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    Resin composition for sealing film-made liquid crystal cells
    1.
    发明授权
    Resin composition for sealing film-made liquid crystal cells 失效
    用于密封薄膜制造的液晶单元的树脂组合物

    公开(公告)号：US5635259A

    公开(公告)日：1997-06-03

    申请号：US487889

    申请日：1995-06-07

    申请人： Syuji Tahara ,  Koichi Machida ,  Seiji Itami ,  Masayuki Horiuchi

    发明人： Syuji Tahara ,  Koichi Machida ,  Seiji Itami ,  Masayuki Horiuchi

    IPC分类号： C08G59/30 ,  C08G59/40 ,  C08G59/68 ,  C08L63/00 ,  C09J151/08 ,  G02F1/1339 ,  C08L63/10 ,  C09K19/00

    CPC分类号： G02F1/1339 ,  C08G59/302 ,  C08G59/4035 ,  C08G59/686 ,  C08L63/00 ,  C09J151/08 ,  Y10T428/1073 ,  Y10T428/31511 ,  Y10T428/31525

    摘要： A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.

    摘要翻译： 一种用于密封液晶单元的树脂组合物，其包含含有多硫化物改性环氧树脂，酰肼化合物和填料的作为主要成分的环氧树脂。 所述环氧树脂在整个环氧树脂中含有由通式（1）表示的多硫化物改性环氧树脂，其量为20〜100重量％，整个环氧树脂的平均分子量为300-3000。式 （1）定义如下：其中R1和R3各自表示选自双酚结构，脂族氧醚结构和脂族硫醚结构中的至少一种有机基团，R 2表示由下式表示的多硫结构： - （C 2 H 4 OCH 2 OC 2 H 4 Sm）n - ，其中m表示多硫化物结构中所含的硫原子数，其为1或2，n表示上式中所含的多硫化物结构的平均数，介于1和50之间。 通过使用该树脂组合物制成的薄膜液晶单元具有优异的粘合性，柔韧性，电性能，并具有高可靠性。

    Resin composition for sealing film-made liquid crystal cells
    2.
    发明授权
    Resin composition for sealing film-made liquid crystal cells 失效
    用于密封薄膜制造的液晶单元的树脂组合物

    公开(公告)号：US5665797A

    公开(公告)日：1997-09-09

    申请号：US586479

    申请日：1996-01-16

    申请人： Syuji Tahara ,  Koichi Machida ,  Seiji Itami ,  Masayuki Horiuchi

    发明人： Syuji Tahara ,  Koichi Machida ,  Seiji Itami ,  Masayuki Horiuchi

    IPC分类号： C08G59/30 ,  C08G59/40 ,  C08G59/68 ,  C08L63/00 ,  C09J151/08 ,  G02F1/1339

    CPC分类号： G02F1/1339 ,  C08G59/302 ,  C08G59/4035 ,  C08G59/686 ,  C08L63/00 ,  C09J151/08 ,  Y10T428/1073 ,  Y10T428/31511 ,  Y10T428/31525

    摘要： A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed in an amount of the general formula (1) by 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000 Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sub.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.

    摘要翻译： 一种用于密封液晶单元的树脂组合物，其包含含有多硫化物改性环氧树脂，酰肼化合物和填料的作为主要成分的环氧树脂。 所述环氧树脂包含在整个环氧树脂中以通式（1）的量表示20至100重量％的多硫化物改性环氧树脂，并且整个环氧树脂的平均分子量为300至3000（式 1）定义如下：其中R1和R3各自表示选自双酚结构，脂族氧醚结构和脂族硫醚结构中的至少一种有机基团，并且R 2表示由下式表示的多硫结构： （C2H4OCH2OC2H4Sm）n-，其中m表示多硫化物结构中所含的硫原子数，为1或2，n表示上式中所含的多硫化物结构的平均数，介于1和50之间。 通过使用该树脂组合物制成的液晶单元具有优异的粘合性，柔韧性，电性能，并具有高可靠性。

    PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME
    5.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 有权
    光敏树脂组合物，干膜和使用其的加工产品

    公开(公告)号：US20100084172A1

    公开(公告)日：2010-04-08

    申请号：US12596952

    申请日：2008-04-23

    申请人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    发明人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    IPC分类号： H05K1/00 ,  C08F2/46

    CPC分类号： C08F283/04 ,  C08F283/00 ,  G03F7/027 ,  G03F7/037 ,  H05K3/287 ,  Y10T428/24917

    摘要： Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

    摘要翻译： 公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求 抗弯性和绝缘可靠性。 具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。

    Method and apparatus for reading bar codes on photographic film and determining setting conditions of photographic film
    6.
    发明授权
    Method and apparatus for reading bar codes on photographic film and determining setting conditions of photographic film 失效
    用于读取照相胶片上的条形码的方法和装置，并确定摄影胶片的设置条件

