Probe support with shield for the examination of test substrates under use of probe supports
    1.
    发明授权
    Probe support with shield for the examination of test substrates under use of probe supports 有权
    使用探头支架检测测试基板的探头支架

    公开(公告)号:US07652491B2

    公开(公告)日:2010-01-26

    申请号:US11940354

    申请日:2007-11-15

    IPC分类号: G10R31/28

    CPC分类号: G01R31/2889 G01R1/07342

    摘要: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes comprises a probe card holder, a probe card, and a probe card adapter, The probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed such that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from the holder. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component.

    摘要翻译: 用于保持探头的探针支架用于探测器中的测试基板的电接触以用于测试目的包括探针卡夹,探针卡和探针卡适配器。探针卡和探针卡适配器彼此电连接为 以及导电材料的屏蔽件,并且被布置成使得探针卡位于屏蔽件的通道中。 屏蔽件设置在测试基板和探针卡座之间并且与保持器电绝缘。 为了测试测试基板,它们相对于以这种方式保持的探针的定位是通过将测试基板的接触表面与传感器尖端角度对准并沿着从第一参考位置开始的路径移动测试基板来进行的, 由x分量和y分量组成直到第一个和每个附加的接触位置。

    PROBE SUPPORT AND PROCESS FOR THE EXAMINATION OF TEST SUBSTRATES UNDER USE OF PROBE SUPPORTS
    3.
    发明申请
    PROBE SUPPORT AND PROCESS FOR THE EXAMINATION OF TEST SUBSTRATES UNDER USE OF PROBE SUPPORTS 有权
    在使用探测支持下检测测试基板的探测支持和过程

    公开(公告)号:US20080116917A1

    公开(公告)日:2008-05-22

    申请号:US11940354

    申请日:2007-11-15

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2889 G01R1/07342

    摘要: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes is specified. A process for testing test substrates in such a prober is also specified. The probe support comprises a probe card holder, a probe card, and a probe card adapter, where the probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed in such a manner that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from it. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component (FIG. 2).

    摘要翻译: 规定了用于保持探头的探针支架,用于检测探针中的测试基板的电接触用于测试目的。 还规定了用于在这种探测器中测试测试底物的方法。 探针支架包括探针卡夹,探针卡和探针卡适配器,其中探针卡和探针卡适配器彼此电连接以及导电材料的屏蔽,并以这种方式设置 探针卡位于屏蔽的通道中。 屏蔽件设置在测试基板和探针卡保持器之间并且与其电绝缘。 为了测试测试基板,它们相对于以这种方式保持的探针的定位是通过将测试基板的接触表面与传感器尖端角度对准并沿着从第一参考位置开始的路径移动测试基板来进行的, 由x分量和y分量(图2)组成直到第一个和每个附加的接触位置。

    Probe receptacle for mounting a probe for testing semiconductor components, probe holder arm and test apparatus
    5.
    发明授权
    Probe receptacle for mounting a probe for testing semiconductor components, probe holder arm and test apparatus 失效
    用于安装用于测试半导体元件,探头支架臂和测试设备的探头的探针插座

    公开(公告)号:US07560942B2

    公开(公告)日:2009-07-14

    申请号:US11674208

    申请日:2007-02-13

    IPC分类号: G01R1/067

    CPC分类号: G01R31/2891 G01R31/2874

    摘要: To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.

    摘要翻译: 为了以可重复的方式布置探针,确保探头针头的可靠接触连接,并确保即使在高温或测试力下也能牢固地固定探头针头,提供探头插座,用于安装用于测试半导体部件的探头。 探针具有探针和基本上棱柱形的探针轴。 探针插座包括具有插座开口的基座,以容纳棱柱形探针轴,被基壁包围。 底壁包括至少两个可以朝向彼此移动的底壁段。 还提供了具有这种探针插座的探针支架臂和具有至少一个具有这种探针插座的探头的测试装置。

    Method for testing a test substrate under defined thermal conditions and thermally conditionable prober
    6.
    发明授权
    Method for testing a test substrate under defined thermal conditions and thermally conditionable prober 有权
    在确定的热条件下测试测试基板的方法和热定向探针

