摘要:
This invention is directed toward a computer-implemented system and method for creating a note in a mobile communication device. The method includes creating a call note if a phone call is in progress. The call note includes call data that are related to the phone call. The call note is also associated with an entry in a call log. The method may be implemented by computer-executable components loaded into the memory of a mobile communication device.
摘要:
This invention is directed toward a computer-implemented system and method for creating a note in a mobile communication device. The method includes creating a call note if a phone call is in progress. The call note includes call data that are related to the phone call. The call note is also associated with an entry in a call log. The method may be implemented by computer-executable components loaded into the memory of a mobile communication device.
摘要:
This invention is directed toward a computer-implemented system and method for creating a note in a mobile communication device. The method includes creating a call note if a phone call is in progress. The call note includes call data that are related to the phone call. The call note is also associated with an entry in a call log. The method may be implemented by computer-executable components loaded into the memory of a mobile communication device.
摘要:
Described is a system and method for updating a contact and adding a new contact from a call log in a communications device. The system includes a contact manager that is directed towards creating and updating call contact cards in a contact database with information retrieved from call logs of phone calls made to or from the communications device. In one embodiment, information is pre-populated into a predetermined data field of the contact card, thereby reducing workload to a user. The method includes determining if a request is for updating an existing contact card or for adding a new contact card to the contact database. The update or addition is made with information retrieved from call logs. Call information is pre-populated into a predetermined data field of the contact card, when it is determined that the request is to add a new contact card to the contact database.
摘要:
Described is a system and method for updating a contact and adding a new contact from a call log in a communications device. The system includes a contact manager that is directed towards creating and updating call contact cards in a contact database with information retrieved from call logs of phone calls made to or from the communications device. In one embodiment, information is pre-populated into a predetermined data field of the contact card, thereby reducing workload to a user. The method includes determining if a request is for updating an existing contact card or for adding a new contact card to the contact database. The update or addition is made with information retrieved from call logs. Call information is pre-populated into a predetermined data field of the contact card, when it is determined that the request is to add a new contact card to the contact database.
摘要:
An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.
摘要:
A nozzle assembly (10) for a turbine engine includes an inner band (16) and an outer band (14) spaced apart from each other. An airfoil (12) installed between the bands has a leading edge (18) and a trailing edge (20). The airfoil has cavities formed in it for fluid flow through the nozzle assembly. A plurality of film cooling holes (1A–6H) are formed in a sidewall of the airfoil on a concave side of the assembly, and a plurality of film cooling holes (1J–1R) are formed in a sidewall of the nozzle on a convex side thereof. The holes are formed on each side of the airfoil, adjacent the trailing edge of the nozzle, in a plurality of rows of holes including at least a forward row (C, J), an aft row (A, L), and an intermediate row (B, K). The spacing between the intermediate row and aft row is substantially closer than the spacing between the forward row and the intermediate row.
摘要:
A nozzle assembly (10) for a turbine engine includes an inner band (16) and an outer band (14) spaced apart from each other. An airfoil (12) installed between the bands has a leading edge (18) and a trailing edge (20). The airfoil has cavities formed in it for fluid flow through the nozzle assembly. A plurality of film cooling holes (1A-6H) are formed in a sidewall of the airfoil on a concave side of the assembly, and a plurality of film cooling holes (1J-1R) are formed in a sidewall of the nozzle on a convex side thereof. The holes are formed on each side of the airfoil, adjacent the trailing edge of the nozzle, in a plurality of rows of holes including at least a forward row (C, J), an aft row (A, L), and an intermediate row (B, K). The spacing between the intermediate row and aft row is substantially closer than the spacing between the forward row and the intermediate row.
摘要:
Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.
摘要:
An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.