    公开(公告)号：US5122645A

    公开(公告)日：1992-06-16

    申请号：US315673

    申请日：1989-02-27

    申请人： Yoshihiko Saeki ,  Yoichi Ujiie ,  Syuji Tahara ,  Kanji Tokuda

    发明人： Yoshihiko Saeki ,  Yoichi Ujiie ,  Syuji Tahara ,  Kanji Tokuda

    IPC分类号： G03B27/46 ,  G03B27/62

    CPC分类号： G03B27/462 ,  G03B27/6285

    摘要： Two bar code sensors are disposed at opposite sides of a passage of a photographic film, each bar code sensor having two photosensors disposed along a line perpendicular to the transportation direction of the photographic film. Each time a photographic film is fed by a predetermined distance, signals outputted from the two bar code sensor units are sampled and are compared with the signals obtained at the second preceding sampling timing to convert them into binary signals. Based on the data configuration of binary signals, i.e., based on the discrimination between the start code and end code, or the presence or absence of a clock track, automatic discrimination is performed between DX bar code data and frame number bar code data which then are decoded into a film type and frame number, respectively. The setting conditions of a photographic film also can be determined based on the bar code data configuration. An alarm is output if the setting conditions are not normal. The feed amount of a read-out frame number code is measured to calculate the number of a frame set at the print stage. Reading a frame number bar code may be performed synchronously with reading the DX bar code clock track.

    Photosensitive resin composition, dry film, and processed product made using the same
    7.
    发明授权
    Photosensitive resin composition, dry film, and processed product made using the same 失效
    感光树脂组合物，干膜和使用其制成的加工产品

    公开(公告)号：US08361605B2

    公开(公告)日：2013-01-29

    申请号：US12596948

    申请日：2008-04-23

    申请人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    发明人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    IPC分类号： G03F7/004 ,  G03F7/037 ,  H05K3/28 ,  B32B27/16 ,  B32B27/18

    CPC分类号： G03F7/037 ,  G03F7/085 ,  H05K3/287 ,  Y10T428/24917

    摘要： A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.

    摘要翻译： 一种感光性树脂组合物，其能够有效地避免在印刷线路板制造中的各种金属的镀覆步骤，例如膜下金属沉积和膜剥离，并且形成粘附性，柔性，绝缘性优异的布线保护膜 可靠性和耐热性。 感光性树脂组合物包含（A）羧化聚合物，（B）具有至少两个光聚合性不饱和双键的化合物，（C）光聚合引发剂，（D）由特定特征表示的氮化合物。

    Resin composition, dry film, and processed product made using the same
    8.
    发明授权
    Resin composition, dry film, and processed product made using the same 失效
    树脂组合物，干膜和使用其制成的加工产品

    公开(公告)号：US08362103B2

    公开(公告)日：2013-01-29

    申请号：US12597676

    申请日：2008-04-30

    申请人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    发明人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    IPC分类号： C08F2/42 ,  C08J3/28 ,  G03C1/00 ,  G03C1/72

    CPC分类号： G03F7/037 ,  C08K5/53 ,  G03F7/027 ,  Y10T428/31721 ,  C08L79/04

    摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

    摘要翻译： 本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜 电阻和绝缘可靠性。 具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。 优选树脂组合物还含有（C）磷腈化合物。

    RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME
    9.
    发明申请
    RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME 失效
    树脂组合物，干膜和使用其的加工产品

    公开(公告)号：US20100059263A1

    公开(公告)日：2010-03-11

    申请号：US12597676

    申请日：2008-04-30

    申请人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    发明人： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

    IPC分类号： H05K1/00 ,  C08K5/53 ,  H01B1/00

    CPC分类号： G03F7/037 ,  C08K5/53 ,  G03F7/027 ,  Y10T428/31721 ,  C08L79/04

    摘要： The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

    摘要翻译： 本发明提供了一种树脂组合物，尽管它不含有易于引起环境负荷的含卤素化合物和锑化合物，但其固化后具有优异的阻燃性，并且可以得到满足近来对高屈服要求的膜 电阻和绝缘可靠性。 具体地说，本发明提供一种树脂组合物，其包含（A）聚酰亚胺前体和（B）由式（1）表示的有机磷化合物与具有四个以上（甲基）丙烯酸酯基团的化合物的加合物。 优选树脂组合物还含有（C）磷腈化合物。

    Apparatus for reading bar codes recorded on photographic film
    10.
    发明授权
    Apparatus for reading bar codes recorded on photographic film 失效
    用于读取记录片上的条形码的装置

    公开(公告)号：US5164574A

    公开(公告)日：1992-11-17

    申请号：US315863

    申请日：1989-02-27

    申请人： Yoichi Ujiie ,  Syuji Tahara ,  Kanji Takuda ,  Yoshihiko Saeki

    发明人： Yoichi Ujiie ,  Syuji Tahara ,  Kanji Takuda ,  Yoshihiko Saeki

    IPC分类号： G03B27/46 ,  G03B27/62 ,  G06K17/00

    CPC分类号： G03B27/462 ,  G03B27/6285 ,  G06K17/0019

    摘要： Two bar code sensors are disposed at opposite sides of a passage of a photographic film, each bar code sensor having first and second photosensor arrays. The first and second photosensor arrays are located at the passages of the clock track and the data track, respectively, along a line perpendicular to the transportation direction of the photographic film. The DX bar code data and frame number bar code data are discriminated automatically based on the bar code data configuration read out with the bar code sensor units. The setting condition of the photographic film is detected, also based on the bar code data configuration. In case of an abnormal state of the setting conditions, an alarm display is output. The bar code data is written in a memory when the data change, or synchronously with reading the clock track of the DX bar code. The number of a frame set at the film mask is calculated by measuring the feed amount of the read-out frame number bar code.