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公开(公告)号：US08860043B2
公开(公告)日：2014-10-14
申请号：US13019812
申请日：2011-02-02
CPC分类号： H01L33/48 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12032 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.
摘要翻译： 公开了用于发光器件的封装，系统和方法。 一个方面的LED封装可以具有各种尺寸和配置，并且可以包括尺寸小于通常提供的尺寸的一个或多个LED。 LED封装或封装可以例如用于背光或其他照明灯具。 优化的材料和技术可用于LED封装，以提供能源效率和长寿命。
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公开(公告)号：US08766298B2
公开(公告)日：2014-07-01
申请号：US13040088
申请日：2011-03-03
CPC分类号： H01L33/54 , H01L33/486 , H01L33/50 , H01L33/60 , H01L2224/48091 , H01L2224/48465 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.
摘要翻译： 公开了一种发光封装二极管，其包括安装在反射封装中的发光二极管，其中与二极管相邻的表面靠近朗伯反射器。 包装中的密封剂由朗伯反射器界定，并且密封剂中的磷光体转换由LED芯片发射的频率，并且与LED芯片发射的频率一起产生白光。 由密封剂形成的基本平坦的弯液面限定了封装二极管的发射表面。
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公开(公告)号：US08624271B2
公开(公告)日：2014-01-07
申请号：US13104558
申请日：2011-05-10
IPC分类号： H01L33/62
CPC分类号： H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
摘要翻译： 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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公开(公告)号：US08425271B2
公开(公告)日：2013-04-23
申请号：US11839562
申请日：2007-08-16
CPC分类号： H01L33/60 , H01L33/486 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A method of forming an LED lamp with a desired distribution of phosphor is disclosed. The method includes the steps of mixing a plurality of phosphor particles in an uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin. The uncured resin is then placed into a defined position adjacent an LED chip and the temperature of the resin is increased to correspondingly decrease its viscosity but to less than the temperature at which the resin would cure unreasonably quickly. The phosphor particles are encouraged to settle in the lowered-viscosity resin to a desired position with respect to the LED chip, and the temperature of the resin is thereafter increased to the point at which it will cured and solidify.
摘要翻译： 公开了一种形成具有所需分布的荧光体的LED灯的方法。 该方法包括以下步骤：在未固化的聚合物树脂中混合多个荧光体颗粒，根据温度可以控制粘度，以形成荧光体颗粒在树脂中的基本上均匀的悬浮液。 然后将未固化的树脂放置在与LED芯片相邻的限定位置，并且增加树脂的温度以相应地降低其粘度，但是小于树脂不合理地固化的温度。 鼓励荧光体颗粒将低粘度树脂沉降到相对于LED芯片的期望位置，然后将树脂的温度升高至其固化和固化的程度。
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公开(公告)号：US20120153317A1
公开(公告)日：2012-06-21
申请号：US13011609
申请日：2011-01-21
CPC分类号： H01L25/0753 , G02F1/133603 , G02F1/133608 , H01L24/48 , H01L24/49 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/29144 , H01L2224/2929 , H01L2224/29399 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/83192 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/10157 , H01L2924/10158 , H01L2924/12032 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/0105 , H01L2924/0665 , H01L2224/45099 , H01L2924/00
摘要： Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
摘要翻译： 公开了发光二极管（LED）装置，系统和方法。 一方面，照明面板可以被配置为为液晶显示器（LCD）面板提供背光。 照明面板可以包括以阵列布置的一个或多个LED。 一个或多个LED可以使用金属对金属管芯附接方法安装在照明面板上，或者附接在设置在照明面板上的封装内。 在一个方面，可以使用本文公开的鲁棒金属 - 金属管芯附接技术和/或材料来连接一个或多个LED。
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6.发明授权Remote component devices, systems, and methods for use with light emitting devices 有权用于发光设备的远程组件设备，系统和方法公开(公告)号：US08922108B2
公开(公告)日：2014-12-30
申请号：US13038109
申请日：2011-03-01
IPC分类号： H01J1/62 , H01J63/04 , H01J61/38 , H01J61/34 , F21V23/06 , F21V3/04 , F21K99/00 , F21Y101/02
CPC分类号： F21K9/56 , F21K9/232 , F21K9/64 , F21K9/90 , F21V3/12 , F21V23/06 , F21Y2115/10 , H01J61/34 , H01J61/38 , H01J2261/385 , Y02B20/19 , Y10T29/49002
摘要： Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.
