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公开(公告)号：US09105405B2
公开(公告)日：2015-08-11
申请号：US14024398
申请日：2013-09-11
Applicant: TDK Corporation
Inventor： Sunao Masuda , Katsumi Kobayashi , Takashi Komatsu , Akitoshi Yoshii , Kazuyuki Hasebe , Kayou Kusano , Norihisa Ando
CPC classification number: H01G2/06 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
Abstract translation: 一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面， 通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面 形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。
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Patent Agency Ranking
公开(公告)号：US09042079B2
公开(公告)日：2015-05-26
申请号：US13973514
申请日：2013-08-22
Applicant: TDK Corporation
Inventor： Sunao Masuda , Katsumi Kobayashi , Akitoshi Yoshii , Kazuyuki Hasebe , Takashi Komatsu , Kayou Kusano
Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.
Abstract translation: 一种陶瓷电子部件，包括： 包括大致长方体的芯片部件，具有面向第一端面的第一平板部的第一金属端子部，与第一平板部连接的至少一对第一嵌合臂部， 保持第一环绕部分之间的第一环绕部分和连接到第一平板部分并且大致平行于一个侧面延伸的第一安装部分和具有面向第二端面的第二平板部分的第二金属端子部分 至少一对连接到第二平板部分的第二装配臂部分，具有与第二包围部分接合的第二接合突起，将第二环绕部分保持在其间，以及大致平行于一个侧面延伸的第二安装部分 。
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公开(公告)号：US20140055910A1
公开(公告)日：2014-02-27
申请号：US13973514
申请日：2013-08-22
Applicant: TDK Corporation
Inventor： Sunao MASUDA , Katsumi Kobayashi , Akitoshi Yoshii , Kazuyuki Hasebe , Takashi Komatsu , Kayou Kusano
IPC: H01G4/01
Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face
Abstract translation: 一种陶瓷电子部件，包括： 包括大致长方体的芯片部件，具有面向第一端面的第一平板部的第一金属端子部，与第一平板部连接的至少一对第一嵌合臂部， 保持第一环绕部分之间的第一环绕部分和连接到第一平板部分并且大致平行于一个侧面延伸的第一安装部分和具有面向第二端面的第二平板部分的第二金属端子部分 至少一对连接到第二平板部分的第二装配臂部分，具有与第二包围部分接合的第二接合突起，将第二环绕部分保持在其间，以及大致平行于一个侧面延伸的第二安装部分
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公开(公告)号：US10102971B2
公开(公告)日：2018-10-16
申请号：US15286122
申请日：2016-10-05
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Masahiro Mori , Sunao Masuda , Kayou Kusano
Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.
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公开(公告)号：US09916929B2
公开(公告)日：2018-03-13
申请号：US15142580
申请日：2016-04-29
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Kusano
CPC classification number: H01G2/16 , H01G2/065 , H01G2/14 , H01G4/232 , H01G4/30 , H01G4/40 , H05K1/181 , H05K2201/10015 , H05K2201/10181 , H05K2201/10515 , H05K2201/10522 , Y02P70/611
Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.
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公开(公告)号：US09881742B2
公开(公告)日：2018-01-30
申请号：US15142530
申请日：2016-04-29
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Kusano
IPC: H01G2/16 , H01G4/30 , H01G4/228 , H01G4/40 , H01C7/18 , H01G2/14 , H01G4/232 , H01G4/258 , H01C7/02
CPC classification number: H01G4/40 , H01C7/02 , H01C7/021 , H01C7/18 , H01G2/14 , H01G4/232 , H01G4/258
Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
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