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    SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR PLATING PROCESS
    1.
    发明申请
    SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR PLATING PROCESS 有权
    用于支撑用于镀层工艺的催化剂颗粒的基板处理方法

    公开(公告)号：US20150237742A1

    公开(公告)日：2015-08-20

    申请号：US14429702

    申请日：2013-09-27

    申请人： TANAKA KIKINZOKU KOGYO K.K. ,  A SCHOOL CORPORATION KANSAI UNIVERSITY

    发明人： Noriaki Nakamura ,  Junichi Taniuchi ,  Hitoshi Kubo ,  Yuusuke Ohshima ,  Tomoko Ishikawa ,  Shoso Shingubara ,  Fumihiro Inoue

    IPC分类号： H05K3/42 ,  H05K3/38

    CPC分类号： H05K3/422 ,  C23C18/1893 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  H05K3/387 ,  H05K3/389 ,  H05K3/426

    摘要： The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

    摘要翻译： 本发明提供一种处理基板的方法，该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒，与常规方法相比，能够进一步进行微粉化处理，并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法，该方法包括使基板与含有金属颗粒的胶体溶液接触，以便支撑用作在基板上形成镀层的催化剂的金属颗粒，其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和（111）面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时，可以增加Pd颗粒的结合力。

    Method for treating substrate that support catalyst particles for plating processing
    2.
    发明授权
    Method for treating substrate that support catalyst particles for plating processing 有权
    用于处理支撑用于电镀处理的催化剂颗粒的基材的方法

    公开(公告)号：US09565776B2

    公开(公告)日：2017-02-07

    申请号：US14429702

    申请日：2013-09-27

    申请人： Tanaka Kikinzoku Kogyo K.K. ,  A School Corporation Kansai University

    发明人： Noriaki Nakamura ,  Junichi Taniuchi ,  Hitoshi Kubo ,  Yuusuke Ohshima ,  Tomoko Ishikawa ,  Shoso Shingubara ,  Fumihiro Inoue

    IPC分类号： B05D5/12 ,  H05K3/42 ,  H05K3/38

    CPC分类号： H05K3/422 ,  C23C18/1893 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  H05K3/387 ,  H05K3/389 ,  H05K3/426

    摘要： The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

    摘要翻译： 本发明提供一种处理基板的方法，该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒，与常规方法相比，能够进一步进行微粉化处理，并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法，该方法包括使基板与含有金属颗粒的胶体溶液接触，以便支撑用作在基板上形成镀层的催化剂的金属颗粒，其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和（111）面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时，可以增加Pd颗粒的结合力。

    Metal ink
    7.
    发明授权
    Metal ink 有权

    公开(公告)号：US11149161B2

    公开(公告)日：2021-10-19

    申请号：US16618095

    申请日：2018-08-01

    申请人： TANAKA KIKINZOKU KOGYO K.K.

    发明人： Yuusuke Ohshima ,  Yuichi Makita ,  Teruhisa Iwai ,  Hitoshi Kubo ,  Shigeki Yamanaka ,  Masahiro Ito ,  Shingo Watanabe

    IPC分类号： C09D11/52 ,  C09D11/037 ,  H01B1/22

    摘要： A metal ink containing metal particles including silver, a protective agent A including an amine compound, and a protective agent B including a fatty acid. The metal ink is configured such that the protective agent A includes at least one C4-12 amine compound, and the protective agent B includes at least one C22-26 fatty acid. It is preferable that the amine compound content is 0.2 mmol/g or more and 1.5 mmol/g or less on a silver particle mass basis. In addition, it is preferable that the fatty acid content is 0.01 mmol/g or more and 0.06 mmol/g or less on a silver particle mass basis.