摘要翻译： 公开了远程组件设备，系统和方法。 在一个方面，远程组件设备，系统和方法可以包括用于将远程组件可锁定地固定到壳体的主体。 设备，系统和方法还可以包括设置在身体上的一个或多个发光装置。 光学材料可以远离一个或多个发光器件至少远离第一距离。 本文公开的远程组件装置，系统和方法可以用作标准灯丝灯泡和紧凑型荧光灯（CFL）灯泡的替代品和/或等效的轻质产品。
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公开(公告)号：USD667803S1
公开(公告)日：2012-09-25
申请号：US29407084
申请日：2011-11-22
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8.发明申请REMOTE COMPONENT DEVICES, SYSTEMS, AND METHODS FOR USE WITH LIGHT EMITTING DEVICES 有权远程组件设备，系统和使用发光设备的方法公开(公告)号：US20120223632A1
公开(公告)日：2012-09-06
申请号：US13038109
申请日：2011-03-01
CPC分类号： F21K9/56 , F21K9/232 , F21K9/64 , F21K9/90 , F21V3/12 , F21V23/06 , F21Y2115/10 , H01J61/34 , H01J61/38 , H01J2261/385 , Y02B20/19 , Y10T29/49002
摘要： Remote component devices, systems, and methods are disclosed. In one aspect, remote component devices, systems, and methods can include a body for lockably securing the remote component to a housing. Devices, systems, and methods can also include one or more light emitting devices disposed over the body. An optical material can be remotely located at least a first distance away from the one or more light emitting devices. Remote component devices, systems, and methods disclosed herein can be used as replacements and/or equivalent light products for standard filament light bulbs and compact fluorescent lamp (CFL) bulbs.
摘要翻译： 公开了远程组件设备，系统和方法。 在一个方面，远程组件设备，系统和方法可以包括用于将远程组件可锁定地固定到壳体的主体。 设备，系统和方法还可以包括设置在身体上的一个或多个发光装置。 光学材料可以远离一个或多个发光器件至少远离第一距离。 本文公开的远程组件装置，系统和方法可以用作标准灯丝灯泡和紧凑型荧光灯（CFL）灯泡的替代品和/或等效的轻质产品。
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公开(公告)号：USD650760S1
公开(公告)日：2011-12-20
申请号：US29379636
申请日：2010-11-22
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公开(公告)号：US20080173883A1
公开(公告)日：2008-07-24
申请号：US11624954
申请日：2007-01-19
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , G02B6/0073 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting diode lamp is disclosed that includes a resin package that defines a recess in the shape of a solid polygon or another three-dimensional solid. The recess includes a floor, two side walls along the respective longer sides of the floor, and two end walls along the respective shorter sides of the floor. The two side walls define an angle therebetween greater than 3°, and the two end walls define an angle therebetween greater than 40°. A light emitting diode chip is positioned on the rectangular floor of the package.
摘要翻译： 公开了一种发光二极管灯，其包括限定具有实心多边形或另一立体固体形状的凹部的树脂封装。 凹部包括地板，沿着地板的相应长边的两个侧壁以及沿着地板的相应短边的两个端壁。 两个侧壁在它们之间限定了大于3°的角度，并且两个端壁在它们之间限定了大于40°的角度。 发光二极管芯片位于封装的矩形地板上。
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