摘要:
The present invention relates to a non-toxic primer powder composition for small caliber ammunition characterized by comprising potassium nitrate coated with shellac as an oxidizer, and particularly characterized by comprising 25-40 wt % of an initiating explosive, 10-30 wt % of nitrate ester as a fuel, 32-40 wt % of a shellac-coated potassium nitrate (KNO3) as an oxidizer, 5-10 wt % of tetracene as a first sensitizer, 3-9 wt % of a borosilicate powder as a second sensitizer and 0.1-0.2 wt % of a chemical binder.
摘要翻译:本发明涉及一种用于小口径弹药的无毒底漆粉末组合物,其特征在于包含用虫胶涂覆的硝酸钾作为氧化剂,其特征在于包含25-40重量%的起始炸药,10-30重量%的硝酸盐 酯作为燃料,32-40重量%的作为氧化剂的虫胶涂覆的硝酸钾(KNO 3 N 3),5-10重量%的并四苯作为第一敏化剂,3-9重量%的 作为第二敏化剂的硼硅酸盐粉末和0.1-0.2重量%的化学粘合剂。
摘要:
The present invention provides a non-volatile memory device and fabricating method thereof, by which a cell size can be lowered despite high degree of cell integration and by which the device fabrication is facilitated. The present invention includes at least two trench isolation layers arranged in a device isolation area of a semiconductor substrate, each having a first depth, a first conductive type well arranged between the at least two trench isolation layers to have a second depth smaller than the first depth, a second conductive type source region and a second conductive type drain region arranged in a prescribed upper part of the first conductive type well to be separated from each other by a channel region in-between, an ONO layer on the channel region of the semiconductor substrate, the ONO layer comprising a lower oxide layer, a nitride layer, and an upper oxide layer, and a wordline conductor layer on the ONO layer.
摘要:
Disclosed are iridium-based luminescent compounds having phenylpyridine moieties with an organosilicon group, and organic electroluminescence devices using the compounds as color-producing materials. The luminescent compounds have the structure of Formula 1 below: wherein L1, L2, L3, R1, R2 and R3, which may be identical to or different from each other, are each independently selected from the group consisting of aryl, alkoxy, alkyl, and groups of Formulae 2 and 3 below: wherein D1, D2 and D3 are each independently selected from the group consisting of C1˜18 alkyl, C1˜18 alkoxy, substituted or unsubstituted C1˜18 alkyl and allyl, and substituted or unsubstituted C6˜18 fluorinated alkyl and allyl groups; wherein D4, D5 and D6 are each independently selected from the group consisting of C1˜18 alkyl, C1˜18 alkoxy, substituted or unsubstituted C1˜18 alkyl and allyl, and substituted or unsubstituted C6˜18 fluorinated alkyl and allyl groups.
摘要:
The present invention provides a trench isolation method in a flash memory device, by which stability and reliability of the device are enhanced in a manner of forming a pad oxide layer thick in the vicinity of an edge of a trench isolation layer. The present invention includes forming a mask layer pattern on a semiconductor substrate to expose a device isolation area but to cover an active area thereof, the mask layer pattern comprising a first insulating layer pattern and a second insulating layer pattern stacked thereon, forming a trench in the semiconductor substrate corresponding to the device isolation area, removing an exposed portion of the first insulating layer pattern enough to expose a portion of the semiconductor substrate in the active area adjacent to the trench, forming a sidewall oxide layer on an inside of the trench and the exposed portion of the semiconductor substrate, filling up the trench with a third insulating layer to cover the sidewall oxide layer, and removing the mask layer pattern.
摘要:
A high voltage semiconductor device and fabricating method thereof, enable a high breakdown voltage to be provided from a surface area without forming a dual spacer layer. The semiconductor device includes a semiconductor substrate having source/drain regions separated from each other by a channel region in-between, a gate insulating layer pattern on the channel region, a gate conductor layer pattern on the gate insulating layer, a sidewall insulating layer provided on a sidewall of the gate conductor layer pattern, a salicide suppress layer pattern covering partial, but not entire, surfaces of the source/drain regions, and covering the sidewall insulating layer, and the gate conductor layer pattern, and a metal salicide layer on remaining portions surfaces of the source/drain regions that are not covered with the salicide suppress layer pattern.
摘要:
A low density and cost effective embedded non-volatile memory cell includes a semiconductor substrate of a first conductivity type and having device isolation regions and active regions defined therein; a first well of a second conductivity type in the semiconductor substrate; a plurality of second wells of the first conductivity type inside the first well, the second wells being formed in parallel with a bit line and surrounded by the device isolation regions and the first well; a plurality of ONO structures formed over corresponding ones of the second wells, each ONO structure including a first oxide film, a nitride film, and a second oxide film; and a plurality of gates formed on corresponding ones of the ONO structures and formed in parallel with a word line.
摘要:
A 1,2,4-Triazole derivative of formula 1 or a non-toxic salt thereof, a preparation method thereof, and a pharmaceutical composition containing the derivative or the salt as an active ingredient are provided.
摘要:
Provided is a light emitting diode array including: a plurality of light emitting chips spaced apart from one another by a predetermined distance; and a fixing member that positions the plurality of light emitting chips at predetermined heights and/or predetermined directions. Also provided are methods for manufacturing the light emitting diode array, a backlight assembly including the light emitting diode array, and a liquid crystal display device including the light emitting diode array.
摘要:
Embodiments relate to a semiconductor device and a method of manufacturing a semiconductor device having a pre-metal dielectric liner. In embodiments, method for forming a semiconductor device may include forming a pre-metal dielectric liner, which has a multi-layer structure including a plurality of interfacial surfaces, on an entire surface of a semiconductor substrate formed with a transistor, and forming a boron phospho silicate glass (BPSG) oxide layer on the pre-metal dielectric liner. Since the pre-metal dielectric liner is formed in a multi-layer structure having a plurality of interfacial surfaces, boron (B) of an upper BPSG oxide layer is not penetrated into the semiconductor substrate.
摘要:
A frame for a cathode ray tube including a panel formed with a blend region outside an effective screen of the panel, the blend region having an outer surface curvature having a radius satisfying a condition “20≦Rb≦60 (mm)” where “Rb” represents the outer surface curvature radius, so that it is possible to reduce the weight of the panel without causing a degradation in picture quality, and thus, to reduce manufacturing costs. It is also possible to reduce damage of the panel when the panel is processed in a furnace, and thus, to achieve an enhancement in productivity.