Method of manufacturing polysilicon thin film and method of manufacturing thin film transistor having the same
    7.
    发明授权

    公开(公告)号:US07557050B2

    公开(公告)日:2009-07-07

    申请号:US11234609

    申请日:2005-09-23

    IPC分类号: H01L21/00

    摘要: In a method of manufacturing a polysilicon thin film and a method of manufacturing a TFT having the thin film, a laser beam is irradiated on a portion of an amorphous silicon thin film to liquefy the portion of the amorphous silicon thin film. The amorphous silicon thin film is on a first end portion of a substrate. The liquefied silicon is crystallized to form silicon grains. The laser beam is shifted from the first end portion towards a second end portion of the substrate opposite the first end portion by an interval in a first direction. The laser beam is then irradiated onto a portion of the amorphous silicon thin film adjacent to the silicon grains to form a first polysilicon thin film. Therefore, electrical characteristics of the amorphous silicon thin film may be improved.

    摘要翻译: 在制造多晶硅薄膜的方法和制造具有薄膜的TFT的方法中,激光束被照射在非晶硅薄膜的一部分上以使非晶硅薄膜的部分液化。 非晶硅薄膜位于基板的第一端部上。 液化硅结晶形成硅晶粒。 激光束从第一端部朝向与第一端部相反的第二端部朝向第一方向的间隔移动。 然后将激光束照射到与硅晶粒相邻的非晶硅薄膜的一部分上以形成第一多晶硅薄膜。 因此,可以提高非晶硅薄膜的电特性。

    METHOD OF MANUFACTURING POLYSILICON THIN FILM AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR HAVING THE SAME
    8.
    发明申请
    METHOD OF MANUFACTURING POLYSILICON THIN FILM AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR HAVING THE SAME 审中-公开
    制造多晶硅薄膜的方法及其制造薄膜薄膜晶体管的方法

    公开(公告)号:US20090275178A1

    公开(公告)日:2009-11-05

    申请号:US12490236

    申请日:2009-06-23

    IPC分类号: H01L21/336 H01L21/268

    摘要: In a method of manufacturing a polysilicon thin film and a method of manufacturing a TFT having the thin film, a laser beam is irradiated on a portion of an amorphous silicon thin film to liquefy the portion of the amorphous silicon thin film. The amorphous silicon thin film is on a first end portion of a substrate. The liquefied silicon is crystallized to form silicon grains. The laser beam is shifted from the first end portion towards a second end portion of the substrate opposite the first end portion by an interval in a first direction. The laser beam is then irradiated onto a portion of the amorphous silicon thin film adjacent to the silicon grains to form a first polysilicon thin film. Therefore, electrical characteristics of the amorphous silicon thin film may be improved.

    摘要翻译: 在制造多晶硅薄膜的方法和制造具有薄膜的TFT的方法中,激光束被照射在非晶硅薄膜的一部分上以使非晶硅薄膜的部分液化。 非晶硅薄膜位于基板的第一端部上。 液化硅结晶形成硅晶粒。 激光束从第一端部朝向与第一端部相反的第二端部朝向第一方向的间隔移动。 然后将激光束照射到与硅晶粒相邻的非晶硅薄膜的一部分上以形成第一多晶硅薄膜。 因此,可以提高非晶硅薄膜的电特性。

    Optic mask and manufacturing method of thin film transistor array panel using the same
    10.
    发明授权
    Optic mask and manufacturing method of thin film transistor array panel using the same 有权
    薄膜晶体管阵列面板的光掩模和制造方法采用相同的方法

    公开(公告)号:US07858450B2

    公开(公告)日:2010-12-28

    申请号:US11029011

    申请日:2005-01-05

    IPC分类号: H01L21/00 H01L21/84

    摘要: An optic mask for crystallizing amorphous silicon comprises a first slit region including a plurality of slits regularly arranged for defining incident region of laser beam, wherein the slits of the first slit region are formed to slope by a predetermined angle to the direction of transfer of the optic mask in crystallization process, and wherein the slits of the first slit region includes a first slit having a first length and a second slit having a second length which is longer than the first length.

    摘要翻译: 用于结晶非晶硅的光学掩模包括:第一狭缝区域,其包括规则地布置用于限定激光束的入射区域的多个狭缝,其中,所述第一狭缝区域的狭缝形成为与所述第一狭缝区域的传送方向倾斜预定角度 并且其中所述第一狭缝区域的狭缝包括具有第一长度的第一狭缝和具有比所述第一长度长的第二长度的第二狭缝。