US11603690
申请日：2006-11-21
CPC分类号： F21K9/00 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2924/01322 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： A light source, a flexible circuit carrier and a flexible reflector are disclosed. The flexible circuit carrier includes a flexible substrate having a first surface having a plurality of electrical traces formed thereon. A first LED die is disposed on the first surface and connected to two of the electrical traces. A plurality of external electrical connections for accessing the electrical traces are also included in the circuit carrier. The flexible reflector includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The flexible layer is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The flexible material and the flexible substrate can include silicone.
摘要翻译： 公开了一种光源，柔性电路载体和柔性反射器。 柔性电路载体包括具有形成在其上的多个电迹线的第一表面的柔性基板。 第一LED芯片设置在第一表面上并连接到两个电迹线。 用于访问电迹线的多个外部电连接也包括在电路载体中。 柔性反射器包括柔性材料层，其具有延伸穿过柔性材料层的至少一个空腔。 柔性层结合到第一表面，使得空腔覆盖在第一LED管芯上。 腔体具有反射在第一LED管芯中产生的光的壁。 柔性材料和柔性基底可以包括硅酮。
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公开(公告)号：US20090057708A1
公开(公告)日：2009-03-05
申请号：US11845501
申请日：2007-08-27
CPC分类号： H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material.
摘要翻译： 公开了一种光源及其制造方法。 光源包括基板，模具和杯。 衬底上具有多个电迹线，并且裸片包括连接到两条迹线的LED。 杯子覆盖在衬底上并且填充有密封剂材料。 模具位于杯内并由衬底和密封剂材料包封。 杯子和密封剂材料具有基本上相同的热膨胀系数。 杯子可以包括设置成反射离开模具的光的反射侧壁。 杯子，密封剂和基材可以由相同的材料构成。
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公开(公告)号：US07968899B2
公开(公告)日：2011-06-28
申请号：US11845501
申请日：2007-08-27
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material.
摘要翻译： 公开了一种光源及其制造方法。 光源包括基板，模具和杯。 衬底上具有多个电迹线，并且裸片包括连接到两条迹线的LED。 杯子覆盖在衬底上并且填充有密封剂材料。 模具位于杯内并由衬底和密封剂材料包封。 杯子和密封剂材料具有基本上相同的热膨胀系数。 杯子可以包括设置成反射离开模具的光的反射侧壁。 杯子，密封剂和基材可以由相同的材料构成。
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公开(公告)号：US08115385B2
公开(公告)日：2012-02-14
申请号：US12871704
申请日：2010-08-30
IPC分类号： H01J1/62
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US20100320485A1
公开(公告)日：2010-12-23
申请号：US12871704
申请日：2010-08-30
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US20110044062A1
公开(公告)日：2011-02-24
申请号：US12544140
申请日：2009-08-19
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10
摘要： An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.
摘要翻译： 光源的实施例包括第一引线和第二引线。 第一引线包括第一安装表面，其中第一光发射器可连接到第一安装表面，附接到第一安装表面的支撑构件，附接到支撑构件的导体部分和从第一安装面延伸的至少一个突出部 表面，所述至少一个突片用于在制造期间保持第一引线。 第二引线是位于第一引线附近的第二引线，并且包括第二安装表面，其中第二光发射器可连接到第二安装表面，附接到第二安装表面的至少两个支撑构件和连接到第二安装表面的导体部分 支持成员。
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公开(公告)号：US20080170391A1
公开(公告)日：2008-07-17
申请号：US11622753
申请日：2007-01-12
IPC分类号： F21S4/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。
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公开(公告)号：US08356917B2
公开(公告)日：2013-01-22
申请号：US12544140
申请日：2009-08-19
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10
摘要： An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.
摘要翻译： 光源的实施例包括第一引线和第二引线。 第一引线包括第一安装表面，其中第一光发射器可连接到第一安装表面，附接到第一安装表面的支撑构件，附接到支撑构件的导体部分和从第一安装面延伸的至少一个突出部 表面，所述至少一个突片用于在制造期间保持第一引线。 第二引线是位于第一引线附近的第二引线，并且包括第二安装表面，其中第二光发射器可连接到第二安装表面，附接到第二安装表面的至少两个支撑构件和连接到第二安装表面的导体部分 支持成员。
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公开(公告)号：US07547583B2
公开(公告)日：2009-06-16
申请号：US12044904
申请日：2008-03-07
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Aizar Abdul Karim Norfidathul
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/495 , H01L23/34 , H01L31/0203
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译： 公开了一种用于封装集成电路的封装电路和方法。 封装电路具有引线框，集成电路芯片和封装层。 引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。 集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。 封装层具有顶部，底部以及第一和第二侧表面。 第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。 热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径具有更小热阻的热路径。
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