EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER
    4.
    发明公开

    公开(公告)号:US20230161241A1

    公开(公告)日:2023-05-25

    申请号:US17749033

    申请日:2022-05-19

    IPC分类号: G03F1/24

    CPC分类号: G03F1/24

    摘要: An extreme ultraviolet (EUV) mask, includes a substrate, a reflective multilayer stack on the substrate, and a single layer or multi-layer capping feature on the reflective multilayer stack. The capping feature includes a capping layer or capping layers including a material having an amorphous structure. Other described embodiments include capping layer(s) that contain element(s) having a first solid carbon solubility less than about 3. In multilayer capping feature embodiments, element(s) of the respective capping layers have different solid carbon solubility properties.

    PROTECTION LAYER ON LOW THERMAL EXPANSION MATERIAL (LTEM) SUBSTRATE OF EXTREME ULTRAVIOLET (EUV) MASK

    公开(公告)号:US20200057363A1

    公开(公告)日:2020-02-20

    申请号:US16534968

    申请日:2019-08-07

    摘要: Fabricating a photomask includes forming a protection layer over a substrate. A plurality of multilayers of reflecting films are formed over the protection layer. A capping layer is formed over the plurality of multilayers. An absorption layer is formed over capping layer. A first photoresist layer is formed over portions of absorption layer. Portions of the first photoresist layer and absorption layer are patterned, forming first openings in absorption layer. The first openings expose portions of the capping layer. Remaining portions of first photoresist layer are removed and a second photoresist layer is formed over portions of absorption layer. The second photoresist layer covers at least the first openings. Portions of the absorption layer and capping layer and plurality of multilayer of reflecting films not covered by the second photoresist layer are patterned, forming second openings. The second openings expose portions of protection layer and second photoresist layer is removed.