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公开(公告)号：US10759890B2
公开(公告)日：2020-09-01
申请号：US14916344
申请日：2014-09-30
发明人： Masayuki Shimura , Yoshiyuki Furuta , Masao Yumoto
IPC分类号： C08F287/00 , C09D4/06 , C08G18/63 , C08F2/48 , H05K3/28
摘要： Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
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公开(公告)号：US10113066B2
公开(公告)日：2018-10-30
申请号：US15026071
申请日：2014-11-04
发明人： Masayuki Shimura , Yoshiyuki Furuta , Masao Yumoto
IPC分类号： C09D4/00 , C09D201/08 , G03F7/004 , G03F7/00 , C08F8/14 , H05K3/06 , H05K3/28 , C09D11/101 , C09D11/30 , C09D133/14 , H05K1/03 , H05K3/00 , C08F220/06 , C08F220/32
摘要： Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).
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3.发明授权Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film 有权可固化组合物，由可固化组合物制备的固化涂膜，以及包含固化膜的印刷线路板公开(公告)号：US09265156B2
公开(公告)日：2016-02-16
申请号：US14227249
申请日：2014-03-27
CPC分类号： H05K3/287 , H05K1/0393 , H05K2201/0154 , H05K2203/013
摘要： A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
摘要翻译： 公开了一种用于印刷电路板的可固化组合物，其对于印刷电路板中的塑料基板和导电层都具有优异的柔性和优异的粘合性能。 可固化组合物包括（A）具有多烯结构的（甲基）丙烯酸酯化合物，（B）具有羟基的（甲基）丙烯酸酯化合物; 和（C）光聚合引发剂。 从固化性组合物得到固化涂膜和包含固化涂膜的印刷线路板，其形式为预定图案。
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4.发明授权公开(公告)号：US10005911B2
公开(公告)日：2018-06-26
申请号：US15028955
申请日：2014-09-30
发明人： Masayuki Shimura , Yoshiyuki Furuta , Masao Yumoto
IPC分类号： C09D4/00 , C08F2/48 , C09D133/06 , H05K3/28 , C09D11/101 , C09D11/322 , C09D11/38 , C09D5/00 , H05K1/03 , C09D7/40 , C09D7/61 , H05K3/34
CPC分类号： C09D4/00 , C08F2/48 , C08K3/346 , C08K3/36 , C08K2003/2227 , C08K2003/3045 , C08K2201/005 , C09D5/00 , C09D7/40 , C09D7/61 , C09D11/101 , C09D11/322 , C09D11/38 , C09D133/066 , H05K1/0373 , H05K3/287 , H05K3/3452 , H05K2201/0209 , H05K2203/0759 , C08F220/20 , C08F2222/1013 , C08F2222/1026
摘要： Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.
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5.发明授权White curable composition for printed circuit board, cured coating film using the same, and printed circuit board 有权用于印刷电路板的白色可固化组合物，使用其的固化涂膜和印刷电路板公开(公告)号：US09182665B2
公开(公告)日：2015-11-10
申请号：US14501962
申请日：2014-09-30
发明人： Masayuki Shimura , Yoshiyuki Furuta , Masao Yumoto
CPC分类号： G03F7/0048 , G03F7/027 , G03F7/028 , G03F7/105
摘要： An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 μm or smaller.
摘要翻译： 本发明的目的是获得可以产生高反射性固化涂膜的白色可固化组合物，而不需要复杂的步骤，即使不进行延长分散处理也显示出良好的分散性。 本发明提供一种用于印刷电路板的白色可固化组合物，其包含：（A）白色颜料; （B）具有羟基的（甲基）丙烯酸酯化合物; （C）光聚合引发剂; 和（D）润湿分散剂。 上述（A）白色颜料优选为氧化钛。 此外，还优选上述氧化钛为金红石型氧化钛，其最大粒径为1μm以下。
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