公开(公告)号：US20180359860A1

公开(公告)日：2018-12-13

申请号：US16045009

申请日：2018-07-25

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Antti KERÄNEN ,  Jarmo SÄÄSKI ,  Ronald H. HAAG

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K3/36

Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

公开(公告)号：US20250048813A1

公开(公告)日：2025-02-06

申请号：US18922834

申请日：2024-10-22

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector

公开(公告)号：US20220171121A1

公开(公告)日：2022-06-02

申请号：US17674894

申请日：2022-02-18

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US20200284974A1

公开(公告)日：2020-09-10

申请号：US16871548

申请日：2020-05-11

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

公开(公告)号：US20240004119A1

公开(公告)日：2024-01-04

申请号：US18326110

申请日：2023-05-31

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: F21V8/00

CPC classification number: G02B6/0031 ,  G02B6/0021 ,  G02B6/0065 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0036 ,  G02B6/0061 ,  G02B6/0068 ,  G02B6/0055 ,  G02B6/0073 ,  G02B6/004 ,  G02B6/0051 ,  G02B6/0083 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US20190049650A1

公开(公告)日：2019-02-14

申请号：US16156123

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02B6/0031 ,  G02B6/0021 ,  H05K1/0274 ,  H05K1/185 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: Multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics, said film having the first side and a second side, at least one area light source and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer, the lightguide layer being of optically at least translucent material, wherein the lightguide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the lightguide layer and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer defines a window for letting the light emitted by the embedded light source and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

公开(公告)号：US20240021764A1

公开(公告)日：2024-01-18

申请号：US18476676

申请日：2023-09-28

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: H01L33/60 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L33/005 ,  H01L33/62 ,  H01L25/0753 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US20240004120A1

公开(公告)日：2024-01-04

申请号：US18339467

申请日：2023-06-22

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: F21V8/00

CPC classification number: G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0065 ,  G02B6/0051 ,  G02B6/0036 ,  G02B6/0083 ,  G02B6/0061 ,  G02B6/0021 ,  G02B6/004 ,  G02B6/0043 ,  G02B6/0055 ,  G02B6/0041 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.

公开(公告)号：US20190064431A1

公开(公告)日：2019-02-28

申请号：US16155956

申请日：2018-10-10

Applicant: Tactotek Oy

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US20240373559A1

公开(公告)日：2024-11-07

申请号：US18775176

申请日：2024-07-17

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Ilpo HÄNNINEN ,  Antti KERÄNEN ,  Tomi SIMULA ,  Vinski BRÄYSY ,  Pälvi APILO ,  Pasi KORHONEN ,  Topi WUORI

IPC: H05K1/18 ,  B29C51/14 ,  B29L31/34 ,  G01P1/02 ,  H05K3/00 ,  H05K3/30

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.