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公开(公告)号：US20250048813A1
公开(公告)日：2025-02-06
申请号：US18922834
申请日：2024-10-22
Applicant: TactoTek Oy
Inventor： Antti KERÄNEN , Sami TORVINEN , Tero HEIKKINEN , Pasi KORHONEN , Pälvi APILO , Mikko HEIKKINEN , Jarmo SÄÄSKI , Paavo NISKALA , Ville WALLENIUS , Heikki TUOVINEN , Janne ASIKKALA , Taneli SALMI , Suvi KELA , Outi RUSANEN , Johanna JUVANI , Mikko SIPPARI , Tomi SIMULA , Tapio RAUTIO , Samuli YRJÄNÄ , Tero RAJANIEMI , Simo KOIVIKKO , Juha-Matti HINTIKKA , Hasse SINIVAARA , Vinski BRÄYSY , Olimpia MIGLIORE , Juha SEPPONEN
IPC: H01L33/60 , H01L25/075 , H01L33/00 , H01L33/62
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector
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2.发明公开公开(公告)号：US20230309242A1
公开(公告)日：2023-09-28
申请号：US18191427
申请日：2023-03-28
Applicant: TactoTek Oy
Inventor： Tomi SIMULA , Tapio RAUTIO
CPC classification number: H05K3/284 , H05K3/0067 , H05K1/0393 , H05K1/111 , H05K3/1283 , H05K2203/1316 , H05K2203/1322
Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.
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3.发明申请公开(公告)号：US20210016539A1
公开(公告)日：2021-01-21
申请号：US17061934
申请日：2020-10-02
Applicant: TactoTek Oy
Inventor： Vinski BRÄYSY , Anne ISOHÄTÄLÄ , Jarmo SÄÄSKI , Tomi SIMULA
Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.
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公开(公告)号：US20240021764A1
公开(公告)日：2024-01-18
申请号：US18476676
申请日：2023-09-28
Applicant: TactoTek Oy
Inventor： Antti KERÄNEN , Sami TORVINEN , Tero HEIKKINEN , Pasi KORHONEN , Pälvi APILO , Mikko HEIKKINEN , Jarmo SÄÄSKI , Paavo NISKALA , Ville WALLENIUS , Heikki TUOVINEN , Janne ASIKKALA , Taneli SALMI , Suvi KELA , Outi RUSANEN , Johanna JUVANI , Mikko SIPPARI , Tomi SIMULA , Tapio RAUTIO , Samuli YRJÄNÄ , Tero RAJANIEMI , Simo KOIVIKKO , Juha-Matti HINTIKKA , Hasse SINIVAARA , Vinski BRÄYSY , Olimpia MIGLIORE , Juha SEPPONEN
IPC: H01L33/60 , H01L33/00 , H01L33/62 , H01L25/075
CPC classification number: H01L33/60 , H01L33/005 , H01L33/62 , H01L25/0753 , H01L2933/0058 , H01L2933/0066
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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5.发明公开公开(公告)号：US20240004120A1
公开(公告)日：2024-01-04
申请号：US18339467
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti KERÄNEN , Tero HEIKKINEN , Pasi KORHONEN , Pälvi APILO , Mikko HEIKKINEN , Jarmo SÄÄSKI , Paavo NISKALA , Ville WALLENIUS , Heikki TUOVINEN , Janne ASIKKALA , Taneli SALMI , Suvi KELA , Outi RUSANEN , Johanna JUVANI , Mikko SIPPARI , Tomi SIMULA , Tapio RAUTIO , Samuli YRJÄNÄ , Tero RAJANIEMI , Simo KOIVIKKO , Juha-Matti HINTIKKA , Hasse SINIVAARA , Vinski BRÄYSY , Olimpia MIGLIORE , Juha SEPPONEN
IPC: F21V8/00
CPC classification number: G02B6/0031 , G02B6/0068 , G02B6/0073 , G02B6/0065 , G02B6/0051 , G02B6/0036 , G02B6/0083 , G02B6/0061 , G02B6/0021 , G02B6/004 , G02B6/0043 , G02B6/0055 , G02B6/0041 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200068714A1
公开(公告)日：2020-02-27
申请号：US16113388
申请日：2018-08-27
Applicant: TactoTek Oy
Inventor： Janne ASIKKALA , Tomi SIMULA , Antti KERANEN
Abstract: A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.
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7.发明公开公开(公告)号：US20240004119A1
公开(公告)日：2024-01-04
申请号：US18326110
申请日：2023-05-31
Applicant: TactoTek Oy
Inventor： Antti KERÄNEN , Tero HEIKKINEN , Pasi KORHONEN , Pälvi APILO , Mikko HEIKKINEN , Jarmo SÄÄSKI , Paavo NISKALA , Ville WALLENIUS , Heikki TUOVINEN , Janne ASIKKALA , Taneli SALMI , Suvi KELA , Outi RUSANEN , Johanna JUVANI , Mikko SIPPARI , Tomi SIMULA , Tapio RAUTIO , Samuli YRJÄNÄ , Tero RAJANIEMI , Simo KOIVIKKO , Juha-Matti HINTIKKA , Hasse SINIVAARA , Vinski BRÄYSY , Olimpia MIGLIORE , Juha SEPPONEN
IPC: F21V8/00
CPC classification number: G02B6/0031 , G02B6/0021 , G02B6/0065 , G02B6/0041 , G02B6/0043 , G02B6/0036 , G02B6/0061 , G02B6/0068 , G02B6/0055 , G02B6/0073 , G02B6/004 , G02B6/0051 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US20210368630A1
公开(公告)日：2021-11-25
申请号：US17072474
申请日：2020-10-16
Applicant: TactoTek Oy
Inventor： Tomi SIMULA , Mika PAANI , Miikka KÄRNÄ , Outi RUSANEN , Johanna JUVANI , Tapio RAUTIO , Marko SUO-ANTTILA , Mikko HEIKKINEN
Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.
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9.发明申请公开(公告)号：US20200061955A1
公开(公告)日：2020-02-27
申请号：US16113335
申请日：2018-08-27
Applicant: TactoTek Oy
Inventor： Vinski BRÄYSY , Anne ISOHÄTÄLÄ , Jarmo SÄÄSKI , Tomi SIMULA
Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.
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公开(公告)号：US20240373559A1
公开(公告)日：2024-11-07
申请号：US18775176
申请日：2024-07-17
Applicant: TactoTek Oy
Inventor： Mikko HEIKKINEN , Jarmo SÄÄSKI , Ilpo HÄNNINEN , Antti KERÄNEN , Tomi SIMULA , Vinski BRÄYSY , Pälvi APILO , Pasi KORHONEN , Topi WUORI
Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.
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