-
1.发明授权公开(公告)号：US07030170B2
公开(公告)日：2006-04-18
申请号：US10301731
申请日：2002-11-22
CPC分类号： G03F7/038 , G03F7/037 , Y10S430/107 , Y10T428/24917 , Y10T428/31721
摘要： A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C═C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C═C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).
摘要翻译： 一种感光性树脂组合物，其含有（A）聚酰胺酸，（B）具有至少两个光聚合性CC不饱和双键的（甲基）丙烯酸酯，（C）光聚合引发剂和（D）阻燃剂与（甲基）丙烯酸酯 B）相对于聚酰胺酸（A）100重量份，含有10〜700重量份的至少两个光聚合性CC不饱和双键。
-
公开(公告)号：US20050170270A1
公开(公告)日：2005-08-04
申请号：US11068890
申请日：2005-03-02
CPC分类号： G03F7/037 , C08G73/1025 , C08G73/16 , H05K1/0254 , H05K3/287 , H05K2201/0154 , Y10S430/106 , Y10S430/117
摘要： A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
摘要翻译： 一种形成用于保护布线的膜的组合物，其一方面包括聚酰亚胺前体，具有至少两个可光聚合基团的化合物和光聚合引发剂，其中所述聚酰亚胺前体包括由二胺组分得到的聚酰亚胺前体，所述二胺组分包含限定的二胺化合物 。 在其它方面，提供了使用该组合物形成布线保护膜的干膜和具有通过干膜保护的布线的基板。
-
公开(公告)号：US07851124B2
公开(公告)日：2010-12-14
申请号：US11068890
申请日：2005-03-02
CPC分类号： G03F7/037 , C08G73/1025 , C08G73/16 , H05K1/0254 , H05K3/287 , H05K2201/0154 , Y10S430/106 , Y10S430/117
摘要： A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
摘要翻译： 一种形成用于保护布线的膜的组合物，其一方面包括聚酰亚胺前体，具有至少两个可光聚合基团的化合物和光聚合引发剂，其中所述聚酰亚胺前体包括由二胺组分获得的聚酰亚胺前体，所述二胺组分包含限定的二胺化合物 。 在其它方面，提供了使用该组合物形成布线保护膜的干膜和具有通过干膜保护的布线的基板。
-
4.发明申请PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 失效光敏树脂组合物，干膜和使用其的加工产品公开(公告)号：US20100116532A1
公开(公告)日：2010-05-13
申请号：US12596948
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
CPC分类号： G03F7/037 , G03F7/085 , H05K3/287 , Y10T428/24917
摘要： A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要翻译： 一种感光性树脂组合物，其能够有效地避免在印刷线路板制造中的各种金属的镀覆步骤，例如膜下金属沉积和膜剥离，并且形成粘附性，柔性，绝缘性优异的布线保护膜 可靠性和耐热性。 感光性树脂组合物包含（A）羧化聚合物，（B）具有至少两个光聚合性不饱和双键的化合物，（C）光聚合引发剂，（D）由特定特征表示的氮化合物。
-
5.发明授权Insulating adhesive tape, and lead frame and semiconductor device employing the tape 失效绝缘胶带，引线框和采用胶带的半导体器件
公开(公告)号：US5406124A
公开(公告)日：1995-04-11
申请号：US158417
申请日：1993-11-29
申请人： Moritsugu Morita , Kimiteru Tagawa , Kenji Abe , Naoshi Mineta , Takayuki Kubo , Shigeo Kiba , Etsuo Ohkawado , Kenji Tanabe
发明人： Moritsugu Morita , Kimiteru Tagawa , Kenji Abe , Naoshi Mineta , Takayuki Kubo , Shigeo Kiba , Etsuo Ohkawado , Kenji Tanabe
CPC分类号： C09J179/08 , C08G73/1071 , H01B3/306 , E02B2017/0047 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2924/01014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31681 , Y10T428/31721
摘要： An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180.degree. C. to 280.degree. C. and an elastic modulus ranging from 10.sup.10 dyne/cm.sup.2 to 10.sup.11 dyne/cm.sup.2 at 25.degree. C., said modulus including a value ranging from 10.sup.2 dyne/cm.sup.2 to 10.sup.9 dyne/cm.sup.2 at a temperature between 250.degree. C. and 300.degree. C.
摘要翻译： 一种绝缘胶带，其包括基底支撑膜和在其至少一个表面上形成的粘合剂层，所述粘合剂层由包含热塑性聚酰亚胺的热塑性聚合物形成，其中所述热塑性聚合物的玻璃化转变温度为180℃ 在25℃下的弹性模量范围为1010达因/厘米2至1011达因/厘米2，所述模量包括在102达因/厘米2至109达因/厘米2的范围内的值，温度为250℃ 和300℃
-
6.发明授权Photosensitive resin composition, dry film, and processed product made using the same 有权感光树脂组合物，干膜和使用其制成的加工产品公开(公告)号：US08409784B2
公开(公告)日：2013-04-02
申请号：US12596952
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
CPC分类号： C08F283/04 , C08F283/00 , G03F7/027 , G03F7/037 , H05K3/287 , Y10T428/24917
摘要： Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].
摘要翻译： 公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求 抗弯性和绝缘可靠性。 具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。
-
7.发明申请PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 有权光敏树脂组合物，干膜和使用其的加工产品公开(公告)号：US20100084172A1
公开(公告)日：2010-04-08
申请号：US12596952
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
CPC分类号： C08F283/04 , C08F283/00 , G03F7/027 , G03F7/037 , H05K3/287 , Y10T428/24917
摘要： Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].
摘要翻译： 公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求 抗弯性和绝缘可靠性。 具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。
-
8.发明授权Photosensitive resin composition, dry film, and processed product made using the same 失效感光树脂组合物，干膜和使用其制成的加工产品公开(公告)号：US08361605B2
公开(公告)日：2013-01-29
申请号：US12596948
申请日：2008-04-23
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
CPC分类号： G03F7/037 , G03F7/085 , H05K3/287 , Y10T428/24917
摘要： A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要翻译： 一种感光性树脂组合物，其能够有效地避免在印刷线路板制造中的各种金属的镀覆步骤，例如膜下金属沉积和膜剥离，并且形成粘附性，柔性，绝缘性优异的布线保护膜 可靠性和耐热性。 感光性树脂组合物包含（A）羧化聚合物，（B）具有至少两个光聚合性不饱和双键的化合物，（C）光聚合引发剂，（D）由特定特征表示的氮化合物。
-
9.发明授权公开(公告)号：US08362103B2
公开(公告)日：2013-01-29
申请号：US12597676
申请日：2008-04-30
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
CPC分类号： G03F7/037 , C08K5/53 , G03F7/027 , Y10T428/31721 , C08L79/04
摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.
摘要翻译： 本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜 电阻和绝缘可靠性。 具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。 优选树脂组合物还含有（C）磷腈化合物。
-
10.发明申请公开(公告)号：US20100059263A1
公开(公告)日：2010-03-11
申请号：US12597676
申请日：2008-04-30
申请人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
发明人： Katsuhiko Funaki , Etsuo Ohkawado , Kousuke Hirota , Syuji Tahara
CPC分类号： G03F7/037 , C08K5/53 , G03F7/027 , Y10T428/31721 , C08L79/04
摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.
摘要翻译： 本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜 电阻和绝缘可靠性。 具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。 优选树脂组合物还含有（C）磷腈化合物。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.026 秒)
