Abstract:
A probe card for testing a device under test having a plurality of contact pads includes a support plate having first contact pads thereon. A flexible membrane has a first face and a peripheral portion including second contact pads thereon. A plurality of contact probes are associated with a first face of the flexible membrane and are configured to abut onto the plurality of contact pads of the device under test. A sliding contact area includes: the first contact pads formed on the support plate; the second contact pads formed on the peripheral portion of the flexible membrane, the peripheral portion of the flexible membrane configured to come in pressing contact onto the support plate at the sliding contact area. A pressing element contacts the peripheral portion of the flexible membrane at the sliding contact area, and the pressing element puts the second contact pads into pressing contact with the first contact pads.
Abstract:
A probe card for a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis (H-H) between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane which comprises a first face and a second and opposite face. Conveniently, the first portion of the flexible membrane is arranged on at least one support and comprises a plurality of strips extending between a proximal end and a distal end, the probe card further including a plurality of micro contact probes comprising a body extending along the longitudinal axis (H-H) between a first end portion and a second end portion, the second end portion of each contact element abutting onto the first face of the flexible membrane at the distal end of a respective strip, and the first end portion of each micro contact probe abutting onto the second face of the flexible membrane at a respective contact element, the flexible membrane being electrically connected to the support plate through a second portion thereof, the second end portion of the micro contact probes being apt to contact the contact pads of a device to be tested, wherein the at least one support is provided with a plurality of guide holes for the housing of the plurality of micro contact probes.
Abstract:
A probe card for an apparatus for testing electronic devices comprises at least one probe head, a plurality of contact probes housed within the probe head, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, a supporting plate of the probe head, an interface plate, a stiffener associating the supporting plate and the interface plate, a plurality of connecting elements with clearance disposed between the supporting plate and the interface plate and housed in a floating manner in a plurality of respective seats made in the supporting plate, and a plurality of connecting elements without clearance disposed between the interface plate and the stiffener.
Abstract:
A contact probe having a first end portion adapted to abut onto a contact pad of a device under test and a second end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body extended between the end portions along a longitudinal development direction is provided with an opening extending along the longitudinal development direction and defines at least one pair of arms in the probe body. Suitably, each arm of the at least one pair of arms has a not constant transversal section, which is perpendicular to the longitudinal development direction, having different areas in correspondence of different points along the probe body and ensures a distribution of the stress along the probe body during bending thereof during testing operation of the device under test performed by means of the contact probe.
Abstract:
A probe card for an apparatus for testing electronic devices comprises at least one probe head, a plurality of contact probes housed within the probe head, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, a supporting plate of the probe head, an interface plate, a stiffener associating the supporting plate and the interface plate, a plurality of connecting elements with clearance disposed between the supporting plate and the interface plate and housed in a floating manner in a plurality of respective seats made in the supporting plate, and a plurality of connecting elements without clearance disposed between the interface plate and the stiffener.
Abstract:
An interface element (20) for a testing apparatus of electronic devices comprises at least one support (21) provided with a plurality of through-openings (22) that house respective interconnections elements (23), which extend between a first end (23a) and a second end (23b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).
Abstract:
A method for cleaning a contact pad of a microstructure or device to be tested when it is in electric contact with a measure apparatus, being obtained by electrically contacting a flexible probe with said contact pad. The method includes mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, so as to locally dig into a covering layer of the pad and realize a localized crushing thereof.
Abstract:
A method for cleaning a contact pad of a microstructure or device to be tested when it is in electric contact with a measure apparatus, being obtained by electrically contacting a flexible probe with said contact pad. The method includes mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by means of a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, so as to locally dig into a covering layer of the pad and realize a localized crushing thereof.
Abstract:
A cantilever probe head includes a support ring associated with a PCB board and a plurality of contact probes, protruding from the support ring in a cantilever manner and being held by a support associated with the support ring. Each contact probe has a rod-like body having a longitudinal axis inclined with respect to a reference plane corresponding to a plane of a wafer of devices under test by the cantilever probe head, as well as at least one first end portion, provided in a first probe section protruding from the support in the direction of the wafer of devices under test, the first end portion being bent with respect to the longitudinal axis starting from a bending point and ending with a contact tip of the contact probe able to abut onto a contact pad of a device under test of the wafer.
Abstract:
A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.