利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

20 条记录 (耗时 0.018 秒)

    Integrated circuit chip packaging assembly
    2.
    发明申请
    Integrated circuit chip packaging assembly 有权

    公开(公告)号：US20060033185A1

    公开(公告)日：2006-02-16

    申请号：US10917036

    申请日：2004-08-12

    申请人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

    发明人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

    Integrated Circuit Chip Packaging Assembly
    3.
    发明申请
    Integrated Circuit Chip Packaging Assembly 有权
    集成电路芯片封装组件

    公开(公告)号：US20070259484A1

    公开(公告)日：2007-11-08

    申请号：US11774879

    申请日：2007-07-09

    申请人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

    发明人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

    IPC分类号： H01L21/00

    CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

    摘要翻译： 一种具有第一和第二封装侧的集成电路芯片封装组件。 集成电路芯片具有基板侧和有源电路侧。 芯片包括形成在有源电路侧的集成电路器件。 芯片的有源电路侧位于第一封装侧。 模片垫具有从其延伸的至少一个浇道构件，其可以朝着第一封装侧弯曲。 芯片的有源电路侧连接到管芯焊盘。 芯片焊盘相对于芯片在第一封装侧。 封装模具化合物形成在芯片焊盘，芯片的至少一部分和流道部件的至少一部分之上。 芯片的基板侧的至少一部分和/或流道部件的至少一部分可以不被封装模具化合物覆盖。

    Semiconductor device having firmly secured heat spreader
    7.
    发明申请
    Semiconductor device having firmly secured heat spreader 有权
    具有牢固固定的散热器的半导体器件

    公开(公告)号：US20060289971A1

    公开(公告)日：2006-12-28

    申请号：US11168000

    申请日：2005-06-27

    申请人： Bernhard Lange ,  Steven Kummerl

    发明人： Bernhard Lange ,  Steven Kummerl

    IPC分类号： H01L23/495

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.

    摘要翻译： 一种半导体器件，包括具有第一（903a）和第二（903b）表面的引线框架（903），具有一定尺寸的平面焊盘（910）和与所述焊盘相邻的多个非共面构件（913） 。 该装置还具有带有第一（920a）和第二（920b）表面的散热器（920），具有与引线框垫尺寸相匹配的尺寸的平面焊盘和引线框架构件插入其中的轮廓（922） 第一扩散器焊盘表面穿过焊盘尺寸接触第二引线框焊盘表面。 半导体芯片（904）安装在第一引线框焊盘表面上。 封装材料（930），优选模塑料覆盖芯片，但是将第二撒布机表面露出。

    Bond Capillary Design for Ribbon Wire Bonding
    9.
    发明申请
    Bond Capillary Design for Ribbon Wire Bonding 有权
    贴片毛细管设计用于丝带线接合

    公开(公告)号：US20070181652A1

    公开(公告)日：2007-08-09

    申请号：US11733870

    申请日：2007-04-11

    申请人： Bernhard Lange ,  Steven Kummerl

    发明人： Bernhard Lange ,  Steven Kummerl

    IPC分类号： A47J36/02

    CPC分类号： B23K20/005 ,  B23K20/004 ,  B23K20/106 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

    摘要： A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.

    摘要翻译： 一种用于将带状线（104）接合到工件（106）的装置（100）和方法（200），包括通过超声波接合毛细管（102）的通道（116）馈送带状线并将带状线夹紧 通过可操作地耦合到粘结毛细管的夹钳（118）将粘结毛细管的接合表面（120）。 带状线（104）沿粘结毛细管（102）的接合表面（112）结合到工件（106）上，并且至少部分地穿过接合表面和粘结毛细管的接合表面（120）之间 通过切割工具（124）。 切割工具（124）可以包括定位在接合表面（112）和接合表面（120）之间的细长构件（126），并且可以具有定位在其远端（130）处的切割刀片（128）。 切割工具（124）还可以包括环形切割器（132），其中，带状丝线穿过具有围绕其内径限定的切割表面（138）的环（134）。

    Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly
    10.
    发明申请
    Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly 审中-公开
    磁辅助制造以减少模具闪光并辅助散热片组装

    公开(公告)号：US20060255479A1

    公开(公告)日：2006-11-16

    申请号：US11125712

    申请日：2005-05-10

    申请人： Steven Kummerl ,  Bemhard Lange

    发明人： Steven Kummerl ,  Bemhard Lange

    IPC分类号： H01L23/28

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A method (300) and apparatus (200) for fabricating a semiconductor package (100), wherein a heat spreader (118) is placed in a mold cavity (204) of a mold (202), and a leadframe (108) is placed over the heat spreader (118). A magnetic field (218) is applied to the mold cavity (204), wherein one or more of the heat spreader (118) and leadframe (108) are generally attracted to a surface (212) of the mold cavity (204), thus generally determining a position (214) of the heat spreader (118) within the mold cavity (204) and defining a contact region (120) between the heat spreader (118) and the mold (202). An encapsulation material (114) is further injected into the mold cavity (204), wherein the encapsulation material (114) is generally prevented from entering the contact region (120) due, at least in part, to the applied magnetic field (218). The encapsulation material (114) is then cured, and the semiconductor package (100) is removed from the mold cavity (204).

    摘要翻译： 一种用于制造半导体封装（100）的方法（300）和装置（200），其中散热器（118）放置在模具（202）的模腔（204）中，并且放置引线框架 在散热器（118）上。 一个磁场（218）被施加到模腔（204），其中一个或多个散热器（118）和引线框架（108）通常被吸引到模腔（204）的表面（212），因此 通常确定散热器（118）在模腔（204）内的位置（214）并且限定了散热器（118）和模具（202）之间的接触区域（120）。 进一步将包封材料（114）注入到模腔（204）中，其中通常防止包封材料（114）至少部分地由所施加的磁场（218）进入接触区域（120） 。 封装材料（114）然后被固化，半导体封装（100）从模具腔（204）移除。