    公开(公告)号:US08497693B2

    公开(公告)日:2013-07-30

    申请号:US12681806

    申请日:2008-10-01

    IPC分类号: G01R31/00

    CPC分类号: G01R31/2891 G01R31/2874

    摘要: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

    摘要翻译: 在用于在限定的热条件下测试测试基板的方法和装置中,待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度,并且该温度保持恒定。

    Chuck with triaxial construction
    7.
    发明授权
    Chuck with triaxial construction 有权
    夹头三轴结构

    公开(公告)号:US08240650B2

    公开(公告)日:2012-08-14

    申请号:US12048323

    申请日:2008-03-14

    摘要: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element. A chuck for very low current measurements which can be used to prevent the occurrence of leakage currents and a triboelectric charge and which is configured favourably in terms of production, is achieved because at least one of the electrically conductive surface elements is mechanically connected to at least one insulation element and has an elasticity that compensates for an expansion difference resulting from differences in different coefficients of expansion between a respective surface element and an adjoining insulation element.

    摘要翻译: 具有三轴结构的卡盘包括用于测试基板的接收表面并且布置在接收表面下方:导电的第一表面元件,与其电绝缘的导电的第二表面元件和与其电绝缘的导电的第三表面元件, 在第一和第二表面元件之间,第一绝缘元件和第二和第三表面元件之间的第二绝缘元件。 实现了用于非常低的电流测量的卡盘,其可用于防止泄漏电流和摩擦电荷的发生,并且在生产方面被有利地配置,这是因为至少一个导电表面元件至少机械地连接到 一个绝缘元件并且具有补偿由相应的表面元件和相邻绝缘元件之间的不同膨胀系数的差异引起的膨胀差的弹性。

    METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER
    8.
    发明申请
    METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER 有权
    在定义的热条件和热调节探头下测试测试基板的方法

    公开(公告)号:US20100289511A1

    公开(公告)日:2010-11-18

    申请号:US12681806

    申请日:2008-10-01

    IPC分类号: G01R31/00

    CPC分类号: G01R31/2891 G01R31/2874

    摘要: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

    摘要翻译: 在用于在限定的热条件下测试测试基板的方法和装置中,待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度,并且该温度保持恒定。

    Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station
    9.
    发明申请
    Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station 有权
    在探测台中再现对准的和之后移位的校准基板的校准位置的步骤

    公开(公告)号:US20060212248A1

    公开(公告)日:2006-09-21

    申请号:US11365424

    申请日:2006-03-01

    IPC分类号: G01C17/38

    CPC分类号: G01R31/2891

    摘要: A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

    摘要翻译: 晶片探针台设置有晶片卡盘,通过真空吸附紧固在卡盘上的晶片,以及在晶片上方的探针针布置,以通过接触晶片上的选定的焊盘并在校准基板上交替地焊接来高速测试晶片 也固定在晶片卡盘上。 用于再现对准的和随后移位的校准基板的校准位置的过程使用第一和第二测量系统来计算在第二晶片装载在晶片卡盘上之后校准基板的新偏移位置。 在最后一步中,晶片卡盘由最近的位置由4轴的机械手级驱动到新的校准位置。

    Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station
    10.
    发明授权
    Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station 有权
    在探测台中再现对准的和之后移位的校准基板的校准位置的步骤

    公开(公告)号:US07265536B2

    公开(公告)日:2007-09-04

    申请号:US11365424

    申请日:2006-03-01

    IPC分类号: G01R31/02 G01R35/00

    CPC分类号: G01R31/2891

    摘要: A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

    摘要翻译: 晶片探针台设置有晶片卡盘,通过真空吸附紧固在卡盘上的晶片,以及在晶片上方的探针针布置,以通过接触晶片上的选定的焊盘并在校准基板上交替地焊接来高速测试晶片 也固定在晶片卡盘上。 用于再现对准的和随后移位的校准基板的校准位置的过程使用第一和第二测量系统来计算在第二晶片装载在晶片卡盘上之后校准基板的新偏移位置。 在最后一步中,晶片卡盘由最近的位置由4轴的机械手级驱动到新的校准位置。