公开(公告)号：US20070029570A1

公开(公告)日：2007-02-08

申请号：US11407276

申请日：2006-04-20

申请人： Su-ho Shin ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

发明人： Su-ho Shin ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package comprises: a package body having therein a LED receiving part including a reflecting surface; an LED mounted within the LED receiving part; a lead mounted within the package body such that first and second ends of the lead are exposed to the outside of the package body. The lead includes first and second conductive parts which are electrically connected to the LED and a non-conductive part which insulates the first and second conductive parts from each other.

摘要翻译： 一种LED封装，包括：封装体，其中具有包括反射表面的LED接收部分; 安装在LED接收部件内的LED; 引线，其安装在封装主体内，使得引线的第一和第二端暴露于封装主体的外部。 引线包括电连接到LED的第一和第二导电部分和使第一和第二导电部彼此绝缘的非导电部分。

公开(公告)号：US07514718B2

公开(公告)日：2009-04-07

申请号：US11405567

申请日：2006-04-18

申请人： Kyu-ho Shin ,  Su-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

发明人： Kyu-ho Shin ,  Su-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

IPC分类号： H01L27/15

CPC分类号： H01L33/62 ,  H01L33/58 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10T29/49002 ,  H01L2924/00014

摘要： An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.

摘要翻译： LED封装包括基板，LED和盖。 基板包括第一导体单元，第二导体单元和使第一和第二导体单元电绝缘的非导体单元。 LED结合到第一导体单元。 盖子安装在LED上的基板上，并且包括将LED连接到第二导体单元的导线。

公开(公告)号：US20060279949A1

公开(公告)日：2006-12-14

申请号：US11405567

申请日：2006-04-18

申请人： Kyu-ho Shin ,  Su-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

发明人： Kyu-ho Shin ,  Su-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Jin-seung Choi

IPC分类号： F21V5/04 ,  H01L33/00 ,  H01S4/00

CPC分类号： H01L33/62 ,  H01L33/58 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10T29/49002 ,  H01L2924/00014

摘要： An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.

公开(公告)号：US20110003412A1

公开(公告)日：2011-01-06

申请号：US12883815

申请日：2010-09-16

申请人： Su-ho SHIN ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho SHIN ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L33/48

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US20070023893A1

公开(公告)日：2007-02-01

申请号：US11408101

申请日：2006-04-21

申请人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L23/34

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US08002443B2

公开(公告)日：2011-08-23

申请号：US11473188

申请日：2006-06-23

申请人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

发明人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

IPC分类号： F21V29/00

CPC分类号： F21V29/51 ,  F21K9/00 ,  F21V29/52 ,  F21V29/67 ,  F21V29/677 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/10106 ,  H01L2924/00014

摘要： A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

摘要翻译： 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。

公开(公告)号：US07928545B2

公开(公告)日：2011-04-19

申请号：US11416107

申请日：2006-05-03

申请人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

发明人： Ki-hwan Kwon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Chang-youl Moon ,  Arthur Darbinian ,  Seung-tae Choi ,  Su-ho Shin

IPC分类号： H01L23/495

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/12041 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上​​金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。

公开(公告)号：US07821027B2

公开(公告)日：2010-10-26

申请号：US11408101

申请日：2006-04-21

申请人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L29/74

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

公开(公告)号：US20070001582A1

公开(公告)日：2007-01-04

申请号：US11473188

申请日：2006-06-23

申请人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

发明人： Su-ho Shin ,  Chang-youl Moon ,  Kyu-ho Shin ,  Soon-cheol Kweon ,  Seung-tae Choi ,  Ki-hwan Kwon

IPC分类号： H01J1/62

CPC分类号： F21V29/51 ,  F21K9/00 ,  F21V29/52 ,  F21V29/67 ,  F21V29/677 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/10106 ,  H01L2924/00014

摘要： A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

摘要翻译： 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。

公开(公告)号：US08592231B2

公开(公告)日：2013-11-26

申请号：US12883815

申请日：2010-09-16

申请人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

发明人： Su-ho Shin ,  Soon-cheol Kweon ,  Kyu-ho Shin ,  Ki-hwan Kwon ,  Seung-tae Choi ,  Chang-youl Moon

IPC分类号： H01L21/00

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。