公开(公告)号：US20210359481A1

公开(公告)日：2021-11-18

申请号：US16872428

申请日：2020-05-12

Applicant: Tactotek Oy

Inventor： Ilpo HÄNNINEN ,  Jarmo SÄÄSKI ,  Mikko HEIKKINEN

IPC: H01R43/20 ,  H05K1/18 ,  H01R13/504 ,  H01R12/72 ,  H01R43/24

Abstract: An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.

公开(公告)号：US20210335702A1

公开(公告)日：2021-10-28

申请号：US17368244

申请日：2021-07-06

Applicant: TactoTek Oy

Inventor： Jarmo SÄÄSKI ,  Mikko HEIKKINEN ,  Tero HEIKKINEN ,  Mika PAANI ,  Jan TILLONEN ,  Ronald HAAG

IPC: H01L23/522 ,  H01L23/50 ,  H05K3/46 ,  H01L23/14 ,  H01L25/065 ,  H05K3/28

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

公开(公告)号：US20180359860A1

公开(公告)日：2018-12-13

申请号：US16045009

申请日：2018-07-25

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Antti KERÄNEN ,  Jarmo SÄÄSKI ,  Ronald H. HAAG

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K3/36

Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

公开(公告)号：US20180220534A1

公开(公告)日：2018-08-02

申请号：US15937172

申请日：2018-03-27

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Jarkko Torvinen

IPC: H05K1/18 ,  H01L33/52 ,  H01L23/498 ,  H05K1/02 ,  H01L51/00 ,  H01L23/538

CPC classification number: H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

公开(公告)号：US20250048813A1

公开(公告)日：2025-02-06

申请号：US18922834

申请日：2024-10-22

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector

公开(公告)号：US20230309231A1

公开(公告)日：2023-09-28

申请号：US17704264

申请日：2022-03-25

Applicant: TactoTek Oy

Inventor： Vinski BRÄYSY ,  Ilpo HÄNNINEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Topi WUORI ,  Mikko SIPPARI ,  Heikki ALAMÄKI

IPC: H05K1/18 ,  H05K3/12 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K3/12 ,  H05K1/111 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US20220171121A1

公开(公告)日：2022-06-02

申请号：US17674894

申请日：2022-02-18

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US20210007222A1

公开(公告)日：2021-01-07

申请号：US17026960

申请日：2020-09-21

Applicant: TactoTek Oy

Inventor： Tero HEIKKINEN ,  Antti KERANEN ,  Mikko HEIKKINEN ,  Jarmo SAASKI

IPC: H05K1/03 ,  F21V3/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46

Abstract: Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

公开(公告)号：US20200284974A1

公开(公告)日：2020-09-10

申请号：US16871548

申请日：2020-05-11

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

公开(公告)号：US20180295711A1

公开(公告)日：2018-10-11

申请号：US15483202

申请日：2017-04-10

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/12

CPC classification number: H05K1/028 ,  B29C45/14377 ,  B29C45/14639 ,  B29C45/14655 ,  B29C45/2628 ,  B29C2045/14663 ,  B29C2045/14704 ,  H05K1/112 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0129

Abstract: A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.