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    System in package device including inductor
    2.
    发明授权
    System in package device including inductor 有权

    公开(公告)号：US10943856B2

    公开(公告)日：2021-03-09

    申请号：US16460665

    申请日：2019-07-02

    Applicant: Texas Instruments Incorporated

    Inventor： Yien Sien Khoo ,  Siew Kee Lee

    IPC: H01L23/49 ,  H01L23/31 ,  H01F1/14 ,  H01F1/36 ,  H01L23/495 ,  H01F27/02 ,  H01F27/29 ,  H01L21/48 ,  H01L49/02 ,  H01L21/56 ,  H01F27/255 ,  H01F1/147 ,  H02M3/158 ,  H01L23/64

    Abstract: Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 μms.

    System in package device including inductor
    4.
    发明授权
    System in package device including inductor 有权

    公开(公告)号：US10340210B2

    公开(公告)日：2019-07-02

    申请号：US15693059

    申请日：2017-08-31

    Applicant: Texas Instruments Incorporated

    Inventor： Yien Sien Khoo ,  Siew Kee Lee

    IPC: H01L23/49 ,  H01L23/31 ,  H01L23/64 ,  H01F1/14 ,  H01F1/36 ,  H01F27/25 ,  H01F27/29 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L49/02 ,  H01F1/147 ,  H01F27/255 ,  H01F27/02 ,  H02M3/158

    Abstract: Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 μms.

    Electronic device with lead pitch gap
    6.
    发明授权
    Electronic device with lead pitch gap 有权

    公开(公告)号：US11569152B2

    公开(公告)日：2023-01-31

    申请号：US16254853

    申请日：2019-01-23

    Applicant: Texas Instruments Incorporated

    Inventor： Anis Fauzi Bin Abdul Aziz ,  Lee Han Meng@Eugene Lee ,  Wei Fen Sueann Lim ,  Siew Kee Lee

    IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

    Abstract: An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.

    ELECTRONIC DEVICE WITH LEAD PITCH GAP
    8.
    发明申请
    ELECTRONIC DEVICE WITH LEAD PITCH GAP 审中-公开

    公开(公告)号：US20200235042A1

    公开(公告)日：2020-07-23

    申请号：US16254853

    申请日：2019-01-23

    Applicant: Texas Instruments Incorporated

    Inventor： Anis Fauzi Bin Abdul Aziz ,  Lee Han Meng@Eugene Lee ,  Wei Fen Sueann Lim ,  Siew Kee Lee

    IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

    Abstract: An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.

    SYSTEM IN PACKAGE DEVICE INCLUDING INDUCTOR
    9.
    发明申请
    SYSTEM IN PACKAGE DEVICE INCLUDING INDUCTOR 审中-公开

    公开(公告)号：US20190326203A1

    公开(公告)日：2019-10-24

    申请号：US16460665

    申请日：2019-07-02

    Applicant: Texas Instruments Incorporated

    Inventor： Yien Sien Khoo ,  Siew Kee Lee

    IPC: H01L23/495 ,  H01F1/36 ,  H01F27/02 ,  H01F27/29 ,  H01L21/48 ,  H01L49/02 ,  H01L21/56 ,  H01F27/255 ,  H01F1/147 ,  H01L23/31

    Abstract: Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 μms.

    CARRIER TAPE
    10.
    发明申请
    CARRIER TAPE 审中-公开
    卡带

    公开(公告)号：US20150053586A1

    公开(公告)日：2015-02-26

    申请号：US13973760

    申请日：2013-08-22

    Applicant: Texas Instruments Incorporated

    Inventor： You Chye How ,  Siew Kee Lee ,  Huay Yann Tay

    IPC: B65D85/62

    CPC classification number: H05K13/0084 ,  Y10T428/13

    Abstract: A carrier tape for transporting electronic components having a linearly displaceable continuous web and a plurality of pocket structures connected to the continuous web. The pocket structures are adapted to receive the electronic components. Each of the plurality of pocket structures defines an opening to enable passage of the electronic component into the pocket structure. Each of the pocket structures define at least one tab that is adapted to retain an electronic component in the pocket structure without a closure member.

    Abstract translation: 一种用于运送具有线性可移动的连续卷材的电子部件的载带和连接到连续卷材的多个袋结构。 口袋结构适于接收电子部件。 多个凹穴结构中的每一个限定了一个开口，以使得电子部件能够通过到口袋结构中。 每个凹穴结构限定至少一个凸片，其适于将电子部件保持在口袋结构中而没有闭合部件。

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